
Jenny L. Wagner
Supervisory Patent Examiner (ID: 9120, Phone: (571)272-5359 , Office: P/2848 )
| Most Active Art Unit | 2891 |
| Art Unit(s) | 2891, 2848, 2800, 2112 |
| Total Applications | 432 |
| Issued Applications | 298 |
| Pending Applications | 0 |
| Abandoned Applications | 134 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6418975
[patent_doc_number] => 20100167468
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-01
[patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/648276
[patent_app_country] => US
[patent_app_date] => 2009-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => publications/A1/0167/20100167468.pdf
[firstpage_image] =>[orig_patent_app_number] => 12648276
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/648276 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Dec 27, 2009 | Abandoned |
Array
(
[id] => 8543305
[patent_doc_number] => 08318595
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-27
[patent_title] => 'Self-assembled electrical contacts'
[patent_app_type] => utility
[patent_app_number] => 12/625189
[patent_app_country] => US
[patent_app_date] => 2009-11-24
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/625189 | Self-assembled electrical contacts | Nov 23, 2009 | Issued |
Array
(
[id] => 5980316
[patent_doc_number] => 20110095423
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[patent_kind] => A1
[patent_issue_date] => 2011-04-28
[patent_title] => 'SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD'
[patent_app_type] => utility
[patent_app_number] => 13/000391
[patent_app_country] => US
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[pdf_file] => publications/A1/0095/20110095423.pdf
[firstpage_image] =>[orig_patent_app_number] => 13000391
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/000391 | Semiconductor device mounted structure and its manufacturing method | Oct 26, 2009 | Issued |
Array
(
[id] => 8270854
[patent_doc_number] => 08212362
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-03
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/603106
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/603106 | Semiconductor device | Oct 20, 2009 | Issued |
Array
(
[id] => 8200735
[patent_doc_number] => 08187964
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[patent_issue_date] => 2012-05-29
[patent_title] => 'Integrated circuit device and method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/581573 | Integrated circuit device and method | Oct 18, 2009 | Issued |
Array
(
[id] => 6601019
[patent_doc_number] => 20100032840
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[patent_kind] => A1
[patent_issue_date] => 2010-02-11
[patent_title] => 'Semiconductor Device with an Improved Solder Joint'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 12581254
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/581254 | Semiconductor device with an improved solder joint | Oct 18, 2009 | Issued |
Array
(
[id] => 6349983
[patent_doc_number] => 20100021656
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-28
[patent_title] => 'LOW LEAKAGE METAL-CONTAINING CAP PROCESS USING OXIDATION'
[patent_app_type] => utility
[patent_app_number] => 12/573407
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[pdf_file] => publications/A1/0021/20100021656.pdf
[firstpage_image] =>[orig_patent_app_number] => 12573407
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/573407 | Low leakage metal-containing cap process using oxidation | Oct 4, 2009 | Issued |
Array
(
[id] => 6348233
[patent_doc_number] => 20100330741
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-30
[patent_title] => 'FABRICATION METHOD FOR SYSTEM-ON-CHIP (SOC) MODULE'
[patent_app_type] => utility
[patent_app_number] => 12/570049
[patent_app_country] => US
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[pdf_file] => publications/A1/0330/20100330741.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/570049 | FABRICATION METHOD FOR SYSTEM-ON-CHIP (SOC) MODULE | Sep 29, 2009 | Abandoned |
Array
(
[id] => 6114674
[patent_doc_number] => 20110074044
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[patent_kind] => A1
[patent_issue_date] => 2011-03-31
[patent_title] => 'PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION'
[patent_app_type] => utility
[patent_app_number] => 12/569200
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[pdf_file] => publications/A1/0074/20110074044.pdf
[firstpage_image] =>[orig_patent_app_number] => 12569200
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/569200 | Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication | Sep 28, 2009 | Issued |
Array
(
[id] => 6358531
[patent_doc_number] => 20100078746
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[patent_issue_date] => 2010-04-01
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/568820
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Array
(
[id] => 7527899
[patent_doc_number] => 08044494
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[patent_issue_date] => 2011-10-25
[patent_title] => 'Stackable molded packages and methods of making the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/567469 | Stackable molded packages and methods of making the same | Sep 24, 2009 | Issued |
Array
(
[id] => 5972695
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[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CAP LAYER AND METHOD OF MANUFACTURE THEREOF'
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Array
(
[id] => 5972733
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[patent_title] => 'ASSEMBLY OF MULTI-CHIP MODULES USING SACRIFICIAL FEATURES'
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Array
(
[id] => 7800984
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[patent_title] => 'Semiconductor device and manufacturing method thereof'
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Array
(
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[patent_title] => 'Stackable wafer level package and fabricating method thereof'
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Array
(
[id] => 6352888
[patent_doc_number] => 20100072629
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[patent_title] => 'Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device'
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[patent_app_number] => 12/562019
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/562019 | Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device | Sep 16, 2009 | Abandoned |
Array
(
[id] => 6575902
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Array
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Array
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Array
(
[id] => 4528801
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/546083 | Controlling warping in integrated circuit devices | Aug 23, 2009 | Issued |