
Jay C. Chang
Examiner (ID: 164, Phone: (571)272-6132 , Office: P/2895 )
| Most Active Art Unit | 2895 |
| Art Unit(s) | 2895, 2817 |
| Total Applications | 685 |
| Issued Applications | 519 |
| Pending Applications | 88 |
| Abandoned Applications | 100 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10022195
[patent_doc_number] => 09064688
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[patent_issue_date] => 2015-06-23
[patent_title] => 'Performing enhanced cleaning in the formation of MOS devices'
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Array
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[patent_kind] => A1
[patent_issue_date] => 2013-09-26
[patent_title] => 'Variation Resistant Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET)'
[patent_app_type] => utility
[patent_app_number] => 13/424745
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Array
(
[id] => 8356998
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[patent_title] => 'SEMICONDUCTOR DEVICE AND DEVICE WITH USE OF IT'
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Array
(
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[patent_issue_date] => 2013-09-03
[patent_title] => 'Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure'
[patent_app_type] => utility
[patent_app_number] => 13/366008
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Array
(
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[patent_title] => 'Methods for fabricating MOS devices with stress memorization'
[patent_app_type] => utility
[patent_app_number] => 13/343513
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[patent_app_date] => 2012-01-27
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Array
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Array
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[patent_title] => 'Diode string voltage adapter'
[patent_app_type] => utility
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[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/336563 | Diode string voltage adapter | Dec 22, 2011 | Issued |
Array
(
[id] => 8310547
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[patent_app_number] => 13/336247
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Array
(
[id] => 8261829
[patent_doc_number] => 20120161260
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[patent_title] => 'Method for packaging a sensor chip, and a component produced using such a method'
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Array
(
[id] => 8299078
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[patent_title] => 'COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF'
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Array
(
[id] => 9286060
[patent_doc_number] => 08642388
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[patent_title] => 'Method for manufacturing light emitting diodes including forming circuit structures with a connecting section'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/332380 | Method for manufacturing light emitting diodes including forming circuit structures with a connecting section | Dec 20, 2011 | Issued |
Array
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[id] => 8880940
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Array
(
[id] => 9778654
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Array
(
[id] => 8274984
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Array
(
[id] => 8261905
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[patent_title] => 'COMPOSITION FOR FILLING THROUGH SILICON VIA (TSV), TSV FILLING METHOD AND SUBSTRATE INCLUDING TSV PLUG FORMED OF THE COMPOSITION'
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Array
(
[id] => 8249113
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Array
(
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Array
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Array
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