Jasmine Jhihan B. Clark

Array ( [id] => 5697587 [patent_doc_number] => 20060214271 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Device and applications for passive RF components in leadframes' [patent_app_type] => utility [patent_app_number] => 11/086321 [patent_app_country] => US [patent_app_date] => 2005-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6052 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20060214271.pdf [firstpage_image] =>[orig_patent_app_number] => 11086321 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 229255 [patent_doc_number] => 07602070 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-10-13 [patent_title] => 'Room temperature metal direct bonding' [patent_app_type] => utility [patent_app_number] => 11/085131 [patent_app_country] => US [patent_app_date] => 2005-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 25 [patent_no_of_words] => 9104 [patent_no_of_claims] => 110 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/602/07602070.pdf [firstpage_image] =>[orig_patent_app_number] => 11085131 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 484510 [patent_doc_number] => 07221053 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-22 [patent_title] => 'Integrated device and electronic system' [patent_app_type] => utility [patent_app_number] => 11/086922 [patent_app_country] => US [patent_app_date] => 2005-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3911 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/221/07221053.pdf [firstpage_image] =>[orig_patent_app_number] => 11086922 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5757413 [patent_doc_number] => 20060208358 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'Stacked package integrated circuit' [patent_app_type] => utility [patent_app_number] => 11/086982 [patent_app_country] => US [patent_app_date] => 2005-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2569 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0208/20060208358.pdf [firstpage_image] =>[orig_patent_app_number] => 11086982 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 390646 [patent_doc_number] => 07301242 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-11-27 [patent_title] => 'Programmable system in package' [patent_app_type] => utility [patent_app_number] => 11/081842 [patent_app_country] => US [patent_app_date] => 2005-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 12 [patent_no_of_words] => 5445 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/301/07301242.pdf [firstpage_image] =>[orig_patent_app_number] => 11081842 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 553460 [patent_doc_number] => 07160796 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-09 [patent_title] => 'Method for manufacturing wiring board and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/079741 [patent_app_country] => US [patent_app_date] => 2005-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4581 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 238 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/160/07160796.pdf [firstpage_image] =>[orig_patent_app_number] => 11079741 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7002521 [patent_doc_number] => 20050167834 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-08-04 [patent_title] => 'Semiconductor device including semiconductor element mounted on another semiconductor element' [patent_app_type] => utility [patent_app_number] => 11/077152 [patent_app_country] => US [patent_app_date] => 2005-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 5645 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0167/20050167834.pdf [firstpage_image] =>[orig_patent_app_number] => 11077152 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 485583 [patent_doc_number] => 07217631 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-15 [patent_title] => 'Semiconductor device and method for fabricating the device' [patent_app_type] => utility [patent_app_number] => 11/077212 [patent_app_country] => US [patent_app_date] => 2005-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 4694 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/217/07217631.pdf [firstpage_image] =>[orig_patent_app_number] => 11077212 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7162190 [patent_doc_number] => 20050199986 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-15 [patent_title] => 'Leadframe with die pad' [patent_app_type] => utility [patent_app_number] => 11/076951 [patent_app_country] => US [patent_app_date] => 2005-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1589 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0199/20050199986.pdf [firstpage_image] =>[orig_patent_app_number] => 11076951 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 810567 [patent_doc_number] => 07417324 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-08-26 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/075442 [patent_app_country] => US [patent_app_date] => 2005-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 9189 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/417/07417324.pdf [firstpage_image] =>[orig_patent_app_number] => 11075442 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5878129 [patent_doc_number] => 20060027908 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-02-09 [patent_title] => '3-D stackable semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/074732 [patent_app_country] => US [patent_app_date] => 2005-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2794 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0027/20060027908.pdf [firstpage_image] =>[orig_patent_app_number] => 11074732 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7072776 [patent_doc_number] => 20050146042 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-07 [patent_title] => 'Method of forming a bonding pad structure' [patent_app_type] => utility [patent_app_number] => 11/073753 [patent_app_country] => US [patent_app_date] => 2005-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7198 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0146/20050146042.pdf [firstpage_image] =>[orig_patent_app_number] => 11073753 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 319085 [patent_doc_number] => 07521797 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-21 [patent_title] => 'Method of manufacturing substrate joint body, substrate joint body and electrooptical device' [patent_app_type] => utility [patent_app_number] => 11/074351 [patent_app_country] => US [patent_app_date] => 2005-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 20 [patent_no_of_words] => 6801 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/521/07521797.pdf [firstpage_image] =>[orig_patent_app_number] => 11074351 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5664637 [patent_doc_number] => 20060169987 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-08-03 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/072279 [patent_app_country] => US [patent_app_date] => 2005-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 7549 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0169/20060169987.pdf [firstpage_image] =>[orig_patent_app_number] => 11072279 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 646455 [patent_doc_number] => 07119441 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-10 [patent_title] => 'Semiconductor interconnect structure' [patent_app_type] => utility [patent_app_number] => 11/068431 [patent_app_country] => US [patent_app_date] => 2005-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 2894 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/119/07119441.pdf [firstpage_image] =>[orig_patent_app_number] => 11068431 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6981184 [patent_doc_number] => 20050151252 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-14 [patent_title] => 'Semiconductor device having capacitors for reducing power source noise' [patent_app_type] => utility [patent_app_number] => 11/064822 [patent_app_country] => US [patent_app_date] => 2005-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 8453 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20050151252.pdf [firstpage_image] =>[orig_patent_app_number] => 11064822 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7162204 [patent_doc_number] => 20050199993 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-15 [patent_title] => 'Semiconductor package having heat spreader and package stack using the same' [patent_app_type] => utility [patent_app_number] => 11/065822 [patent_app_country] => US [patent_app_date] => 2005-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6911 [patent_no_of_claims] => 62 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0199/20050199993.pdf [firstpage_image] =>[orig_patent_app_number] => 11065822 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5217494 [patent_doc_number] => 20070158805 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-12 [patent_title] => 'BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same' [patent_app_type] => utility [patent_app_number] => 11/062507 [patent_app_country] => US [patent_app_date] => 2005-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4658 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0158/20070158805.pdf [firstpage_image] =>[orig_patent_app_number] => 11062507 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 681173 [patent_doc_number] => 07084514 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-01 [patent_title] => 'Multi-chip module and methods' [patent_app_type] => utility [patent_app_number] => 11/058984 [patent_app_country] => US [patent_app_date] => 2005-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 4912 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/084/07084514.pdf [firstpage_image] =>[orig_patent_app_number] => 11058984 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5646010 [patent_doc_number] => 20060131742 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-22 [patent_title] => 'PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE' [patent_app_type] => utility [patent_app_number] => 11/057132 [patent_app_country] => US [patent_app_date] => 2005-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1998 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0131/20060131742.pdf [firstpage_image] =>[orig_patent_app_number] => 11057132 [rel_patent_id] =>[rel_patent_doc_number] =>)