
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5239796
[patent_doc_number] => 20070018287
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-25
[patent_title] => 'Electronic device and carrier substrate for same'
[patent_app_type] => utility
[patent_app_number] => 10/574882
[patent_app_country] => US
[patent_app_date] => 2004-10-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 6286
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0018/20070018287.pdf
[firstpage_image] =>[orig_patent_app_number] => 10574882
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/574882 | Electronic device and carrier substrate for same | Sep 30, 2004 | Issued |
Array
(
[id] => 708752
[patent_doc_number] => 07061099
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-06-13
[patent_title] => 'Microelectronic package having chamber sealed by material including one or more intermetallic compounds'
[patent_app_type] => utility
[patent_app_number] => 10/955872
[patent_app_country] => US
[patent_app_date] => 2004-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 7785
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 6
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/061/07061099.pdf
[firstpage_image] =>[orig_patent_app_number] => 10955872
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/955872 | Microelectronic package having chamber sealed by material including one or more intermetallic compounds | Sep 29, 2004 | Issued |
Array
(
[id] => 935374
[patent_doc_number] => 06974723
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-12-13
[patent_title] => 'Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials'
[patent_app_type] => utility
[patent_app_number] => 10/956162
[patent_app_country] => US
[patent_app_date] => 2004-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 4362
[patent_no_of_claims] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/974/06974723.pdf
[firstpage_image] =>[orig_patent_app_number] => 10956162
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/956162 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | Sep 29, 2004 | Issued |
Array
(
[id] => 7154520
[patent_doc_number] => 20050082655
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/951811
[patent_app_country] => US
[patent_app_date] => 2004-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 7087
[patent_no_of_claims] => 61
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0082/20050082655.pdf
[firstpage_image] =>[orig_patent_app_number] => 10951811
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/951811 | Semiconductor device containing stacked semiconductor chips and manufacturing method thereof | Sep 28, 2004 | Issued |
Array
(
[id] => 5718578
[patent_doc_number] => 20060071351
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-06
[patent_title] => 'Mold compound interlocking feature to improve semiconductor package strength'
[patent_app_type] => utility
[patent_app_number] => 10/952342
[patent_app_country] => US
[patent_app_date] => 2004-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2440
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0071/20060071351.pdf
[firstpage_image] =>[orig_patent_app_number] => 10952342
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/952342 | Mold compound interlocking feature to improve semiconductor package strength | Sep 27, 2004 | Abandoned |
Array
(
[id] => 7114386
[patent_doc_number] => 20050067686
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-31
[patent_title] => 'Semiconductor device containing stacked semiconductor chips and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/951541
[patent_app_country] => US
[patent_app_date] => 2004-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4036
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[pdf_file] => publications/A1/0067/20050067686.pdf
[firstpage_image] =>[orig_patent_app_number] => 10951541
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/951541 | Semiconductor device containing stacked semiconductor chips and manufacturing method thereof | Sep 27, 2004 | Issued |
Array
(
[id] => 889157
[patent_doc_number] => 07348661
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-25
[patent_title] => 'Array capacitor apparatuses to filter input/output signal'
[patent_app_type] => utility
[patent_app_number] => 10/949582
[patent_app_country] => US
[patent_app_date] => 2004-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2850
[patent_no_of_claims] => 26
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/348/07348661.pdf
[firstpage_image] =>[orig_patent_app_number] => 10949582
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/949582 | Array capacitor apparatuses to filter input/output signal | Sep 23, 2004 | Issued |
Array
(
[id] => 6969748
[patent_doc_number] => 20050035458
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-17
[patent_title] => 'Metal film semiconductor device and a method for forming the same'
[patent_app_type] => utility
[patent_app_number] => 10/945992
[patent_app_country] => US
[patent_app_date] => 2004-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4800
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0035/20050035458.pdf
[firstpage_image] =>[orig_patent_app_number] => 10945992
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/945992 | Metal film semiconductor device and a method for forming the same | Sep 21, 2004 | Abandoned |
Array
(
[id] => 785775
[patent_doc_number] => 06989601
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-01-24
[patent_title] => 'Copper damascene with low-k capping layer and improved electromigration reliability'
[patent_app_type] => utility
[patent_app_number] => 10/946071
[patent_app_country] => US
[patent_app_date] => 2004-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 4512
[patent_no_of_claims] => 8
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[pdf_file] => patents/06/989/06989601.pdf
[firstpage_image] =>[orig_patent_app_number] => 10946071
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/946071 | Copper damascene with low-k capping layer and improved electromigration reliability | Sep 21, 2004 | Issued |
Array
(
[id] => 642827
[patent_doc_number] => 07122897
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-10-17
[patent_title] => 'Semiconductor device and method of manufacturing the semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/945111
[patent_app_country] => US
[patent_app_date] => 2004-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 43
[patent_no_of_words] => 10454
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[pdf_file] => patents/07/122/07122897.pdf
[firstpage_image] =>[orig_patent_app_number] => 10945111
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/945111 | Semiconductor device and method of manufacturing the semiconductor device | Sep 20, 2004 | Issued |
Array
(
[id] => 7008432
[patent_doc_number] => 20050062148
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-24
[patent_title] => 'Semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 10/944241
[patent_app_country] => US
[patent_app_date] => 2004-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0062/20050062148.pdf
[firstpage_image] =>[orig_patent_app_number] => 10944241
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/944241 | Semiconductor package | Sep 16, 2004 | Issued |
Array
(
[id] => 7008431
[patent_doc_number] => 20050062147
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[patent_kind] => A1
[patent_issue_date] => 2005-03-24
[patent_title] => 'Semiconductor device having heat dissipation layer'
[patent_app_type] => utility
[patent_app_number] => 10/940232
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[firstpage_image] =>[orig_patent_app_number] => 10940232
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/940232 | Semiconductor device having heat dissipation layer | Sep 12, 2004 | Issued |
Array
(
[id] => 869652
[patent_doc_number] => 07365413
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2008-04-29
[patent_title] => 'Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern'
[patent_app_type] => utility
[patent_app_number] => 10/940511
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/940511 | Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern | Sep 12, 2004 | Issued |
Array
(
[id] => 124198
[patent_doc_number] => 07705464
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-27
[patent_title] => 'Connection structure for semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 10/939931
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[patent_app_date] => 2004-09-13
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/939931 | Connection structure for semiconductor devices | Sep 12, 2004 | Issued |
Array
(
[id] => 5724269
[patent_doc_number] => 20060055029
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-16
[patent_title] => 'Integrated heatspreader for use in wire bonded ball grid array semiconductor packages'
[patent_app_type] => utility
[patent_app_number] => 10/939082
[patent_app_country] => US
[patent_app_date] => 2004-09-10
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[pdf_file] => publications/A1/0055/20060055029.pdf
[firstpage_image] =>[orig_patent_app_number] => 10939082
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/939082 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages | Sep 9, 2004 | Issued |
Array
(
[id] => 7154641
[patent_doc_number] => 20050082692
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Rectifier diode device'
[patent_app_type] => utility
[patent_app_number] => 10/932401
[patent_app_country] => US
[patent_app_date] => 2004-09-02
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 10932401
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/932401 | Rectifier diode device | Sep 1, 2004 | Issued |
Array
(
[id] => 853442
[patent_doc_number] => 07378748
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[patent_issue_date] => 2008-05-27
[patent_title] => 'Solid-state imaging device and method for manufacturing the same'
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[patent_app_number] => 10/931101
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/931101 | Solid-state imaging device and method for manufacturing the same | Aug 30, 2004 | Issued |
Array
(
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[patent_title] => 'IC chip solder bump structure and method of manufacturing same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/928612 | IC chip solder bump structure and method of manufacturing same | Aug 26, 2004 | Issued |
Array
(
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 10926102
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/926102 | Hermetic sealing cap and method of manufacturing the same | Aug 25, 2004 | Issued |