![](/images/general/no_picture/200_user.png)
Jay Huang
Examiner (ID: 5062)
Most Active Art Unit | 3685 |
Art Unit(s) | 3619, 3685 |
Total Applications | 480 |
Issued Applications | 227 |
Pending Applications | 35 |
Abandoned Applications | 218 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
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[id] => 10278971
[patent_doc_number] => 20150163969
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[patent_kind] => A1
[patent_issue_date] => 2015-06-11
[patent_title] => 'ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD'
[patent_app_type] => utility
[patent_app_number] => 14/561634
[patent_app_country] => US
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Array
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[patent_issue_date] => 2015-06-11
[patent_title] => 'ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM'
[patent_app_type] => utility
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Array
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[patent_doc_number] => 20150195939
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[patent_kind] => A1
[patent_issue_date] => 2015-07-09
[patent_title] => 'BOX-FRAME HOUSING AND A METHOD OF MANUFACTURE'
[patent_app_type] => utility
[patent_app_number] => 14/557032
[patent_app_country] => US
[patent_app_date] => 2011-08-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/557032 | Box-frame housing and a method of manufacture | Nov 30, 2014 | Issued |
Array
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[patent_doc_number] => 09666460
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-05-30
[patent_title] => 'Through type furnace for substrates comprising a longitudinal slit'
[patent_app_type] => utility
[patent_app_number] => 14/549327
[patent_app_country] => US
[patent_app_date] => 2014-11-20
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Array
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[id] => 12969235
[patent_doc_number] => 09875985
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[patent_kind] => B2
[patent_issue_date] => 2018-01-23
[patent_title] => Flip-chip bonder with induction coils and a heating element
[patent_app_type] => utility
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Array
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[patent_issue_date] => 2016-09-22
[patent_title] => 'THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USING THROUGH ELECTRODE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/035882 | THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USING THROUGH ELECTRODE | Nov 9, 2014 | Abandoned |
Array
(
[id] => 11097171
[patent_doc_number] => 20160294140
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[patent_kind] => A1
[patent_issue_date] => 2016-10-06
[patent_title] => 'DEVICE FOR WELDING ELECTRICAL CONDUCTORS'
[patent_app_type] => utility
[patent_app_number] => 15/035374
[patent_app_country] => US
[patent_app_date] => 2014-11-06
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/035374 | DEVICE FOR WELDING ELECTRICAL CONDUCTORS | Nov 5, 2014 | Abandoned |
Array
(
[id] => 14453049
[patent_doc_number] => 10322472
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-06-18
[patent_title] => Cu core ball, solder paste, formed solder, Cu core column, and solder joint
[patent_app_type] => utility
[patent_app_number] => 15/034194
[patent_app_country] => US
[patent_app_date] => 2014-11-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/034194 | Cu core ball, solder paste, formed solder, Cu core column, and solder joint | Nov 3, 2014 | Issued |
Array
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[id] => 9898552
[patent_doc_number] => 20150053751
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-02-26
[patent_title] => 'Aluminium Composite Material for Fluxless Brazing'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/531717 | Aluminium Composite Material for Fluxless Brazing | Nov 2, 2014 | Abandoned |
Array
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[id] => 10244653
[patent_doc_number] => 20150129648
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[patent_kind] => A1
[patent_issue_date] => 2015-05-14
[patent_title] => 'Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method'
[patent_app_type] => utility
[patent_app_number] => 14/531860
[patent_app_country] => US
[patent_app_date] => 2014-11-03
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Array
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[id] => 11721589
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[patent_title] => 'System and method for flux coat, reflow and clean'
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Array
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[id] => 10229725
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[patent_title] => 'Inhibition of Microfissure Formation in Wear Resistant Coatings'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/522124 | Inhibition of Microfissure Formation in Wear Resistant Coatings | Oct 22, 2014 | Abandoned |
Array
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Array
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[id] => 10212032
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Array
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[id] => 10212030
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/504701 | Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials | Oct 1, 2014 | Issued |
Array
(
[id] => 9802453
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[patent_title] => 'METHOD OF MOUNTING ELECTRONIC PARTS ON SURFACE MOUNTING SUBSTRATE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/505046 | Method of mounting electronic parts on surface mounting substrate using a film resist standoff | Oct 1, 2014 | Issued |
Array
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Array
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