Jasmine Jhihan B. Clark

Array ( [id] => 5038182 [patent_doc_number] => 20070090464 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-26 [patent_title] => 'Power circuit package and fabrication method' [patent_app_type] => utility [patent_app_number] => 11/259992 [patent_app_country] => US [patent_app_date] => 2005-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2720 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0090/20070090464.pdf [firstpage_image] =>[orig_patent_app_number] => 11259992 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 356597 [patent_doc_number] => 07489035 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-02-10 [patent_title] => 'Integrated circuit chip package having a ring-shaped silicon decoupling capacitor' [patent_app_type] => utility [patent_app_number] => 11/258672 [patent_app_country] => US [patent_app_date] => 2005-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 4304 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/489/07489035.pdf [firstpage_image] =>[orig_patent_app_number] => 11258672 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5640265 [patent_doc_number] => 20060278720 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-12-14 [patent_title] => 'Multimedia memory card' [patent_app_type] => utility [patent_app_number] => 11/251822 [patent_app_country] => US [patent_app_date] => 2005-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1168 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20060278720.pdf [firstpage_image] =>[orig_patent_app_number] => 11251822 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5191974 [patent_doc_number] => 20070080456 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-12 [patent_title] => 'Arrangement of conductive pads on grid array package and on circuit board' [patent_app_type] => utility [patent_app_number] => 11/246281 [patent_app_country] => US [patent_app_date] => 2005-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3594 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0080/20070080456.pdf [firstpage_image] =>[orig_patent_app_number] => 11246281 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5774768 [patent_doc_number] => 20060103408 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-18 [patent_title] => 'Semiconductor wafer and testing method therefor' [patent_app_type] => utility [patent_app_number] => 11/245091 [patent_app_country] => US [patent_app_date] => 2005-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 10004 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0103/20060103408.pdf [firstpage_image] =>[orig_patent_app_number] => 11245091 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 824001 [patent_doc_number] => 07405474 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2008-07-29 [patent_title] => 'Low cost thermally enhanced semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/246361 [patent_app_country] => US [patent_app_date] => 2005-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 5728 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/405/07405474.pdf [firstpage_image] =>[orig_patent_app_number] => 11246361 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 840828 [patent_doc_number] => 07391120 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-24 [patent_title] => 'Increasing the adhesion of an adhesive connection in housings' [patent_app_type] => utility [patent_app_number] => 11/246747 [patent_app_country] => US [patent_app_date] => 2005-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1303 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/391/07391120.pdf [firstpage_image] =>[orig_patent_app_number] => 11246747 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 908330 [patent_doc_number] => 07332822 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-19 [patent_title] => 'Flip chip system with organic/inorganic hybrid underfill composition' [patent_app_type] => utility [patent_app_number] => 11/242741 [patent_app_country] => US [patent_app_date] => 2005-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 3980 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/332/07332822.pdf [firstpage_image] =>[orig_patent_app_number] => 11242741 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 817493 [patent_doc_number] => 07411301 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-08-12 [patent_title] => 'Semiconductor integrated circuit device' [patent_app_type] => utility [patent_app_number] => 11/239371 [patent_app_country] => US [patent_app_date] => 2005-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 40 [patent_no_of_words] => 17233 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 227 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/411/07411301.pdf [firstpage_image] =>[orig_patent_app_number] => 11239371 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 813988 [patent_doc_number] => 07414262 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-08-19 [patent_title] => 'Electronic devices and methods for forming the same' [patent_app_type] => utility [patent_app_number] => 11/241221 [patent_app_country] => US [patent_app_date] => 2005-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4363 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/414/07414262.pdf [firstpage_image] =>[orig_patent_app_number] => 11241221 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 548057 [patent_doc_number] => 07170121 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-01-30 [patent_title] => 'Computer system architecture using a proximity I/O switch' [patent_app_type] => utility [patent_app_number] => 11/241599 [patent_app_country] => US [patent_app_date] => 2005-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1897 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/170/07170121.pdf [firstpage_image] =>[orig_patent_app_number] => 11241599 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4796304 [patent_doc_number] => 20080007890 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-10 [patent_title] => 'Thermally conductive composite and uses for microelectronic packaging' [patent_app_type] => utility [patent_app_number] => 11/239712 [patent_app_country] => US [patent_app_date] => 2005-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6653 [patent_no_of_claims] => 48 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20080007890.pdf [firstpage_image] =>[orig_patent_app_number] => 11239712 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5724291 [patent_doc_number] => 20060055051 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-03-16 [patent_title] => 'Method for producing chip stacks' [patent_app_type] => utility [patent_app_number] => 11/236311 [patent_app_country] => US [patent_app_date] => 2005-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2369 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0055/20060055051.pdf [firstpage_image] =>[orig_patent_app_number] => 11236311 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 363885 [patent_doc_number] => 07482700 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-27 [patent_title] => 'Semiconductor device having projection on surface thereof, and method of identifying semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/234281 [patent_app_country] => US [patent_app_date] => 2005-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 3324 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/482/07482700.pdf [firstpage_image] =>[orig_patent_app_number] => 11234281 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 865577 [patent_doc_number] => 07368821 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-06 [patent_title] => 'BGA semiconductor chip package and mounting structure thereof' [patent_app_type] => utility [patent_app_number] => 11/231751 [patent_app_country] => US [patent_app_date] => 2005-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 3978 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/368/07368821.pdf [firstpage_image] =>[orig_patent_app_number] => 11231751 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5104427 [patent_doc_number] => 20070063302 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-22 [patent_title] => 'Electronic assembly that includes pads having a bowl shaped upper section' [patent_app_type] => utility [patent_app_number] => 11/230772 [patent_app_country] => US [patent_app_date] => 2005-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3081 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0063/20070063302.pdf [firstpage_image] =>[orig_patent_app_number] => 11230772 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5104445 [patent_doc_number] => 20070063320 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-22 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ADHESIVE RESTRAINT' [patent_app_type] => utility [patent_app_number] => 11/162682 [patent_app_country] => US [patent_app_date] => 2005-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3305 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0063/20070063320.pdf [firstpage_image] =>[orig_patent_app_number] => 11162682 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5724279 [patent_doc_number] => 20060055039 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-03-16 [patent_title] => 'Stackable layer containing ball grid array package' [patent_app_type] => utility [patent_app_number] => 11/229351 [patent_app_country] => US [patent_app_date] => 2005-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2313 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0055/20060055039.pdf [firstpage_image] =>[orig_patent_app_number] => 11229351 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5605650 [patent_doc_number] => 20060267166 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-30 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/224982 [patent_app_country] => US [patent_app_date] => 2005-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5039 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0267/20060267166.pdf [firstpage_image] =>[orig_patent_app_number] => 11224982 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 303954 [patent_doc_number] => 07535094 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-19 [patent_title] => 'Substrate structure, a method and an arrangement for producing such substrate structure' [patent_app_type] => utility [patent_app_number] => 11/225851 [patent_app_country] => US [patent_app_date] => 2005-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 4400 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/535/07535094.pdf [firstpage_image] =>[orig_patent_app_number] => 11225851 [rel_patent_id] =>[rel_patent_doc_number] =>)