
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10828188
[patent_doc_number] => 20160174358
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-06-16
[patent_title] => 'FLEXIBLE DEVICE AND FABRICATION METHOD OF FLEXIBLE DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/620214
[patent_app_country] => US
[patent_app_date] => 2015-02-12
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14620214
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Array
(
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[patent_doc_number] => 20160225718
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[patent_kind] => A1
[patent_issue_date] => 2016-08-04
[patent_title] => 'DEVICE INCLUDING A METALLIZATION LAYER AND METHOD OF MANUFACTURING A DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/608884
[patent_app_country] => US
[patent_app_date] => 2015-01-29
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Array
(
[id] => 10246250
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[patent_kind] => A1
[patent_issue_date] => 2015-05-14
[patent_title] => 'PRINTED CIRCUIT BOARDS INCLUDING STRIP-LINE CIRCUITRY AND METHODS OF MANUFACTURING SAME'
[patent_app_type] => utility
[patent_app_number] => 14/603548
[patent_app_country] => US
[patent_app_date] => 2015-01-23
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Array
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[id] => 10518784
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[patent_issue_date] => 2016-01-26
[patent_title] => 'Semiconductor element'
[patent_app_type] => utility
[patent_app_number] => 14/601541
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[patent_app_date] => 2015-01-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 70
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Array
(
[id] => 10782031
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[patent_kind] => A1
[patent_issue_date] => 2016-05-05
[patent_title] => 'FLEXIBLE AND TRANSPARENT ELECTRODE AND MANUFACTURING METHOD THEREOF'
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Array
(
[id] => 10239428
[patent_doc_number] => 20150124423
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[patent_kind] => A1
[patent_issue_date] => 2015-05-07
[patent_title] => 'METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/594710
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Array
(
[id] => 10998959
[patent_doc_number] => 20160195907
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-07-07
[patent_title] => 'Micro Socket-Based Personal Computer'
[patent_app_type] => utility
[patent_app_number] => 14/588883
[patent_app_country] => US
[patent_app_date] => 2015-01-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[patent_no_of_words] => 546
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/588883 | Micro Socket-Based Personal Computer | Jan 1, 2015 | Abandoned |
Array
(
[id] => 11680004
[patent_doc_number] => 09678532
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[patent_kind] => B2
[patent_issue_date] => 2017-06-13
[patent_title] => 'Capacitive touch sensitive housing and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 14/584355
[patent_app_country] => US
[patent_app_date] => 2014-12-29
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/584355 | Capacitive touch sensitive housing and method for making the same | Dec 28, 2014 | Issued |
Array
(
[id] => 12103870
[patent_doc_number] => 09860988
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-01-02
[patent_title] => 'Solder contacts for socket assemblies'
[patent_app_type] => utility
[patent_app_number] => 14/780501
[patent_app_country] => US
[patent_app_date] => 2014-12-20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/780501 | Solder contacts for socket assemblies | Dec 19, 2014 | Issued |
Array
(
[id] => 10811187
[patent_doc_number] => 20160157346
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[patent_kind] => A1
[patent_issue_date] => 2016-06-02
[patent_title] => 'Printed Circuit Board, Ball Grid Array Package and Wiring Method of Printed Circuit Board'
[patent_app_type] => utility
[patent_app_number] => 14/571621
[patent_app_country] => US
[patent_app_date] => 2014-12-16
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[patent_drawing_sheets_cnt] => 11
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/571621 | Printed circuit board, ball grid array package and wiring method of printed circuit board | Dec 15, 2014 | Issued |
Array
(
[id] => 10585504
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[patent_issue_date] => 2016-04-05
[patent_title] => 'Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component'
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Array
(
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[patent_title] => 'Electronic module'
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Array
(
[id] => 11861790
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[patent_title] => 'Sintered body for varistor, multilayer substrate using same, and production method for these'
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Array
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[patent_title] => 'Conductive structure, touch panel, and method for manufacturing same'
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Array
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[patent_title] => 'Graphite sheet to redirect SMT components during thermal exposure'
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Array
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Array
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[patent_title] => 'COMPOSITION AND METHOD FOR FORMING CONDUCTIVE PATTERN, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON'
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Array
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Array
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