
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19980316
[patent_doc_number] => 12347804
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-07-01
[patent_title] => Bonded assembly including interconnect-level bonding pads and methods of forming the same
[patent_app_type] => utility
[patent_app_number] => 17/542963
[patent_app_country] => US
[patent_app_date] => 2021-12-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 90
[patent_figures_cnt] => 110
[patent_no_of_words] => 30998
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17542963
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/542963 | Bonded assembly including interconnect-level bonding pads and methods of forming the same | Dec 5, 2021 | Issued |
Array
(
[id] => 19370553
[patent_doc_number] => 12062647
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-13
[patent_title] => Semiconductor package
[patent_app_type] => utility
[patent_app_number] => 17/457660
[patent_app_country] => US
[patent_app_date] => 2021-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
[patent_no_of_words] => 10623
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17457660
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/457660 | Semiconductor package | Dec 4, 2021 | Issued |
Array
(
[id] => 19356968
[patent_doc_number] => 12057425
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-06
[patent_title] => Semiconductor package
[patent_app_type] => utility
[patent_app_number] => 17/540519
[patent_app_country] => US
[patent_app_date] => 2021-12-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 16
[patent_no_of_words] => 9860
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17540519
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/540519 | Semiconductor package | Dec 1, 2021 | Issued |
Array
(
[id] => 19244550
[patent_doc_number] => 12015005
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-18
[patent_title] => Semiconductor package including non-conductive film and method for forming the same
[patent_app_type] => utility
[patent_app_number] => 17/537994
[patent_app_country] => US
[patent_app_date] => 2021-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 37
[patent_no_of_words] => 11722
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17537994
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/537994 | Semiconductor package including non-conductive film and method for forming the same | Nov 29, 2021 | Issued |
Array
(
[id] => 18688420
[patent_doc_number] => 11784165
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-10-10
[patent_title] => Monolithic chip stacking using a die with double-sided interconnect layers
[patent_app_type] => utility
[patent_app_number] => 17/538200
[patent_app_country] => US
[patent_app_date] => 2021-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 15
[patent_no_of_words] => 7272
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17538200
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/538200 | Monolithic chip stacking using a die with double-sided interconnect layers | Nov 29, 2021 | Issued |
Array
(
[id] => 18408969
[patent_doc_number] => 20230170322
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-01
[patent_title] => GANG CLIP WITH MOUNT COMPOUND ARRESTER
[patent_app_type] => utility
[patent_app_number] => 17/536498
[patent_app_country] => US
[patent_app_date] => 2021-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5563
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 190
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17536498
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/536498 | GANG CLIP WITH MOUNT COMPOUND ARRESTER | Nov 28, 2021 | Pending |
Array
(
[id] => 18593361
[patent_doc_number] => 11742272
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-08-29
[patent_title] => Semiconductor device
[patent_app_type] => utility
[patent_app_number] => 17/456612
[patent_app_country] => US
[patent_app_date] => 2021-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 16
[patent_no_of_words] => 3035
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17456612
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/456612 | Semiconductor device | Nov 25, 2021 | Issued |
Array
(
[id] => 18394884
[patent_doc_number] => 20230163105
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-25
[patent_title] => SEMICONDUCTOR CHIP STACK MODULE AND METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/533421
[patent_app_country] => US
[patent_app_date] => 2021-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12659
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 47
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17533421
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/533421 | Semiconductor chip stack module and method of fabricating the same | Nov 22, 2021 | Issued |
Array
(
[id] => 19654514
[patent_doc_number] => 12176314
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-24
[patent_title] => Dicing die attach film, and semiconductor package using the same and method of producing semiconductor package
[patent_app_type] => utility
[patent_app_number] => 17/529388
[patent_app_country] => US
[patent_app_date] => 2021-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 14100
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17529388
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/529388 | Dicing die attach film, and semiconductor package using the same and method of producing semiconductor package | Nov 17, 2021 | Issued |
Array
(
[id] => 19460158
[patent_doc_number] => 12100665
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-24
[patent_title] => Semiconductor package structure and manufacturing method thereof
[patent_app_type] => utility
[patent_app_number] => 17/527226
[patent_app_country] => US
[patent_app_date] => 2021-11-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 25
[patent_no_of_words] => 7736
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 363
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17527226
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/527226 | Semiconductor package structure and manufacturing method thereof | Nov 15, 2021 | Issued |
Array
(
[id] => 17708722
[patent_doc_number] => 20220208730
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-06-30
[patent_title] => STACKED SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/454114
[patent_app_country] => US
[patent_app_date] => 2021-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12145
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 140
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17454114
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/454114 | Stacked semiconductor package | Nov 8, 2021 | Issued |
Array
(
[id] => 18704798
[patent_doc_number] => 11791316
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-10-17
[patent_title] => Semiconductor devices with redistribution structures configured for switchable routing
[patent_app_type] => utility
[patent_app_number] => 17/521173
[patent_app_country] => US
[patent_app_date] => 2021-11-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 14
[patent_no_of_words] => 7587
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 185
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17521173
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/521173 | Semiconductor devices with redistribution structures configured for switchable routing | Nov 7, 2021 | Issued |
Array
(
[id] => 17933327
[patent_doc_number] => 20220328453
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-10-13
[patent_title] => SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PAD
[patent_app_type] => utility
[patent_app_number] => 17/519917
[patent_app_country] => US
[patent_app_date] => 2021-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5842
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17519917
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/519917 | Semiconductor package including a dummy pad | Nov 4, 2021 | Issued |
Array
(
[id] => 17630623
[patent_doc_number] => 20220165638
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-05-26
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/517908
[patent_app_country] => US
[patent_app_date] => 2021-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10351
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -8
[patent_words_short_claim] => 220
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17517908
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/517908 | Semiconductor device and method of manufacturing the same | Nov 2, 2021 | Issued |
Array
(
[id] => 18352501
[patent_doc_number] => 20230140612
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-04
[patent_title] => RADIO FREQUENCY INTEGRATED CIRCUIT
[patent_app_type] => utility
[patent_app_number] => 17/512872
[patent_app_country] => US
[patent_app_date] => 2021-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4502
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -41
[patent_words_short_claim] => 43
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17512872
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/512872 | Radio frequency integrated circuit | Oct 27, 2021 | Issued |
Array
(
[id] => 17963698
[patent_doc_number] => 20220344279
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-10-27
[patent_title] => SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER
[patent_app_type] => utility
[patent_app_number] => 17/510749
[patent_app_country] => US
[patent_app_date] => 2021-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6750
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 156
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17510749
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/510749 | Semiconductor package including molding layer | Oct 25, 2021 | Issued |
Array
(
[id] => 17933262
[patent_doc_number] => 20220328388
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-10-13
[patent_title] => SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
[patent_app_type] => utility
[patent_app_number] => 17/508250
[patent_app_country] => US
[patent_app_date] => 2021-10-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4990
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17508250
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/508250 | Semiconductor package including under bump metallization pad | Oct 21, 2021 | Issued |
Array
(
[id] => 19670932
[patent_doc_number] => 12183703
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-31
[patent_title] => Leadframes in semiconductor devices
[patent_app_type] => utility
[patent_app_number] => 17/505494
[patent_app_country] => US
[patent_app_date] => 2021-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 18
[patent_no_of_words] => 9920
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17505494
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/505494 | Leadframes in semiconductor devices | Oct 18, 2021 | Issued |
Array
(
[id] => 17778115
[patent_doc_number] => 20220244465
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-08-04
[patent_title] => DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
[patent_app_type] => utility
[patent_app_number] => 17/495338
[patent_app_country] => US
[patent_app_date] => 2021-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 120796
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -64
[patent_words_short_claim] => 124
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17495338
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/495338 | Data processing systems including optical communication modules | Oct 5, 2021 | Issued |
Array
(
[id] => 19168526
[patent_doc_number] => 11984440
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-05-14
[patent_title] => Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
[patent_app_type] => utility
[patent_app_number] => 17/493317
[patent_app_country] => US
[patent_app_date] => 2021-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 7819
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17493317
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/493317 | Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods | Oct 3, 2021 | Issued |