Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19980316 [patent_doc_number] => 12347804 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-01 [patent_title] => Bonded assembly including interconnect-level bonding pads and methods of forming the same [patent_app_type] => utility [patent_app_number] => 17/542963 [patent_app_country] => US [patent_app_date] => 2021-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 90 [patent_figures_cnt] => 110 [patent_no_of_words] => 30998 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17542963 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/542963
Bonded assembly including interconnect-level bonding pads and methods of forming the same Dec 5, 2021 Issued
Array ( [id] => 19370553 [patent_doc_number] => 12062647 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-13 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/457660 [patent_app_country] => US [patent_app_date] => 2021-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 10623 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17457660 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/457660
Semiconductor package Dec 4, 2021 Issued
Array ( [id] => 19356968 [patent_doc_number] => 12057425 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-06 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/540519 [patent_app_country] => US [patent_app_date] => 2021-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 16 [patent_no_of_words] => 9860 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17540519 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/540519
Semiconductor package Dec 1, 2021 Issued
Array ( [id] => 19244550 [patent_doc_number] => 12015005 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-18 [patent_title] => Semiconductor package including non-conductive film and method for forming the same [patent_app_type] => utility [patent_app_number] => 17/537994 [patent_app_country] => US [patent_app_date] => 2021-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 37 [patent_no_of_words] => 11722 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17537994 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/537994
Semiconductor package including non-conductive film and method for forming the same Nov 29, 2021 Issued
Array ( [id] => 18688420 [patent_doc_number] => 11784165 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-10 [patent_title] => Monolithic chip stacking using a die with double-sided interconnect layers [patent_app_type] => utility [patent_app_number] => 17/538200 [patent_app_country] => US [patent_app_date] => 2021-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 7272 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17538200 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/538200
Monolithic chip stacking using a die with double-sided interconnect layers Nov 29, 2021 Issued
Array ( [id] => 18408969 [patent_doc_number] => 20230170322 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-01 [patent_title] => GANG CLIP WITH MOUNT COMPOUND ARRESTER [patent_app_type] => utility [patent_app_number] => 17/536498 [patent_app_country] => US [patent_app_date] => 2021-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5563 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17536498 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/536498
GANG CLIP WITH MOUNT COMPOUND ARRESTER Nov 28, 2021 Pending
Array ( [id] => 18593361 [patent_doc_number] => 11742272 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-29 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/456612 [patent_app_country] => US [patent_app_date] => 2021-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 3035 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17456612 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/456612
Semiconductor device Nov 25, 2021 Issued
Array ( [id] => 18394884 [patent_doc_number] => 20230163105 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => SEMICONDUCTOR CHIP STACK MODULE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/533421 [patent_app_country] => US [patent_app_date] => 2021-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12659 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17533421 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/533421
Semiconductor chip stack module and method of fabricating the same Nov 22, 2021 Issued
Array ( [id] => 19654514 [patent_doc_number] => 12176314 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-24 [patent_title] => Dicing die attach film, and semiconductor package using the same and method of producing semiconductor package [patent_app_type] => utility [patent_app_number] => 17/529388 [patent_app_country] => US [patent_app_date] => 2021-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 14100 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17529388 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/529388
Dicing die attach film, and semiconductor package using the same and method of producing semiconductor package Nov 17, 2021 Issued
Array ( [id] => 19460158 [patent_doc_number] => 12100665 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-24 [patent_title] => Semiconductor package structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/527226 [patent_app_country] => US [patent_app_date] => 2021-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 25 [patent_no_of_words] => 7736 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 363 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17527226 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/527226
Semiconductor package structure and manufacturing method thereof Nov 15, 2021 Issued
Array ( [id] => 17708722 [patent_doc_number] => 20220208730 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-30 [patent_title] => STACKED SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/454114 [patent_app_country] => US [patent_app_date] => 2021-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12145 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17454114 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/454114
Stacked semiconductor package Nov 8, 2021 Issued
Array ( [id] => 18704798 [patent_doc_number] => 11791316 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-17 [patent_title] => Semiconductor devices with redistribution structures configured for switchable routing [patent_app_type] => utility [patent_app_number] => 17/521173 [patent_app_country] => US [patent_app_date] => 2021-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 7587 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 185 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17521173 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/521173
Semiconductor devices with redistribution structures configured for switchable routing Nov 7, 2021 Issued
Array ( [id] => 17933327 [patent_doc_number] => 20220328453 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-13 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD [patent_app_type] => utility [patent_app_number] => 17/519917 [patent_app_country] => US [patent_app_date] => 2021-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5842 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17519917 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/519917
Semiconductor package including a dummy pad Nov 4, 2021 Issued
Array ( [id] => 17630623 [patent_doc_number] => 20220165638 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-26 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/517908 [patent_app_country] => US [patent_app_date] => 2021-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10351 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 220 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17517908 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/517908
Semiconductor device and method of manufacturing the same Nov 2, 2021 Issued
Array ( [id] => 18352501 [patent_doc_number] => 20230140612 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => RADIO FREQUENCY INTEGRATED CIRCUIT [patent_app_type] => utility [patent_app_number] => 17/512872 [patent_app_country] => US [patent_app_date] => 2021-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4502 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -41 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17512872 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/512872
Radio frequency integrated circuit Oct 27, 2021 Issued
Array ( [id] => 17963698 [patent_doc_number] => 20220344279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-27 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER [patent_app_type] => utility [patent_app_number] => 17/510749 [patent_app_country] => US [patent_app_date] => 2021-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6750 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17510749 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/510749
Semiconductor package including molding layer Oct 25, 2021 Issued
Array ( [id] => 17933262 [patent_doc_number] => 20220328388 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-13 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD [patent_app_type] => utility [patent_app_number] => 17/508250 [patent_app_country] => US [patent_app_date] => 2021-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4990 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17508250 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/508250
Semiconductor package including under bump metallization pad Oct 21, 2021 Issued
Array ( [id] => 19670932 [patent_doc_number] => 12183703 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-31 [patent_title] => Leadframes in semiconductor devices [patent_app_type] => utility [patent_app_number] => 17/505494 [patent_app_country] => US [patent_app_date] => 2021-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 9920 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17505494 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/505494
Leadframes in semiconductor devices Oct 18, 2021 Issued
Array ( [id] => 17778115 [patent_doc_number] => 20220244465 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES [patent_app_type] => utility [patent_app_number] => 17/495338 [patent_app_country] => US [patent_app_date] => 2021-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 120796 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -64 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17495338 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/495338
Data processing systems including optical communication modules Oct 5, 2021 Issued
Array ( [id] => 19168526 [patent_doc_number] => 11984440 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-14 [patent_title] => Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods [patent_app_type] => utility [patent_app_number] => 17/493317 [patent_app_country] => US [patent_app_date] => 2021-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7819 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17493317 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/493317
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods Oct 3, 2021 Issued
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