Jason Lappas
Examiner (ID: 2641, Phone: (571)270-1272 , Office: P/2827 )
Most Active Art Unit | 2827 |
Art Unit(s) | 2827 |
Total Applications | 1253 |
Issued Applications | 1140 |
Pending Applications | 50 |
Abandoned Applications | 63 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 6384754
[patent_doc_number] => 20020179933
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-05
[patent_title] => 'Vertical heterojunction bipolar transistor'
[patent_app_type] => new
[patent_app_number] => 10/197726
[patent_app_country] => US
[patent_app_date] => 2002-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 7140
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0179/20020179933.pdf
[firstpage_image] =>[orig_patent_app_number] => 10197726
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/197726 | Vertical heterojunction bipolar transistor | Jul 16, 2002 | Abandoned |
Array
(
[id] => 7427437
[patent_doc_number] => 20040007742
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-15
[patent_title] => 'Pure silcide ESD protection device'
[patent_app_type] => new
[patent_app_number] => 10/193445
[patent_app_country] => US
[patent_app_date] => 2002-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3479
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0007/20040007742.pdf
[firstpage_image] =>[orig_patent_app_number] => 10193445
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/193445 | Pure silcide ESD protection device | Jul 10, 2002 | Abandoned |
Array
(
[id] => 1110970
[patent_doc_number] => 06806160
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-10-19
[patent_title] => 'Method for forming a lateral SCR device for on-chip ESD protection in shallow-trench-isolation CMOS process'
[patent_app_type] => B2
[patent_app_number] => 10/178392
[patent_app_country] => US
[patent_app_date] => 2002-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[patent_no_of_words] => 3499
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/806/06806160.pdf
[firstpage_image] =>[orig_patent_app_number] => 10178392
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/178392 | Method for forming a lateral SCR device for on-chip ESD protection in shallow-trench-isolation CMOS process | Jun 24, 2002 | Issued |
Array
(
[id] => 1352332
[patent_doc_number] => 06580163
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-06-17
[patent_title] => 'IC chip packaging for reducing bond wire length'
[patent_app_type] => B2
[patent_app_number] => 10/172325
[patent_app_country] => US
[patent_app_date] => 2002-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1997
[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/580/06580163.pdf
[firstpage_image] =>[orig_patent_app_number] => 10172325
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/172325 | IC chip packaging for reducing bond wire length | Jun 13, 2002 | Issued |
Array
(
[id] => 1220572
[patent_doc_number] => 06703310
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-09
[patent_title] => 'Semiconductor device and method of production of same'
[patent_app_type] => B2
[patent_app_number] => 10/162598
[patent_app_country] => US
[patent_app_date] => 2002-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[patent_no_of_words] => 6820
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/703/06703310.pdf
[firstpage_image] =>[orig_patent_app_number] => 10162598
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/162598 | Semiconductor device and method of production of same | Jun 5, 2002 | Issued |
Array
(
[id] => 1123329
[patent_doc_number] => 06794236
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-09-21
[patent_title] => 'Eeprom device with improved capacitive coupling and fabrication process'
[patent_app_type] => B1
[patent_app_number] => 10/160855
[patent_app_country] => US
[patent_app_date] => 2002-06-03
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/794/06794236.pdf
[firstpage_image] =>[orig_patent_app_number] => 10160855
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/160855 | Eeprom device with improved capacitive coupling and fabrication process | Jun 2, 2002 | Issued |
Array
(
[id] => 6612240
[patent_doc_number] => 20030209807
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-11-13
[patent_title] => 'Organic substrate for flip chip bonding'
[patent_app_type] => new
[patent_app_number] => 10/141685
[patent_app_country] => US
[patent_app_date] => 2002-05-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4185
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0209/20030209807.pdf
[firstpage_image] =>[orig_patent_app_number] => 10141685
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/141685 | Organic substrate for flip chip bonding | May 6, 2002 | Issued |
Array
(
[id] => 5782794
[patent_doc_number] => 20020158272
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-31
[patent_title] => 'Semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/131206
[patent_app_country] => US
[patent_app_date] => 2002-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 24
[patent_no_of_words] => 11884
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0158/20020158272.pdf
[firstpage_image] =>[orig_patent_app_number] => 10131206
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/131206 | Semiconductor device | Apr 24, 2002 | Issued |
Array
(
[id] => 6547406
[patent_doc_number] => 20020110955
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-15
[patent_title] => 'Electronic device including at least one chip fixed to a support and a method for manufacturing such a device'
[patent_app_type] => new
[patent_app_number] => 10/126874
[patent_app_country] => US
[patent_app_date] => 2002-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20020110955.pdf
[firstpage_image] =>[orig_patent_app_number] => 10126874
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/126874 | Electronic device including at least one chip fixed to a support and a method for manufacturing such a device | Apr 21, 2002 | Abandoned |
Array
(
[id] => 6872775
[patent_doc_number] => 20030193072
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-10-16
[patent_title] => 'Embedded flat film molding'
[patent_app_type] => new
[patent_app_number] => 10/123685
[patent_app_country] => US
[patent_app_date] => 2002-04-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1980
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0193/20030193072.pdf
[firstpage_image] =>[orig_patent_app_number] => 10123685
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/123685 | Embedded flat film molding | Apr 15, 2002 | Issued |
Array
(
[id] => 1347581
[patent_doc_number] => 06586844
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-07-01
[patent_title] => 'Flip chip die'
[patent_app_type] => B1
[patent_app_number] => 10/115735
[patent_app_country] => US
[patent_app_date] => 2002-04-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/586/06586844.pdf
[firstpage_image] =>[orig_patent_app_number] => 10115735
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/115735 | Flip chip die | Apr 2, 2002 | Issued |
Array
(
[id] => 6153866
[patent_doc_number] => 20020145176
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-10
[patent_title] => 'Semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/096396
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[pdf_file] => publications/A1/0145/20020145176.pdf
[firstpage_image] =>[orig_patent_app_number] => 10096396
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/096396 | Semiconductor device | Mar 11, 2002 | Abandoned |
Array
(
[id] => 6671966
[patent_doc_number] => 20030057569
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-27
[patent_title] => 'Semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 10091306
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/091306 | Semiconductor device | Mar 5, 2002 | Abandoned |
Array
(
[id] => 6776700
[patent_doc_number] => 20030047780
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-13
[patent_title] => 'Semiconductor device and method for fabricating the same'
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[pdf_file] => publications/A1/0047/20030047780.pdf
[firstpage_image] =>[orig_patent_app_number] => 10084925
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/084925 | Semiconductor device and method for fabricating the same | Feb 28, 2002 | Issued |
Array
(
[id] => 5901061
[patent_doc_number] => 20020140057
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-03
[patent_title] => 'High frequency semiconductor device'
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[pdf_file] => publications/A1/0140/20020140057.pdf
[firstpage_image] =>[orig_patent_app_number] => 10078346
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/078346 | High frequency semiconductor device | Feb 20, 2002 | Issued |
Array
(
[id] => 1128205
[patent_doc_number] => 06791127
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-09-14
[patent_title] => 'Semiconductor device having a condenser chip for reducing a noise'
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/791/06791127.pdf
[firstpage_image] =>[orig_patent_app_number] => 10073316
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/073316 | Semiconductor device having a condenser chip for reducing a noise | Feb 12, 2002 | Issued |
Array
(
[id] => 6012390
[patent_doc_number] => 20020100977
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-01
[patent_title] => 'Semiconductor device having reliable coupling with mounting substrate'
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[pdf_file] => publications/A1/0100/20020100977.pdf
[firstpage_image] =>[orig_patent_app_number] => 10056035
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/056035 | Semiconductor device having reliable coupling with mounting substrate | Jan 27, 2002 | Issued |
Array
(
[id] => 1360638
[patent_doc_number] => 06576991
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-06-10
[patent_title] => 'Device with integrated circuit protected against attacks made by the controlled destruction of an additional layer'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/959166 | Device with integrated circuit protected against attacks made by the controlled destruction of an additional layer | Jan 27, 2002 | Issued |
Array
(
[id] => 1264484
[patent_doc_number] => 06660616
[patent_country] => US
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[patent_issue_date] => 2003-12-09
[patent_title] => 'P-i-n transit time silicon-on-insulator device'
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[patent_app_number] => 10/055436
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[pdf_file] => patents/06/660/06660616.pdf
[firstpage_image] =>[orig_patent_app_number] => 10055436
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/055436 | P-i-n transit time silicon-on-insulator device | Jan 22, 2002 | Issued |
Array
(
[id] => 6699458
[patent_doc_number] => 20030222338
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-12-04
[patent_title] => 'Reverse wire bonding techniques'
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[patent_app_number] => 10/039615
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0222/20030222338.pdf
[firstpage_image] =>[orig_patent_app_number] => 10039615
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/039615 | Reverse wire bonding techniques | Jan 3, 2002 | Abandoned |