
Jenny L. Wagner
Supervisory Patent Examiner (ID: 9120, Phone: (571)272-5359 , Office: P/2848 )
| Most Active Art Unit | 2891 |
| Art Unit(s) | 2891, 2848, 2800, 2112 |
| Total Applications | 432 |
| Issued Applications | 298 |
| Pending Applications | 0 |
| Abandoned Applications | 134 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7486174
[patent_doc_number] => 20110250742
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-10-13
[patent_title] => 'CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES'
[patent_app_type] => utility
[patent_app_number] => 13/041674
[patent_app_country] => US
[patent_app_date] => 2011-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4404
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0250/20110250742.pdf
[firstpage_image] =>[orig_patent_app_number] => 13041674
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/041674 | Controlling warping in integrated circuit devices | Mar 6, 2011 | Issued |
Array
(
[id] => 6208433
[patent_doc_number] => 20110133336
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-09
[patent_title] => 'Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device'
[patent_app_type] => utility
[patent_app_number] => 13/030098
[patent_app_country] => US
[patent_app_date] => 2011-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
[patent_no_of_words] => 7318
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0133/20110133336.pdf
[firstpage_image] =>[orig_patent_app_number] => 13030098
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/030098 | Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device | Feb 16, 2011 | Abandoned |
Array
(
[id] => 9027115
[patent_doc_number] => 08536698
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-09-17
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 13/027648
[patent_app_country] => US
[patent_app_date] => 2011-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1558
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13027648
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/027648 | Semiconductor device | Feb 14, 2011 | Issued |
Array
(
[id] => 6058969
[patent_doc_number] => 20110198740
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-08-18
[patent_title] => 'SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 13/027668
[patent_app_country] => US
[patent_app_date] => 2011-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 7809
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0198/20110198740.pdf
[firstpage_image] =>[orig_patent_app_number] => 13027668
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/027668 | Semiconductor storage device and manufacturing method thereof | Feb 14, 2011 | Issued |
Array
(
[id] => 7815188
[patent_doc_number] => 20120061808
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-15
[patent_title] => 'SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND RELATED METHODS'
[patent_app_type] => utility
[patent_app_number] => 13/026991
[patent_app_country] => US
[patent_app_date] => 2011-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 22
[patent_no_of_words] => 5713
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0061/20120061808.pdf
[firstpage_image] =>[orig_patent_app_number] => 13026991
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/026991 | Semiconductor packages having increased input/output capacity and related methods | Feb 13, 2011 | Issued |
Array
(
[id] => 7496901
[patent_doc_number] => 20110260341
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-10-27
[patent_title] => 'Power switch component having improved temperature distribution'
[patent_app_type] => utility
[patent_app_number] => 13/025344
[patent_app_country] => US
[patent_app_date] => 2011-02-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1705
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0260/20110260341.pdf
[firstpage_image] =>[orig_patent_app_number] => 13025344
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/025344 | Power switch component having improved temperature distribution | Feb 10, 2011 | Issued |
Array
(
[id] => 6058920
[patent_doc_number] => 20110198732
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-08-18
[patent_title] => 'CHIP PACKAGE AND METHOD FOR FORMING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/026072
[patent_app_country] => US
[patent_app_date] => 2011-02-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4255
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0198/20110198732.pdf
[firstpage_image] =>[orig_patent_app_number] => 13026072
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/026072 | Chip package and method for forming the same | Feb 10, 2011 | Issued |
Array
(
[id] => 7515236
[patent_doc_number] => 08039308
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-10-18
[patent_title] => 'Integrated-circuit package for proximity communication'
[patent_app_type] => utility
[patent_app_number] => 13/006227
[patent_app_country] => US
[patent_app_date] => 2011-01-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 19
[patent_no_of_words] => 11173
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/039/08039308.pdf
[firstpage_image] =>[orig_patent_app_number] => 13006227
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/006227 | Integrated-circuit package for proximity communication | Jan 12, 2011 | Issued |
Array
(
[id] => 9256003
[patent_doc_number] => 08619431
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-12-31
[patent_title] => 'Three-dimensional system-in-package package-on-package structure'
[patent_app_type] => utility
[patent_app_number] => 12/975698
[patent_app_country] => US
[patent_app_date] => 2010-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4079
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 262
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12975698
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/975698 | Three-dimensional system-in-package package-on-package structure | Dec 21, 2010 | Issued |
Array
(
[id] => 6153850
[patent_doc_number] => 20110156278
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-30
[patent_title] => 'FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE'
[patent_app_type] => utility
[patent_app_number] => 12/975783
[patent_app_country] => US
[patent_app_date] => 2010-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 24891
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0156/20110156278.pdf
[firstpage_image] =>[orig_patent_app_number] => 12975783
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/975783 | Film for flip chip type semiconductor back surface | Dec 21, 2010 | Issued |
Array
(
[id] => 4644324
[patent_doc_number] => 08021929
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-09-20
[patent_title] => 'Apparatus and method configured to lower thermal stresses'
[patent_app_type] => utility
[patent_app_number] => 12/975825
[patent_app_country] => US
[patent_app_date] => 2010-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 3801
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/021/08021929.pdf
[firstpage_image] =>[orig_patent_app_number] => 12975825
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/975825 | Apparatus and method configured to lower thermal stresses | Dec 21, 2010 | Issued |
Array
(
[id] => 6099052
[patent_doc_number] => 20110163456
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-07-07
[patent_title] => 'ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS'
[patent_app_type] => utility
[patent_app_number] => 12/974573
[patent_app_country] => US
[patent_app_date] => 2010-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 9806
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0163/20110163456.pdf
[firstpage_image] =>[orig_patent_app_number] => 12974573
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/974573 | Electronic device substrate, electronic device, method of manufacturing electronic device substrate, method of manufacturing electronic device, and electronic apparatus | Dec 20, 2010 | Issued |
Array
(
[id] => 8249152
[patent_doc_number] => 20120153474
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-21
[patent_title] => 'INTEGRATED CIRCUIT SYSTEM WITH REDUCED POLYSILICON RESIDUE AND METHOD OF MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/975327
[patent_app_country] => US
[patent_app_date] => 2010-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 6304
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0153/20120153474.pdf
[firstpage_image] =>[orig_patent_app_number] => 12975327
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/975327 | Integrated circuit system with reduced polysilicon residue and method of manufacture thereof | Dec 20, 2010 | Issued |
Array
(
[id] => 8713818
[patent_doc_number] => 08399961
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-03-19
[patent_title] => 'Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps'
[patent_app_type] => utility
[patent_app_number] => 12/974896
[patent_app_country] => US
[patent_app_date] => 2010-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 3203
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12974896
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/974896 | Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps | Dec 20, 2010 | Issued |
Array
(
[id] => 8317880
[patent_doc_number] => 08232657
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-31
[patent_title] => 'Packaged semiconductor assemblies and methods for manufacturing such assemblies'
[patent_app_type] => utility
[patent_app_number] => 12/973607
[patent_app_country] => US
[patent_app_date] => 2010-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 19
[patent_no_of_words] => 8019
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 176
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12973607
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/973607 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Dec 19, 2010 | Issued |
Array
(
[id] => 8654242
[patent_doc_number] => 08373997
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-02-12
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/972894
[patent_app_country] => US
[patent_app_date] => 2010-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 7586
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12972894
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/972894 | Semiconductor device | Dec 19, 2010 | Issued |
Array
(
[id] => 4619136
[patent_doc_number] => 07998855
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-16
[patent_title] => 'Solving via-misalignment issues in interconnect structures having air-gaps'
[patent_app_type] => utility
[patent_app_number] => 12/963293
[patent_app_country] => US
[patent_app_date] => 2010-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 3659
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/998/07998855.pdf
[firstpage_image] =>[orig_patent_app_number] => 12963293
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/963293 | Solving via-misalignment issues in interconnect structures having air-gaps | Dec 7, 2010 | Issued |
Array
(
[id] => 7988981
[patent_doc_number] => 08076788
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-12-13
[patent_title] => 'Off-chip vias in stacked chips'
[patent_app_type] => utility
[patent_app_number] => 12/941392
[patent_app_country] => US
[patent_app_date] => 2010-11-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 26
[patent_no_of_words] => 6790
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/076/08076788.pdf
[firstpage_image] =>[orig_patent_app_number] => 12941392
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/941392 | Off-chip vias in stacked chips | Nov 7, 2010 | Issued |
Array
(
[id] => 8528341
[patent_doc_number] => 08304914
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-06
[patent_title] => 'Flash memory device with word lines of uniform width and method for manufacturing thereof'
[patent_app_type] => utility
[patent_app_number] => 12/912602
[patent_app_country] => US
[patent_app_date] => 2010-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 44
[patent_no_of_words] => 5283
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12912602
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/912602 | Flash memory device with word lines of uniform width and method for manufacturing thereof | Oct 25, 2010 | Issued |
Array
(
[id] => 4612934
[patent_doc_number] => 07989317
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-02
[patent_title] => 'Manufacturing method of semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/909244
[patent_app_country] => US
[patent_app_date] => 2010-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 31
[patent_no_of_words] => 8591
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/989/07989317.pdf
[firstpage_image] =>[orig_patent_app_number] => 12909244
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/909244 | Manufacturing method of semiconductor device | Oct 20, 2010 | Issued |