Search

Jeremy C. Norris

Examiner (ID: 14672, Phone: (571)272-1932 , Office: P/2847 )

Most Active Art Unit
2847
Art Unit(s)
2841, 2831, 2835, 2847, 2827
Total Applications
2108
Issued Applications
1794
Pending Applications
93
Abandoned Applications
249

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17440659 [patent_doc_number] => 11266015 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-03-01 [patent_title] => Short interconnect assembly with strip elastomer [patent_app_type] => utility [patent_app_number] => 17/344499 [patent_app_country] => US [patent_app_date] => 2021-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 19 [patent_no_of_words] => 4683 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 362 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17344499 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/344499
Short interconnect assembly with strip elastomer Jun 9, 2021 Issued
Array ( [id] => 19102663 [patent_doc_number] => 20240121891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-11 [patent_title] => FLEXIBLE PRINTED BOARD [patent_app_type] => utility [patent_app_number] => 18/548216 [patent_app_country] => US [patent_app_date] => 2021-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7754 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18548216 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/548216
FLEXIBLE PRINTED BOARD Jun 8, 2021 Pending
Array ( [id] => 18063771 [patent_doc_number] => 20220394858 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-08 [patent_title] => PACKAGE SUBSTRATE INCLUDING CORE WITH TRENCH VIAS AND PLANES [patent_app_type] => utility [patent_app_number] => 17/339420 [patent_app_country] => US [patent_app_date] => 2021-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7425 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17339420 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/339420
PACKAGE SUBSTRATE INCLUDING CORE WITH TRENCH VIAS AND PLANES Jun 3, 2021 Pending
Array ( [id] => 18264349 [patent_doc_number] => 11612062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-21 [patent_title] => Barrier layer [patent_app_type] => utility [patent_app_number] => 17/336113 [patent_app_country] => US [patent_app_date] => 2021-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2745 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17336113 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/336113
Barrier layer May 31, 2021 Issued
Array ( [id] => 19664260 [patent_doc_number] => 12177962 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-24 [patent_title] => Insulating resin circuit substrate [patent_app_type] => utility [patent_app_number] => 17/928356 [patent_app_country] => US [patent_app_date] => 2021-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 5688 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17928356 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/928356
Insulating resin circuit substrate May 30, 2021 Issued
Array ( [id] => 17956687 [patent_doc_number] => 11482802 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-10-25 [patent_title] => High speed traceless interconnect [patent_app_type] => utility [patent_app_number] => 17/333925 [patent_app_country] => US [patent_app_date] => 2021-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 12 [patent_no_of_words] => 5628 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17333925 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/333925
High speed traceless interconnect May 27, 2021 Issued
Array ( [id] => 17101830 [patent_doc_number] => 20210289621 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => FLEXIBLE SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/333165 [patent_app_country] => US [patent_app_date] => 2021-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6796 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17333165 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/333165
Flexible substrate May 27, 2021 Issued
Array ( [id] => 18010700 [patent_doc_number] => 20220369467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/330982 [patent_app_country] => US [patent_app_date] => 2021-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3045 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17330982 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/330982
Circuit board, method for manufacturing the same May 25, 2021 Issued
Array ( [id] => 18595084 [patent_doc_number] => 11744006 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-29 [patent_title] => Method and design of high-performance interconnects with improved signal integrity [patent_app_type] => utility [patent_app_number] => 17/329285 [patent_app_country] => US [patent_app_date] => 2021-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5465 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17329285 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/329285
Method and design of high-performance interconnects with improved signal integrity May 24, 2021 Issued
Array ( [id] => 17732392 [patent_doc_number] => 11388811 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2022-07-12 [patent_title] => Heat-dissipating substrate structure with built-in conductive circuits [patent_app_type] => utility [patent_app_number] => 17/326359 [patent_app_country] => US [patent_app_date] => 2021-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3046 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17326359 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/326359
Heat-dissipating substrate structure with built-in conductive circuits May 20, 2021 Issued
Array ( [id] => 18475415 [patent_doc_number] => 20230209703 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => Method for manufacturing a component [patent_app_type] => utility [patent_app_number] => 17/927204 [patent_app_country] => US [patent_app_date] => 2021-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7236 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17927204 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/927204
Method for manufacturing a component May 20, 2021 Abandoned
Array ( [id] => 18458662 [patent_doc_number] => 20230199944 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => CIRCUIT BOARD [patent_app_type] => utility [patent_app_number] => 17/926681 [patent_app_country] => US [patent_app_date] => 2021-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8353 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17926681 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/926681
Circuit board May 20, 2021 Issued
Array ( [id] => 17731213 [patent_doc_number] => 11387617 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-12 [patent_title] => Systems and methods for providing a soldered interface on a printed circuit board having a blind feature [patent_app_type] => utility [patent_app_number] => 17/319993 [patent_app_country] => US [patent_app_date] => 2021-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 42 [patent_no_of_words] => 9128 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17319993 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/319993
Systems and methods for providing a soldered interface on a printed circuit board having a blind feature May 12, 2021 Issued
Array ( [id] => 17057617 [patent_doc_number] => 20210267051 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-26 [patent_title] => RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS [patent_app_type] => utility [patent_app_number] => 17/319396 [patent_app_country] => US [patent_app_date] => 2021-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13327 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17319396 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/319396
Resin multilayer substrate and electronic apparatus May 12, 2021 Issued
Array ( [id] => 17774051 [patent_doc_number] => 11406024 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-02 [patent_title] => Multi-layer circuit board with traces thicker than a circuit board [patent_app_type] => utility [patent_app_number] => 17/317203 [patent_app_country] => US [patent_app_date] => 2021-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 7610 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17317203 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/317203
Multi-layer circuit board with traces thicker than a circuit board May 10, 2021 Issued
Array ( [id] => 18761492 [patent_doc_number] => 11812546 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-07 [patent_title] => High-frequency circuit [patent_app_type] => utility [patent_app_number] => 17/783094 [patent_app_country] => US [patent_app_date] => 2021-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 6998 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 203 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17783094 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/783094
High-frequency circuit May 9, 2021 Issued
Array ( [id] => 17979018 [patent_doc_number] => 11495896 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-11-08 [patent_title] => High voltage superconductors for datacenter campus [patent_app_type] => utility [patent_app_number] => 17/246824 [patent_app_country] => US [patent_app_date] => 2021-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 4869 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17246824 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/246824
High voltage superconductors for datacenter campus May 2, 2021 Issued
Array ( [id] => 18791084 [patent_doc_number] => 20230380062 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 17/923624 [patent_app_country] => US [patent_app_date] => 2021-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6823 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17923624 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/923624
Beveled overburden for vias and method of making the same Apr 28, 2021 Issued
Array ( [id] => 18465860 [patent_doc_number] => 11690171 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-06-27 [patent_title] => Conductive bump electrode structure [patent_app_type] => utility [patent_app_number] => 17/242340 [patent_app_country] => US [patent_app_date] => 2021-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2332 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17242340 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/242340
Conductive bump electrode structure Apr 27, 2021 Issued
Array ( [id] => 17012739 [patent_doc_number] => 20210243900 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-05 [patent_title] => WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/237616 [patent_app_country] => US [patent_app_date] => 2021-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16201 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -2 [patent_words_short_claim] => 355 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17237616 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/237616
Wired circuit board and production method thereof Apr 21, 2021 Issued
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