
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 14492047
[patent_doc_number] => 10332824
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-06-25
[patent_title] => Lead frame
[patent_app_type] => utility
[patent_app_number] => 16/105756
[patent_app_country] => US
[patent_app_date] => 2018-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 20
[patent_no_of_words] => 9879
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16105756
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/105756 | Lead frame | Aug 19, 2018 | Issued |
Array
(
[id] => 14168213
[patent_doc_number] => 10258092
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-04-16
[patent_title] => Garments having stretchable and conductive ink
[patent_app_type] => utility
[patent_app_number] => 16/057712
[patent_app_country] => US
[patent_app_date] => 2018-08-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 31
[patent_figures_cnt] => 71
[patent_no_of_words] => 58988
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 310
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16057712
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/057712 | Garments having stretchable and conductive ink | Aug 6, 2018 | Issued |
Array
(
[id] => 17039158
[patent_doc_number] => 11096278
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-08-17
[patent_title] => Ceramic circuit board
[patent_app_type] => utility
[patent_app_number] => 16/636239
[patent_app_country] => US
[patent_app_date] => 2018-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5577
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16636239
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/636239 | Ceramic circuit board | Jul 29, 2018 | Issued |
Array
(
[id] => 13924289
[patent_doc_number] => 10206285
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2019-02-12
[patent_title] => Stackable via package and method
[patent_app_type] => utility
[patent_app_number] => 16/042312
[patent_app_country] => US
[patent_app_date] => 2018-07-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 28
[patent_no_of_words] => 7510
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 209
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16042312
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/042312 | Stackable via package and method | Jul 22, 2018 | Issued |
Array
(
[id] => 15972747
[patent_doc_number] => 20200170125
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-05-28
[patent_title] => Structure Including Electroconductive Pattern Regions, Method for Producing Same, Stack, Method for Producing Same, and Copper Wiring
[patent_app_type] => utility
[patent_app_number] => 16/631715
[patent_app_country] => US
[patent_app_date] => 2018-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 27449
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -29
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16631715
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/631715 | Structure including electroconductive pattern regions, method for producing same, stack, method for producing same, and copper wiring | Jul 17, 2018 | Issued |
Array
(
[id] => 14401701
[patent_doc_number] => 10314162
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2019-06-04
[patent_title] => Apparatuses and methods for improved network connections
[patent_app_type] => utility
[patent_app_number] => 16/034492
[patent_app_country] => US
[patent_app_date] => 2018-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4710
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 188
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16034492
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/034492 | Apparatuses and methods for improved network connections | Jul 12, 2018 | Issued |
Array
(
[id] => 15019013
[patent_doc_number] => 10455689
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-10-22
[patent_title] => Mating backplane for high speed, high density electrical connector
[patent_app_type] => utility
[patent_app_number] => 16/032284
[patent_app_country] => US
[patent_app_date] => 2018-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 27
[patent_no_of_words] => 15934
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16032284
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/032284 | Mating backplane for high speed, high density electrical connector | Jul 10, 2018 | Issued |
Array
(
[id] => 15372983
[patent_doc_number] => 20200022256
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-01-16
[patent_title] => PREPARATION METHOD OF FLEXIBLE TRANSPARENT CIRCUIT
[patent_app_type] => utility
[patent_app_number] => 16/031088
[patent_app_country] => US
[patent_app_date] => 2018-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4075
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16031088
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/031088 | Preparation method of flexible transparent circuit | Jul 9, 2018 | Issued |
Array
(
[id] => 15401631
[patent_doc_number] => 10541479
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2020-01-21
[patent_title] => Interconnection including a cable assembly and a board assembly, a board assembly for an interconnection and a method for making an interconnection
[patent_app_type] => utility
[patent_app_number] => 16/029693
[patent_app_country] => US
[patent_app_date] => 2018-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 25
[patent_no_of_words] => 11045
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16029693
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/029693 | Interconnection including a cable assembly and a board assembly, a board assembly for an interconnection and a method for making an interconnection | Jul 8, 2018 | Issued |
Array
(
[id] => 15173535
[patent_doc_number] => 10492296
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-11-26
[patent_title] => Conductive substrate and method for manufacturing same
[patent_app_type] => utility
[patent_app_number] => 16/030423
[patent_app_country] => US
[patent_app_date] => 2018-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 4552
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16030423
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/030423 | Conductive substrate and method for manufacturing same | Jul 8, 2018 | Issued |
Array
(
[id] => 13835371
[patent_doc_number] => 20190021170
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2019-01-17
[patent_title] => GLASS SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 16/030216
[patent_app_country] => US
[patent_app_date] => 2018-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4135
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 151
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16030216
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/030216 | Glass substrate | Jul 8, 2018 | Issued |
Array
(
[id] => 16836849
[patent_doc_number] => 11013124
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2021-05-18
[patent_title] => Printed circuit board and method of manufacturing printed circuit board
[patent_app_type] => utility
[patent_app_number] => 16/648399
[patent_app_country] => US
[patent_app_date] => 2018-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 8126
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16648399
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/648399 | Printed circuit board and method of manufacturing printed circuit board | Jun 24, 2018 | Issued |
Array
(
[id] => 16618989
[patent_doc_number] => 20210037642
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-02-04
[patent_title] => FLEXIBLE PRINTED CIRCUIT BOARD
[patent_app_type] => utility
[patent_app_number] => 16/618253
[patent_app_country] => US
[patent_app_date] => 2018-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6618
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -9
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16618253
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/618253 | Flexible printed circuit board | Jun 24, 2018 | Issued |
Array
(
[id] => 13633405
[patent_doc_number] => 20180368257
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-12-20
[patent_title] => SUBSTRATE FOR RECEIVING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A SUBSTRATE AND A METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
[patent_app_type] => utility
[patent_app_number] => 16/011689
[patent_app_country] => US
[patent_app_date] => 2018-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6354
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 41
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16011689
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/011689 | SUBSTRATE FOR RECEIVING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A SUBSTRATE AND A METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY | Jun 18, 2018 | Abandoned |
Array
(
[id] => 14859151
[patent_doc_number] => 10418310
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-09-17
[patent_title] => BGA package substrate and method of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 16/006895
[patent_app_country] => US
[patent_app_date] => 2018-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 30
[patent_no_of_words] => 4023
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16006895
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/006895 | BGA package substrate and method of manufacturing the same | Jun 12, 2018 | Issued |
Array
(
[id] => 15877481
[patent_doc_number] => 20200146144
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2020-05-07
[patent_title] => METHOD FOR MANUFACTURING CERAMIC-METAL LAYER ASSEMBLY, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD, AND METAL-BOARD-JOINED CERAMIC BASE MATERIAL BOARD
[patent_app_type] => utility
[patent_app_number] => 16/616136
[patent_app_country] => US
[patent_app_date] => 2018-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7880
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16616136
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/616136 | Method for manufacturing ceramic-metal layer assembly, method for manufacturing ceramic circuit board, and metal-board-joined ceramic base material board | Jun 10, 2018 | Issued |
Array
(
[id] => 14336687
[patent_doc_number] => 10299387
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-05-21
[patent_title] => Substrate on which electronic component is soldered, electronic device, method for soldering electronic component
[patent_app_type] => utility
[patent_app_number] => 15/984458
[patent_app_country] => US
[patent_app_date] => 2018-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 21
[patent_no_of_words] => 6164
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15984458
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/984458 | Substrate on which electronic component is soldered, electronic device, method for soldering electronic component | May 20, 2018 | Issued |
Array
(
[id] => 13571139
[patent_doc_number] => 20180337117
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-11-22
[patent_title] => WIRING SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 15/978500
[patent_app_country] => US
[patent_app_date] => 2018-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8251
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -3
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15978500
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/978500 | Wiring substrate | May 13, 2018 | Issued |
Array
(
[id] => 16308541
[patent_doc_number] => 10777346
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2020-09-15
[patent_title] => Circuit assembly
[patent_app_type] => utility
[patent_app_number] => 16/615842
[patent_app_country] => US
[patent_app_date] => 2018-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 5322
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 227
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16615842
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/615842 | Circuit assembly | May 8, 2018 | Issued |
Array
(
[id] => 17234224
[patent_doc_number] => 20210360781
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-11-18
[patent_title] => STRETCHABLE CONDUCTIVE INK PACKAGE BASED ON DUAL-SYSTEM POLYSILOXANE
[patent_app_type] => utility
[patent_app_number] => 17/053234
[patent_app_country] => US
[patent_app_date] => 2018-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3525
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17053234
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/053234 | STRETCHABLE CONDUCTIVE INK PACKAGE BASED ON DUAL-SYSTEM POLYSILOXANE | May 7, 2018 | Abandoned |