Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7072784 [patent_doc_number] => 20050146050 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-07 [patent_title] => 'FLIP CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 10/904512 [patent_app_country] => US [patent_app_date] => 2004-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1766 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0146/20050146050.pdf [firstpage_image] =>[orig_patent_app_number] => 10904512 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/904512
FLIP CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE THEREOF Nov 13, 2004 Abandoned
Array ( [id] => 7072751 [patent_doc_number] => 20050146017 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-07 [patent_title] => 'Power supply connection structure to a semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/986151 [patent_app_country] => US [patent_app_date] => 2004-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3857 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0146/20050146017.pdf [firstpage_image] =>[orig_patent_app_number] => 10986151 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/986151
Power supply connection structure to a semiconductor device Nov 11, 2004 Issued
Array ( [id] => 6903476 [patent_doc_number] => 20050098871 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-12 [patent_title] => 'Semiconductor device with semiconductor chip and rewiring layer and method for producing the same' [patent_app_type] => utility [patent_app_number] => 10/985051 [patent_app_country] => US [patent_app_date] => 2004-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5045 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20050098871.pdf [firstpage_image] =>[orig_patent_app_number] => 10985051 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/985051
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same Nov 9, 2004 Issued
Array ( [id] => 954123 [patent_doc_number] => 06958538 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-10-25 [patent_title] => 'Computer system architecture using a proximity I/O switch' [patent_app_type] => utility [patent_app_number] => 10/983250 [patent_app_country] => US [patent_app_date] => 2004-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1928 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/958/06958538.pdf [firstpage_image] =>[orig_patent_app_number] => 10983250 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/983250
Computer system architecture using a proximity I/O switch Nov 3, 2004 Issued
Array ( [id] => 6903484 [patent_doc_number] => 20050098879 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-12 [patent_title] => 'Semiconductor package having ultra-thin thickness and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/982361 [patent_app_country] => US [patent_app_date] => 2004-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3825 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20050098879.pdf [firstpage_image] =>[orig_patent_app_number] => 10982361 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/982361
Semiconductor package having ultra-thin thickness and method of manufacturing the same Nov 2, 2004 Issued
Array ( [id] => 885873 [patent_doc_number] => 07352062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-01 [patent_title] => 'Integrated circuit package design' [patent_app_type] => utility [patent_app_number] => 10/979491 [patent_app_country] => US [patent_app_date] => 2004-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2915 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/352/07352062.pdf [firstpage_image] =>[orig_patent_app_number] => 10979491 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/979491
Integrated circuit package design Nov 1, 2004 Issued
Array ( [id] => 673106 [patent_doc_number] => 07091623 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-15 [patent_title] => 'Multi-chip semiconductor package and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 10/980671 [patent_app_country] => US [patent_app_date] => 2004-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 3553 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/091/07091623.pdf [firstpage_image] =>[orig_patent_app_number] => 10980671 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/980671
Multi-chip semiconductor package and fabrication method thereof Nov 1, 2004 Issued
Array ( [id] => 7101441 [patent_doc_number] => 20050104167 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-19 [patent_title] => 'Flip-chip type quad flat package and leadframe' [patent_app_type] => utility [patent_app_number] => 10/979881 [patent_app_country] => US [patent_app_date] => 2004-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2501 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0104/20050104167.pdf [firstpage_image] =>[orig_patent_app_number] => 10979881 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/979881
Flip-chip type quad flat package and leadframe Oct 31, 2004 Issued
Array ( [id] => 668928 [patent_doc_number] => 07095124 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-22 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/975071 [patent_app_country] => US [patent_app_date] => 2004-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5339 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/095/07095124.pdf [firstpage_image] =>[orig_patent_app_number] => 10975071 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/975071
Semiconductor device Oct 27, 2004 Issued
Array ( [id] => 493451 [patent_doc_number] => 07211467 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-01 [patent_title] => 'Method for fabricating leadless packages with mold locking characteristics' [patent_app_type] => utility [patent_app_number] => 10/973385 [patent_app_country] => US [patent_app_date] => 2004-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 3085 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/211/07211467.pdf [firstpage_image] =>[orig_patent_app_number] => 10973385 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/973385
Method for fabricating leadless packages with mold locking characteristics Oct 26, 2004 Issued
Array ( [id] => 730213 [patent_doc_number] => 07042102 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-09 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/971692 [patent_app_country] => US [patent_app_date] => 2004-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 4723 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/042/07042102.pdf [firstpage_image] =>[orig_patent_app_number] => 10971692 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/971692
Semiconductor device Oct 24, 2004 Issued
Array ( [id] => 540317 [patent_doc_number] => 07176580 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-02-13 [patent_title] => 'Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip' [patent_app_type] => utility [patent_app_number] => 10/973172 [patent_app_country] => US [patent_app_date] => 2004-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2481 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/176/07176580.pdf [firstpage_image] =>[orig_patent_app_number] => 10973172 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/973172
Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip Oct 24, 2004 Issued
Array ( [id] => 767288 [patent_doc_number] => 07009303 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-03-07 [patent_title] => 'Multi-chip module' [patent_app_type] => utility [patent_app_number] => 10/971042 [patent_app_country] => US [patent_app_date] => 2004-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 5955 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/009/07009303.pdf [firstpage_image] =>[orig_patent_app_number] => 10971042 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/971042
Multi-chip module Oct 24, 2004 Issued
Array ( [id] => 63636 [patent_doc_number] => 07763948 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-27 [patent_title] => 'Flexible and elastic dielectric integrated circuit' [patent_app_type] => utility [patent_app_number] => 10/971341 [patent_app_country] => US [patent_app_date] => 2004-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 64 [patent_figures_cnt] => 106 [patent_no_of_words] => 27066 [patent_no_of_claims] => 57 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/763/07763948.pdf [firstpage_image] =>[orig_patent_app_number] => 10971341 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/971341
Flexible and elastic dielectric integrated circuit Oct 21, 2004 Issued
Array ( [id] => 6936594 [patent_doc_number] => 20050110155 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-26 [patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board and electronic device' [patent_app_type] => utility [patent_app_number] => 10/968851 [patent_app_country] => US [patent_app_date] => 2004-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3365 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0110/20050110155.pdf [firstpage_image] =>[orig_patent_app_number] => 10968851 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/968851
Semiconductor device and method of manufacturing the same, circuit board and electronic device Oct 18, 2004 Issued
Array ( [id] => 931403 [patent_doc_number] => 06979907 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-12-27 [patent_title] => 'Integrated circuit package' [patent_app_type] => utility [patent_app_number] => 10/969361 [patent_app_country] => US [patent_app_date] => 2004-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 3099 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/979/06979907.pdf [firstpage_image] =>[orig_patent_app_number] => 10969361 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/969361
Integrated circuit package Oct 18, 2004 Issued
Array ( [id] => 7080667 [patent_doc_number] => 20050046047 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-03 [patent_title] => 'Resin-encapsulated semiconductor apparatus and process for its fabrication' [patent_app_type] => utility [patent_app_number] => 10/964637 [patent_app_country] => US [patent_app_date] => 2004-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 10608 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0046/20050046047.pdf [firstpage_image] =>[orig_patent_app_number] => 10964637 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/964637
Resin-encapsulated semiconductor apparatus and process for its fabrication Oct 14, 2004 Issued
Array ( [id] => 5736114 [patent_doc_number] => 20060006504 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-12 [patent_title] => 'Multilayer leadframe module with embedded passive component and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/964542 [patent_app_country] => US [patent_app_date] => 2004-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 44 [patent_figures_cnt] => 44 [patent_no_of_words] => 10513 [patent_no_of_claims] => 71 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20060006504.pdf [firstpage_image] =>[orig_patent_app_number] => 10964542 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/964542
Multilayer leadframe module with embedded passive component and method of fabricating the same Oct 12, 2004 Abandoned
Array ( [id] => 795881 [patent_doc_number] => 07429797 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-09-30 [patent_title] => 'Electronic device and carrier substrate' [patent_app_type] => utility [patent_app_number] => 10/574881 [patent_app_country] => US [patent_app_date] => 2004-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4637 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/429/07429797.pdf [firstpage_image] =>[orig_patent_app_number] => 10574881 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/574881
Electronic device and carrier substrate Sep 30, 2004 Issued
Array ( [id] => 624014 [patent_doc_number] => 07138725 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-11-21 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/954181 [patent_app_country] => US [patent_app_date] => 2004-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 4140 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/138/07138725.pdf [firstpage_image] =>[orig_patent_app_number] => 10954181 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/954181
Semiconductor device Sep 30, 2004 Issued
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