Search

Jason M. Ip

Examiner (ID: 17072, Phone: (571)270-5387 , Office: P/3777 )

Most Active Art Unit
3793
Art Unit(s)
3793, 3777, 3737, 3797
Total Applications
730
Issued Applications
373
Pending Applications
66
Abandoned Applications
317

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18255728 [patent_doc_number] => 20230082767 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => ELECTRONIC PACKAGE [patent_app_type] => utility [patent_app_number] => 17/989554 [patent_app_country] => US [patent_app_date] => 2022-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3941 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17989554 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/989554
ELECTRONIC PACKAGE Nov 16, 2022 Pending
Array ( [id] => 19054866 [patent_doc_number] => 20240096835 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-21 [patent_title] => MANUFACTURING METHOD OF ELECTRONIC PACKAGE [patent_app_type] => utility [patent_app_number] => 18/055890 [patent_app_country] => US [patent_app_date] => 2022-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2466 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18055890 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/055890
MANUFACTURING METHOD OF ELECTRONIC PACKAGE Nov 15, 2022 Pending
Array ( [id] => 18366631 [patent_doc_number] => 20230148222 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/050724 [patent_app_country] => US [patent_app_date] => 2022-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9062 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18050724 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/050724
INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Oct 27, 2022 Pending
Array ( [id] => 19086203 [patent_doc_number] => 20240113004 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-04 [patent_title] => CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET [patent_app_type] => utility [patent_app_number] => 17/957444 [patent_app_country] => US [patent_app_date] => 2022-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7155 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17957444 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/957444
CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET Sep 29, 2022 Pending
Array ( [id] => 18143138 [patent_doc_number] => 20230016985 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/955239 [patent_app_country] => US [patent_app_date] => 2022-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5359 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17955239 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/955239
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Sep 27, 2022 Pending
Array ( [id] => 18774364 [patent_doc_number] => 20230369195 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => POWER MODULE AND METHOD FOR MANUFACTURING SAME [patent_app_type] => utility [patent_app_number] => 17/948332 [patent_app_country] => US [patent_app_date] => 2022-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4517 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17948332 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/948332
POWER MODULE AND METHOD FOR MANUFACTURING SAME Sep 19, 2022 Pending
Array ( [id] => 18346222 [patent_doc_number] => 20230134332 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => LEADFRAME PACKAGE WITH METAL INTERPOSER [patent_app_type] => utility [patent_app_number] => 17/948195 [patent_app_country] => US [patent_app_date] => 2022-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2211 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17948195 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/948195
LEADFRAME PACKAGE WITH METAL INTERPOSER Sep 18, 2022 Pending
Array ( [id] => 19038156 [patent_doc_number] => 20240087971 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS [patent_app_type] => utility [patent_app_number] => 17/943915 [patent_app_country] => US [patent_app_date] => 2022-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8000 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17943915 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/943915
COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS Sep 12, 2022 Pending
Array ( [id] => 19444535 [patent_doc_number] => 12094826 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-17 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/930991 [patent_app_country] => US [patent_app_date] => 2022-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 16 [patent_no_of_words] => 9696 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 210 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17930991 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/930991
Semiconductor device Sep 8, 2022 Issued
Array ( [id] => 19007818 [patent_doc_number] => 20240071889 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => RECESS LEAD FOR A SURFACE MOUNT PACKAGE [patent_app_type] => utility [patent_app_number] => 17/897974 [patent_app_country] => US [patent_app_date] => 2022-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4596 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17897974 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/897974
RECESS LEAD FOR A SURFACE MOUNT PACKAGE Aug 28, 2022 Pending
Array ( [id] => 18322024 [patent_doc_number] => 20230120152 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 17/896637 [patent_app_country] => US [patent_app_date] => 2022-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12196 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17896637 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/896637
Semiconductor device and semiconductor device manufacturing method Aug 25, 2022 Issued
Array ( [id] => 19007865 [patent_doc_number] => 20240071936 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/896083 [patent_app_country] => US [patent_app_date] => 2022-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10234 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17896083 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/896083
INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE Aug 25, 2022 Pending
Array ( [id] => 20360154 [patent_doc_number] => 12476159 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-18 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/822049 [patent_app_country] => US [patent_app_date] => 2022-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 0 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17822049 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/822049
Semiconductor device Aug 23, 2022 Issued
Array ( [id] => 19007810 [patent_doc_number] => 20240071881 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT [patent_app_type] => utility [patent_app_number] => 17/894063 [patent_app_country] => US [patent_app_date] => 2022-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4680 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17894063 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/894063
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT Aug 22, 2022 Pending
Array ( [id] => 20229311 [patent_doc_number] => 12417967 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-16 [patent_title] => Low parasitic inductance power module featuring staggered interleaving conductive members [patent_app_type] => utility [patent_app_number] => 17/892008 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 0 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 501 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17892008 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/892008
Low parasitic inductance power module featuring staggered interleaving conductive members Aug 18, 2022 Issued
Array ( [id] => 18991172 [patent_doc_number] => 20240063141 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => SOLDER JOINT DESIGN FOR IMPROVED PACKAGE RELIABILITY [patent_app_type] => utility [patent_app_number] => 17/891535 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4588 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17891535 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/891535
SOLDER JOINT DESIGN FOR IMPROVED PACKAGE RELIABILITY Aug 18, 2022 Pending
Array ( [id] => 18991131 [patent_doc_number] => 20240063100 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES [patent_app_type] => utility [patent_app_number] => 17/889229 [patent_app_country] => US [patent_app_date] => 2022-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6097 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17889229 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/889229
SKIP LAYER WITH AIR GAP ON GLASS SUBSTRATES Aug 15, 2022 Pending
Array ( [id] => 18212343 [patent_doc_number] => 20230058607 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => CHIP-ON-BOARD MODULE [patent_app_type] => utility [patent_app_number] => 17/886896 [patent_app_country] => US [patent_app_date] => 2022-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2661 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17886896 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/886896
CHIP-ON-BOARD MODULE Aug 11, 2022 Pending
Array ( [id] => 19858242 [patent_doc_number] => 12261093 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-25 [patent_title] => Semiconductor packages having a dam structure [patent_app_type] => utility [patent_app_number] => 17/883726 [patent_app_country] => US [patent_app_date] => 2022-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 14 [patent_no_of_words] => 4892 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17883726 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/883726
Semiconductor packages having a dam structure Aug 8, 2022 Issued
Array ( [id] => 18040193 [patent_doc_number] => 20220384410 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => FUSION MEMORY DEVICE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/883682 [patent_app_country] => US [patent_app_date] => 2022-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5084 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17883682 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/883682
Fusion memory device and method of fabricating the same Aug 8, 2022 Issued
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