
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 17553560
[patent_doc_number] => 20220124904
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-04-21
[patent_title] => MODULE SUBSTRATE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/358800
[patent_app_country] => US
[patent_app_date] => 2021-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5647
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17358800
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/358800 | Module substrate and semiconductor module including the same | Jun 24, 2021 | Issued |
Array
(
[id] => 18237467
[patent_doc_number] => 11602043
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-03-07
[patent_title] => Systems and methods for varying an impedance of a cable
[patent_app_type] => utility
[patent_app_number] => 17/354131
[patent_app_country] => US
[patent_app_date] => 2021-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 3770
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17354131
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/354131 | Systems and methods for varying an impedance of a cable | Jun 21, 2021 | Issued |
Array
(
[id] => 20133900
[patent_doc_number] => 12376229
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-07-29
[patent_title] => Resin coated copper and circuit board including the same
[patent_app_type] => utility
[patent_app_number] => 18/010921
[patent_app_country] => US
[patent_app_date] => 2021-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 17
[patent_no_of_words] => 8338
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18010921
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/010921 | Resin coated copper and circuit board including the same | Jun 16, 2021 | Issued |
Array
(
[id] => 19897938
[patent_doc_number] => 12275846
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-04-15
[patent_title] => Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
[patent_app_type] => utility
[patent_app_number] => 18/012176
[patent_app_country] => US
[patent_app_date] => 2021-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 10
[patent_no_of_words] => 6476
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18012176
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/012176 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board | Jun 13, 2021 | Issued |
Array
(
[id] => 17440659
[patent_doc_number] => 11266015
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-03-01
[patent_title] => Short interconnect assembly with strip elastomer
[patent_app_type] => utility
[patent_app_number] => 17/344499
[patent_app_country] => US
[patent_app_date] => 2021-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 19
[patent_no_of_words] => 4683
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 362
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17344499
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/344499 | Short interconnect assembly with strip elastomer | Jun 9, 2021 | Issued |
Array
(
[id] => 20649453
[patent_doc_number] => 12604416
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-04-14
[patent_title] => Laminate for wiring board
[patent_app_type] => utility
[patent_app_number] => 18/283537
[patent_app_country] => US
[patent_app_date] => 2021-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 31
[patent_no_of_words] => 9598
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18283537
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/283537 | Laminate for wiring board | Jun 9, 2021 | Issued |
Array
(
[id] => 19102663
[patent_doc_number] => 20240121891
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-04-11
[patent_title] => FLEXIBLE PRINTED BOARD
[patent_app_type] => utility
[patent_app_number] => 18/548216
[patent_app_country] => US
[patent_app_date] => 2021-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7754
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -5
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18548216
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/548216 | Flexible printed board | Jun 8, 2021 | Issued |
Array
(
[id] => 20691767
[patent_doc_number] => 12621937
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-05-05
[patent_title] => Package substrate including core with trench vias and planes
[patent_app_type] => utility
[patent_app_number] => 17/339420
[patent_app_country] => US
[patent_app_date] => 2021-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 32
[patent_no_of_words] => 2213
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17339420
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/339420 | Package substrate including core with trench vias and planes | Jun 3, 2021 | Issued |
Array
(
[id] => 18264349
[patent_doc_number] => 11612062
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-03-21
[patent_title] => Barrier layer
[patent_app_type] => utility
[patent_app_number] => 17/336113
[patent_app_country] => US
[patent_app_date] => 2021-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2745
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 46
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17336113
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/336113 | Barrier layer | May 31, 2021 | Issued |
Array
(
[id] => 19664260
[patent_doc_number] => 12177962
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-24
[patent_title] => Insulating resin circuit substrate
[patent_app_type] => utility
[patent_app_number] => 17/928356
[patent_app_country] => US
[patent_app_date] => 2021-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 7
[patent_no_of_words] => 5688
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 186
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17928356
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/928356 | Insulating resin circuit substrate | May 30, 2021 | Issued |
Array
(
[id] => 17101830
[patent_doc_number] => 20210289621
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-16
[patent_title] => FLEXIBLE SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 17/333165
[patent_app_country] => US
[patent_app_date] => 2021-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6796
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -9
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17333165
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/333165 | Flexible substrate | May 27, 2021 | Issued |
Array
(
[id] => 17956687
[patent_doc_number] => 11482802
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-10-25
[patent_title] => High speed traceless interconnect
[patent_app_type] => utility
[patent_app_number] => 17/333925
[patent_app_country] => US
[patent_app_date] => 2021-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 12
[patent_no_of_words] => 5628
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17333925
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/333925 | High speed traceless interconnect | May 27, 2021 | Issued |
Array
(
[id] => 18010700
[patent_doc_number] => 20220369467
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-11-17
[patent_title] => CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/330982
[patent_app_country] => US
[patent_app_date] => 2021-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3045
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -9
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17330982
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/330982 | Circuit board, method for manufacturing the same | May 25, 2021 | Issued |
Array
(
[id] => 18595084
[patent_doc_number] => 11744006
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-08-29
[patent_title] => Method and design of high-performance interconnects with improved signal integrity
[patent_app_type] => utility
[patent_app_number] => 17/329285
[patent_app_country] => US
[patent_app_date] => 2021-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5465
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17329285
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/329285 | Method and design of high-performance interconnects with improved signal integrity | May 24, 2021 | Issued |
Array
(
[id] => 17732392
[patent_doc_number] => 11388811
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2022-07-12
[patent_title] => Heat-dissipating substrate structure with built-in conductive circuits
[patent_app_type] => utility
[patent_app_number] => 17/326359
[patent_app_country] => US
[patent_app_date] => 2021-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 3046
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17326359
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/326359 | Heat-dissipating substrate structure with built-in conductive circuits | May 20, 2021 | Issued |
Array
(
[id] => 18458662
[patent_doc_number] => 20230199944
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-22
[patent_title] => CIRCUIT BOARD
[patent_app_type] => utility
[patent_app_number] => 17/926681
[patent_app_country] => US
[patent_app_date] => 2021-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8353
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17926681
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/926681 | Circuit board | May 20, 2021 | Issued |
Array
(
[id] => 18475415
[patent_doc_number] => 20230209703
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-29
[patent_title] => Method for manufacturing a component
[patent_app_type] => utility
[patent_app_number] => 17/927204
[patent_app_country] => US
[patent_app_date] => 2021-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7236
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -12
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17927204
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/927204 | Method for manufacturing a component | May 20, 2021 | Abandoned |
Array
(
[id] => 17731213
[patent_doc_number] => 11387617
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-07-12
[patent_title] => Systems and methods for providing a soldered interface on a printed circuit board having a blind feature
[patent_app_type] => utility
[patent_app_number] => 17/319993
[patent_app_country] => US
[patent_app_date] => 2021-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 42
[patent_no_of_words] => 9128
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17319993
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/319993 | Systems and methods for providing a soldered interface on a printed circuit board having a blind feature | May 12, 2021 | Issued |
Array
(
[id] => 17057617
[patent_doc_number] => 20210267051
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-08-26
[patent_title] => RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS
[patent_app_type] => utility
[patent_app_number] => 17/319396
[patent_app_country] => US
[patent_app_date] => 2021-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13327
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17319396
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/319396 | Resin multilayer substrate and electronic apparatus | May 12, 2021 | Issued |
Array
(
[id] => 17774051
[patent_doc_number] => 11406024
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-08-02
[patent_title] => Multi-layer circuit board with traces thicker than a circuit board
[patent_app_type] => utility
[patent_app_number] => 17/317203
[patent_app_country] => US
[patent_app_date] => 2021-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 7610
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 52
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17317203
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/317203 | Multi-layer circuit board with traces thicker than a circuit board | May 10, 2021 | Issued |