Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5239796 [patent_doc_number] => 20070018287 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-25 [patent_title] => 'Electronic device and carrier substrate for same' [patent_app_type] => utility [patent_app_number] => 10/574882 [patent_app_country] => US [patent_app_date] => 2004-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6286 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0018/20070018287.pdf [firstpage_image] =>[orig_patent_app_number] => 10574882 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/574882
Electronic device and carrier substrate for same Sep 30, 2004 Issued
Array ( [id] => 708752 [patent_doc_number] => 07061099 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-06-13 [patent_title] => 'Microelectronic package having chamber sealed by material including one or more intermetallic compounds' [patent_app_type] => utility [patent_app_number] => 10/955872 [patent_app_country] => US [patent_app_date] => 2004-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7785 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 23 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/061/07061099.pdf [firstpage_image] =>[orig_patent_app_number] => 10955872 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/955872
Microelectronic package having chamber sealed by material including one or more intermetallic compounds Sep 29, 2004 Issued
Array ( [id] => 935374 [patent_doc_number] => 06974723 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-12-13 [patent_title] => 'Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials' [patent_app_type] => utility [patent_app_number] => 10/956162 [patent_app_country] => US [patent_app_date] => 2004-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4362 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/974/06974723.pdf [firstpage_image] =>[orig_patent_app_number] => 10956162 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/956162
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Sep 29, 2004 Issued
Array ( [id] => 7154520 [patent_doc_number] => 20050082655 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-21 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/951811 [patent_app_country] => US [patent_app_date] => 2004-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7087 [patent_no_of_claims] => 61 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20050082655.pdf [firstpage_image] =>[orig_patent_app_number] => 10951811 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/951811
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof Sep 28, 2004 Issued
Array ( [id] => 5718578 [patent_doc_number] => 20060071351 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-04-06 [patent_title] => 'Mold compound interlocking feature to improve semiconductor package strength' [patent_app_type] => utility [patent_app_number] => 10/952342 [patent_app_country] => US [patent_app_date] => 2004-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2440 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0071/20060071351.pdf [firstpage_image] =>[orig_patent_app_number] => 10952342 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/952342
Mold compound interlocking feature to improve semiconductor package strength Sep 27, 2004 Abandoned
Array ( [id] => 7114386 [patent_doc_number] => 20050067686 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-31 [patent_title] => 'Semiconductor device containing stacked semiconductor chips and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 10/951541 [patent_app_country] => US [patent_app_date] => 2004-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4036 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0067/20050067686.pdf [firstpage_image] =>[orig_patent_app_number] => 10951541 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/951541
Semiconductor device containing stacked semiconductor chips and manufacturing method thereof Sep 27, 2004 Issued
Array ( [id] => 889157 [patent_doc_number] => 07348661 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-03-25 [patent_title] => 'Array capacitor apparatuses to filter input/output signal' [patent_app_type] => utility [patent_app_number] => 10/949582 [patent_app_country] => US [patent_app_date] => 2004-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2850 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/348/07348661.pdf [firstpage_image] =>[orig_patent_app_number] => 10949582 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/949582
Array capacitor apparatuses to filter input/output signal Sep 23, 2004 Issued
Array ( [id] => 6969748 [patent_doc_number] => 20050035458 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-17 [patent_title] => 'Metal film semiconductor device and a method for forming the same' [patent_app_type] => utility [patent_app_number] => 10/945992 [patent_app_country] => US [patent_app_date] => 2004-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4800 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20050035458.pdf [firstpage_image] =>[orig_patent_app_number] => 10945992 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/945992
Metal film semiconductor device and a method for forming the same Sep 21, 2004 Abandoned
Array ( [id] => 785775 [patent_doc_number] => 06989601 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2006-01-24 [patent_title] => 'Copper damascene with low-k capping layer and improved electromigration reliability' [patent_app_type] => utility [patent_app_number] => 10/946071 [patent_app_country] => US [patent_app_date] => 2004-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4512 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/989/06989601.pdf [firstpage_image] =>[orig_patent_app_number] => 10946071 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/946071
Copper damascene with low-k capping layer and improved electromigration reliability Sep 21, 2004 Issued
Array ( [id] => 642827 [patent_doc_number] => 07122897 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-17 [patent_title] => 'Semiconductor device and method of manufacturing the semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/945111 [patent_app_country] => US [patent_app_date] => 2004-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 43 [patent_no_of_words] => 10454 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/122/07122897.pdf [firstpage_image] =>[orig_patent_app_number] => 10945111 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/945111
Semiconductor device and method of manufacturing the semiconductor device Sep 20, 2004 Issued
Array ( [id] => 7008432 [patent_doc_number] => 20050062148 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-24 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/944241 [patent_app_country] => US [patent_app_date] => 2004-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3703 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20050062148.pdf [firstpage_image] =>[orig_patent_app_number] => 10944241 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/944241
Semiconductor package Sep 16, 2004 Issued
Array ( [id] => 7008431 [patent_doc_number] => 20050062147 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-24 [patent_title] => 'Semiconductor device having heat dissipation layer' [patent_app_type] => utility [patent_app_number] => 10/940232 [patent_app_country] => US [patent_app_date] => 2004-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 7408 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20050062147.pdf [firstpage_image] =>[orig_patent_app_number] => 10940232 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/940232
Semiconductor device having heat dissipation layer Sep 12, 2004 Issued
Array ( [id] => 869652 [patent_doc_number] => 07365413 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2008-04-29 [patent_title] => 'Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern' [patent_app_type] => utility [patent_app_number] => 10/940511 [patent_app_country] => US [patent_app_date] => 2004-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 3353 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/365/07365413.pdf [firstpage_image] =>[orig_patent_app_number] => 10940511 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/940511
Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern Sep 12, 2004 Issued
Array ( [id] => 124198 [patent_doc_number] => 07705464 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-27 [patent_title] => 'Connection structure for semiconductor devices' [patent_app_type] => utility [patent_app_number] => 10/939931 [patent_app_country] => US [patent_app_date] => 2004-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 2591 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/705/07705464.pdf [firstpage_image] =>[orig_patent_app_number] => 10939931 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/939931
Connection structure for semiconductor devices Sep 12, 2004 Issued
Array ( [id] => 5724269 [patent_doc_number] => 20060055029 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-03-16 [patent_title] => 'Integrated heatspreader for use in wire bonded ball grid array semiconductor packages' [patent_app_type] => utility [patent_app_number] => 10/939082 [patent_app_country] => US [patent_app_date] => 2004-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2501 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0055/20060055029.pdf [firstpage_image] =>[orig_patent_app_number] => 10939082 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/939082
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages Sep 9, 2004 Issued
Array ( [id] => 7154641 [patent_doc_number] => 20050082692 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-21 [patent_title] => 'Rectifier diode device' [patent_app_type] => utility [patent_app_number] => 10/932401 [patent_app_country] => US [patent_app_date] => 2004-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6358 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20050082692.pdf [firstpage_image] =>[orig_patent_app_number] => 10932401 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/932401
Rectifier diode device Sep 1, 2004 Issued
Array ( [id] => 853442 [patent_doc_number] => 07378748 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-05-27 [patent_title] => 'Solid-state imaging device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/931101 [patent_app_country] => US [patent_app_date] => 2004-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 4865 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/378/07378748.pdf [firstpage_image] =>[orig_patent_app_number] => 10931101 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/931101
Solid-state imaging device and method for manufacturing the same Aug 30, 2004 Issued
Array ( [id] => 934018 [patent_doc_number] => 06977213 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-12-20 [patent_title] => 'IC chip solder bump structure and method of manufacturing same' [patent_app_type] => utility [patent_app_number] => 10/928612 [patent_app_country] => US [patent_app_date] => 2004-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3751 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/977/06977213.pdf [firstpage_image] =>[orig_patent_app_number] => 10928612 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/928612
IC chip solder bump structure and method of manufacturing same Aug 26, 2004 Issued
Array ( [id] => 6903475 [patent_doc_number] => 20050098870 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-12 [patent_title] => 'FBGA arrangement' [patent_app_type] => utility [patent_app_number] => 10/927952 [patent_app_country] => US [patent_app_date] => 2004-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2105 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20050098870.pdf [firstpage_image] =>[orig_patent_app_number] => 10927952 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/927952
FBGA arrangement Aug 26, 2004 Issued
Array ( [id] => 7147948 [patent_doc_number] => 20050023661 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-03 [patent_title] => 'Hermetic sealing cap and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/926102 [patent_app_country] => US [patent_app_date] => 2004-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7903 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20050023661.pdf [firstpage_image] =>[orig_patent_app_number] => 10926102 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/926102
Hermetic sealing cap and method of manufacturing the same Aug 25, 2004 Issued
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