Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6963922 [patent_doc_number] => 20050230819 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-20 [patent_title] => 'Semiconductor Heat-Dissipating Substrate, and Manufacturing Method and Package Therefor' [patent_app_type] => utility [patent_app_number] => 11/160691 [patent_app_country] => US [patent_app_date] => 2005-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 15355 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20050230819.pdf [firstpage_image] =>[orig_patent_app_number] => 11160691 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/160691
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor Jul 5, 2005 Issued
Array ( [id] => 5765860 [patent_doc_number] => 20050263872 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-12-01 [patent_title] => 'Flex-based circuit module' [patent_app_type] => utility [patent_app_number] => 11/173445 [patent_app_country] => US [patent_app_date] => 2005-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 35 [patent_no_of_words] => 11340 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0263/20050263872.pdf [firstpage_image] =>[orig_patent_app_number] => 11173445 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/173445
Flex-based circuit module Jun 30, 2005 Issued
Array ( [id] => 5790965 [patent_doc_number] => 20060012019 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-19 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/173852 [patent_app_country] => US [patent_app_date] => 2005-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5292 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20060012019.pdf [firstpage_image] =>[orig_patent_app_number] => 11173852 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/173852
Semiconductor package Jun 29, 2005 Issued
Array ( [id] => 6923459 [patent_doc_number] => 20050236714 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-27 [patent_title] => 'Selectively converted inter-layer dielectric' [patent_app_type] => utility [patent_app_number] => 11/170322 [patent_app_country] => US [patent_app_date] => 2005-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4606 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0236/20050236714.pdf [firstpage_image] =>[orig_patent_app_number] => 11170322 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/170322
Selectively converted inter-layer dielectric Jun 27, 2005 Issued
Array ( [id] => 5736142 [patent_doc_number] => 20060006532 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-12 [patent_title] => 'Flip-chip without bumps and polymer for board assembly' [patent_app_type] => utility [patent_app_number] => 11/168052 [patent_app_country] => US [patent_app_date] => 2005-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6074 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20060006532.pdf [firstpage_image] =>[orig_patent_app_number] => 11168052 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/168052
Flip-chip without bumps and polymer for board assembly Jun 26, 2005 Abandoned
Array ( [id] => 860300 [patent_doc_number] => 07371652 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-13 [patent_title] => 'Alignment using fiducial features' [patent_app_type] => utility [patent_app_number] => 11/158682 [patent_app_country] => US [patent_app_date] => 2005-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 6542 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/371/07371652.pdf [firstpage_image] =>[orig_patent_app_number] => 11158682 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/158682
Alignment using fiducial features Jun 21, 2005 Issued
Array ( [id] => 630355 [patent_doc_number] => 07132315 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-11-07 [patent_title] => 'Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/154541 [patent_app_country] => US [patent_app_date] => 2005-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 22 [patent_no_of_words] => 9785 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 276 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/132/07132315.pdf [firstpage_image] =>[orig_patent_app_number] => 11154541 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/154541
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same Jun 16, 2005 Issued
Array ( [id] => 6963895 [patent_doc_number] => 20050230792 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-20 [patent_title] => 'Modifying a semiconductor device to provide electrical parameter monitoring' [patent_app_type] => utility [patent_app_number] => 11/154872 [patent_app_country] => US [patent_app_date] => 2005-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3500 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20050230792.pdf [firstpage_image] =>[orig_patent_app_number] => 11154872 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/154872
Modifying a semiconductor device to provide electrical parameter monitoring Jun 15, 2005 Issued
Array ( [id] => 5736021 [patent_doc_number] => 20060006411 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-12 [patent_title] => 'Method for producing a package for an electronic circuit and a substrate for a package' [patent_app_type] => utility [patent_app_number] => 11/153811 [patent_app_country] => US [patent_app_date] => 2005-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2863 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20060006411.pdf [firstpage_image] =>[orig_patent_app_number] => 11153811 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/153811
Method for producing a package for an electronic circuit and a substrate for a package Jun 14, 2005 Issued
Array ( [id] => 5833394 [patent_doc_number] => 20060245224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-02 [patent_title] => 'Semiconductor power module package' [patent_app_type] => utility [patent_app_number] => 11/149255 [patent_app_country] => US [patent_app_date] => 2005-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1648 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0245/20060245224.pdf [firstpage_image] =>[orig_patent_app_number] => 11149255 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/149255
Semiconductor power module package Jun 9, 2005 Abandoned
Array ( [id] => 7056113 [patent_doc_number] => 20050277288 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-12-15 [patent_title] => 'Stackable semiconductor chip layer comprising prefabricated trench interconnect vias' [patent_app_type] => utility [patent_app_number] => 11/150712 [patent_app_country] => US [patent_app_date] => 2005-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3996 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0277/20050277288.pdf [firstpage_image] =>[orig_patent_app_number] => 11150712 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/150712
Stackable semiconductor chip layer comprising prefabricated trench interconnect vias Jun 9, 2005 Issued
Array ( [id] => 5605670 [patent_doc_number] => 20060267186 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-30 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/573772 [patent_app_country] => US [patent_app_date] => 2005-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 8340 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0267/20060267186.pdf [firstpage_image] =>[orig_patent_app_number] => 10573772 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/573772
Semiconductor device Jun 8, 2005 Issued
Array ( [id] => 415592 [patent_doc_number] => 07279778 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-10-09 [patent_title] => 'Semiconductor package having a high-speed signal input/output terminal' [patent_app_type] => utility [patent_app_number] => 11/143641 [patent_app_country] => US [patent_app_date] => 2005-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3076 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/279/07279778.pdf [firstpage_image] =>[orig_patent_app_number] => 11143641 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/143641
Semiconductor package having a high-speed signal input/output terminal Jun 2, 2005 Issued
Array ( [id] => 6949846 [patent_doc_number] => 20050224940 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-13 [patent_title] => 'Method for maintaining solder thickness in flipchip attach packaging processes' [patent_app_type] => utility [patent_app_number] => 11/145081 [patent_app_country] => US [patent_app_date] => 2005-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4938 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 14 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20050224940.pdf [firstpage_image] =>[orig_patent_app_number] => 11145081 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/145081
Method for maintaining solder thickness in flipchip attach packaging processes Jun 2, 2005 Abandoned
Array ( [id] => 840808 [patent_doc_number] => 07391112 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-24 [patent_title] => 'Capping copper bumps' [patent_app_type] => utility [patent_app_number] => 11/142971 [patent_app_country] => US [patent_app_date] => 2005-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1625 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/391/07391112.pdf [firstpage_image] =>[orig_patent_app_number] => 11142971 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/142971
Capping copper bumps May 31, 2005 Issued
Array ( [id] => 928773 [patent_doc_number] => 07315083 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-01-01 [patent_title] => 'Circuit device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/141461 [patent_app_country] => US [patent_app_date] => 2005-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 40 [patent_no_of_words] => 10803 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/315/07315083.pdf [firstpage_image] =>[orig_patent_app_number] => 11141461 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/141461
Circuit device and manufacturing method thereof May 30, 2005 Issued
Array ( [id] => 5625439 [patent_doc_number] => 20060263944 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-23 [patent_title] => 'System and method for die attach using a backside heat spreader' [patent_app_type] => utility [patent_app_number] => 11/134952 [patent_app_country] => US [patent_app_date] => 2005-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1859 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0263/20060263944.pdf [firstpage_image] =>[orig_patent_app_number] => 11134952 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/134952
System and method for die attach using a backside heat spreader May 22, 2005 Issued
Array ( [id] => 5810758 [patent_doc_number] => 20060081866 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-04-20 [patent_title] => 'Optical semiconductor apparatus' [patent_app_type] => utility [patent_app_number] => 11/134622 [patent_app_country] => US [patent_app_date] => 2005-05-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5431 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0081/20060081866.pdf [firstpage_image] =>[orig_patent_app_number] => 11134622 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/134622
Optical semiconductor apparatus May 19, 2005 Issued
Array ( [id] => 4691219 [patent_doc_number] => 20080083989 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-10 [patent_title] => 'Semiconductor Device and Method for Fabricating the Same' [patent_app_type] => utility [patent_app_number] => 10/578351 [patent_app_country] => US [patent_app_date] => 2005-05-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 18750 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0083/20080083989.pdf [firstpage_image] =>[orig_patent_app_number] => 10578351 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/578351
Semiconductor Device and Method for Fabricating the Same May 19, 2005 Abandoned
Array ( [id] => 7206441 [patent_doc_number] => 20050258531 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-11-24 [patent_title] => 'Semiconductor device and manufacturing process thereof' [patent_app_type] => utility [patent_app_number] => 11/132292 [patent_app_country] => US [patent_app_date] => 2005-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4284 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0258/20050258531.pdf [firstpage_image] =>[orig_patent_app_number] => 11132292 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/132292
Semiconductor device and manufacturing process thereof May 18, 2005 Issued
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