
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6963922
[patent_doc_number] => 20050230819
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-20
[patent_title] => 'Semiconductor Heat-Dissipating Substrate, and Manufacturing Method and Package Therefor'
[patent_app_type] => utility
[patent_app_number] => 11/160691
[patent_app_country] => US
[patent_app_date] => 2005-07-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 15355
[patent_no_of_claims] => 25
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[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0230/20050230819.pdf
[firstpage_image] =>[orig_patent_app_number] => 11160691
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/160691 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Jul 5, 2005 | Issued |
Array
(
[id] => 5765860
[patent_doc_number] => 20050263872
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-01
[patent_title] => 'Flex-based circuit module'
[patent_app_type] => utility
[patent_app_number] => 11/173445
[patent_app_country] => US
[patent_app_date] => 2005-07-01
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11173445
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/173445 | Flex-based circuit module | Jun 30, 2005 | Issued |
Array
(
[id] => 5790965
[patent_doc_number] => 20060012019
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-19
[patent_title] => 'Semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/173852
[patent_app_country] => US
[patent_app_date] => 2005-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0012/20060012019.pdf
[firstpage_image] =>[orig_patent_app_number] => 11173852
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/173852 | Semiconductor package | Jun 29, 2005 | Issued |
Array
(
[id] => 6923459
[patent_doc_number] => 20050236714
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-27
[patent_title] => 'Selectively converted inter-layer dielectric'
[patent_app_type] => utility
[patent_app_number] => 11/170322
[patent_app_country] => US
[patent_app_date] => 2005-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 4606
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[pdf_file] => publications/A1/0236/20050236714.pdf
[firstpage_image] =>[orig_patent_app_number] => 11170322
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/170322 | Selectively converted inter-layer dielectric | Jun 27, 2005 | Issued |
Array
(
[id] => 5736142
[patent_doc_number] => 20060006532
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-12
[patent_title] => 'Flip-chip without bumps and polymer for board assembly'
[patent_app_type] => utility
[patent_app_number] => 11/168052
[patent_app_country] => US
[patent_app_date] => 2005-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 6074
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[pdf_file] => publications/A1/0006/20060006532.pdf
[firstpage_image] =>[orig_patent_app_number] => 11168052
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/168052 | Flip-chip without bumps and polymer for board assembly | Jun 26, 2005 | Abandoned |
Array
(
[id] => 860300
[patent_doc_number] => 07371652
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-13
[patent_title] => 'Alignment using fiducial features'
[patent_app_type] => utility
[patent_app_number] => 11/158682
[patent_app_country] => US
[patent_app_date] => 2005-06-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/371/07371652.pdf
[firstpage_image] =>[orig_patent_app_number] => 11158682
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/158682 | Alignment using fiducial features | Jun 21, 2005 | Issued |
Array
(
[id] => 630355
[patent_doc_number] => 07132315
[patent_country] => US
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[patent_title] => 'Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/154541
[patent_app_country] => US
[patent_app_date] => 2005-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 9785
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/132/07132315.pdf
[firstpage_image] =>[orig_patent_app_number] => 11154541
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/154541 | Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same | Jun 16, 2005 | Issued |
Array
(
[id] => 6963895
[patent_doc_number] => 20050230792
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-20
[patent_title] => 'Modifying a semiconductor device to provide electrical parameter monitoring'
[patent_app_type] => utility
[patent_app_number] => 11/154872
[patent_app_country] => US
[patent_app_date] => 2005-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 3500
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0230/20050230792.pdf
[firstpage_image] =>[orig_patent_app_number] => 11154872
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/154872 | Modifying a semiconductor device to provide electrical parameter monitoring | Jun 15, 2005 | Issued |
Array
(
[id] => 5736021
[patent_doc_number] => 20060006411
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-12
[patent_title] => 'Method for producing a package for an electronic circuit and a substrate for a package'
[patent_app_type] => utility
[patent_app_number] => 11/153811
[patent_app_country] => US
[patent_app_date] => 2005-06-15
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[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0006/20060006411.pdf
[firstpage_image] =>[orig_patent_app_number] => 11153811
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/153811 | Method for producing a package for an electronic circuit and a substrate for a package | Jun 14, 2005 | Issued |
Array
(
[id] => 5833394
[patent_doc_number] => 20060245224
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-02
[patent_title] => 'Semiconductor power module package'
[patent_app_type] => utility
[patent_app_number] => 11/149255
[patent_app_country] => US
[patent_app_date] => 2005-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0245/20060245224.pdf
[firstpage_image] =>[orig_patent_app_number] => 11149255
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/149255 | Semiconductor power module package | Jun 9, 2005 | Abandoned |
Array
(
[id] => 7056113
[patent_doc_number] => 20050277288
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-15
[patent_title] => 'Stackable semiconductor chip layer comprising prefabricated trench interconnect vias'
[patent_app_type] => utility
[patent_app_number] => 11/150712
[patent_app_country] => US
[patent_app_date] => 2005-06-10
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[pdf_file] => publications/A1/0277/20050277288.pdf
[firstpage_image] =>[orig_patent_app_number] => 11150712
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/150712 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | Jun 9, 2005 | Issued |
Array
(
[id] => 5605670
[patent_doc_number] => 20060267186
[patent_country] => US
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[patent_title] => 'Semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/573772 | Semiconductor device | Jun 8, 2005 | Issued |
Array
(
[id] => 415592
[patent_doc_number] => 07279778
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[patent_issue_date] => 2007-10-09
[patent_title] => 'Semiconductor package having a high-speed signal input/output terminal'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/143641 | Semiconductor package having a high-speed signal input/output terminal | Jun 2, 2005 | Issued |
Array
(
[id] => 6949846
[patent_doc_number] => 20050224940
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[patent_issue_date] => 2005-10-13
[patent_title] => 'Method for maintaining solder thickness in flipchip attach packaging processes'
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[firstpage_image] =>[orig_patent_app_number] => 11145081
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/145081 | Method for maintaining solder thickness in flipchip attach packaging processes | Jun 2, 2005 | Abandoned |
Array
(
[id] => 840808
[patent_doc_number] => 07391112
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[patent_title] => 'Capping copper bumps'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/142971 | Capping copper bumps | May 31, 2005 | Issued |
Array
(
[id] => 928773
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/141461 | Circuit device and manufacturing method thereof | May 30, 2005 | Issued |
Array
(
[id] => 5625439
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Array
(
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Array
(
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 11132292
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/132292 | Semiconductor device and manufacturing process thereof | May 18, 2005 | Issued |