
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9767338
[patent_doc_number] => 20140291000
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-10-02
[patent_title] => 'CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD HAVING BUILT-IN CERAMIC ELECTRONIC COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 14/223258
[patent_app_country] => US
[patent_app_date] => 2014-03-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6254
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14223258
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/223258 | Ceramic electronic component and wiring board having built-in ceramic electronic component | Mar 23, 2014 | Issued |
Array
(
[id] => 9726761
[patent_doc_number] => 20140262467
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-18
[patent_title] => 'CONTACT SURFACE FOR A PIN HOLE'
[patent_app_type] => utility
[patent_app_number] => 14/215651
[patent_app_country] => US
[patent_app_date] => 2014-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1923
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14215651
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/215651 | CONTACT SURFACE FOR A PIN HOLE | Mar 16, 2014 | Abandoned |
Array
(
[id] => 9861182
[patent_doc_number] => 20150041199
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-02-12
[patent_title] => 'MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN'
[patent_app_type] => utility
[patent_app_number] => 14/213185
[patent_app_country] => US
[patent_app_date] => 2014-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 8857
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14213185
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/213185 | Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein | Mar 13, 2014 | Issued |
Array
(
[id] => 10689515
[patent_doc_number] => 20160035660
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-04
[patent_title] => 'BONDING BODY, POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 14/775137
[patent_app_country] => US
[patent_app_date] => 2014-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 16896
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14775137
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/775137 | Bonding body, power module substrate, and heat-sink-attached power module substrate | Mar 13, 2014 | Issued |
Array
(
[id] => 9767321
[patent_doc_number] => 20140290982
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-10-02
[patent_title] => 'PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/208752
[patent_app_country] => US
[patent_app_date] => 2014-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 9236
[patent_no_of_claims] => 27
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14208752
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/208752 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME | Mar 12, 2014 | Abandoned |
Array
(
[id] => 11302434
[patent_doc_number] => 09510458
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-11-29
[patent_title] => 'High aspect ratio traces, circuits, and methods for manufacturing and using the same'
[patent_app_type] => utility
[patent_app_number] => 14/207405
[patent_app_country] => US
[patent_app_date] => 2014-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 3348
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14207405
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/207405 | High aspect ratio traces, circuits, and methods for manufacturing and using the same | Mar 11, 2014 | Issued |
Array
(
[id] => 9753390
[patent_doc_number] => 20140284090
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-25
[patent_title] => 'THIN FILM SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/206064
[patent_app_country] => US
[patent_app_date] => 2014-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2902
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/206064 | THIN FILM SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | Mar 11, 2014 | Abandoned |
Array
(
[id] => 9732810
[patent_doc_number] => 20140268520
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-18
[patent_title] => 'METHOD OF MANUFACTURING MEMBER WITH SEALING MATERIAL LAYER, MEMBER WITH SEALING MATERIAL LAYER, AND MANUFACTURING APPARATUS'
[patent_app_type] => utility
[patent_app_number] => 14/206060
[patent_app_country] => US
[patent_app_date] => 2014-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 12616
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14206060
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/206060 | METHOD OF MANUFACTURING MEMBER WITH SEALING MATERIAL LAYER, MEMBER WITH SEALING MATERIAL LAYER, AND MANUFACTURING APPARATUS | Mar 11, 2014 | Abandoned |
Array
(
[id] => 10691487
[patent_doc_number] => 20160037632
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-04
[patent_title] => 'LAMINATE, CONDUCTIVE PATTERN, AND METHOD FOR PRODUCING LAMINATE'
[patent_app_type] => utility
[patent_app_number] => 14/775576
[patent_app_country] => US
[patent_app_date] => 2014-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 21379
[patent_no_of_claims] => 11
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14775576
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/775576 | Laminate, conductive pattern, and method for producing laminate | Mar 5, 2014 | Issued |
Array
(
[id] => 9851182
[patent_doc_number] => 08952919
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-02-10
[patent_title] => 'Capacitive touch sensitive housing and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 14/196107
[patent_app_country] => US
[patent_app_date] => 2014-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 3114
[patent_no_of_claims] => 20
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14196107
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/196107 | Capacitive touch sensitive housing and method for making the same | Mar 3, 2014 | Issued |
Array
(
[id] => 10043617
[patent_doc_number] => 09084341
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-14
[patent_title] => 'Fabrication method of packaging substrate'
[patent_app_type] => utility
[patent_app_number] => 14/190428
[patent_app_country] => US
[patent_app_date] => 2014-02-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3632
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/190428 | Fabrication method of packaging substrate | Feb 25, 2014 | Issued |
Array
(
[id] => 9944592
[patent_doc_number] => 08993893
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-03-31
[patent_title] => 'Multilayer substrate'
[patent_app_type] => utility
[patent_app_number] => 14/183558
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/183558 | Multilayer substrate | Feb 18, 2014 | Issued |
Array
(
[id] => 11233600
[patent_doc_number] => 09460832
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-10-04
[patent_title] => 'Sleeve for a power cable'
[patent_app_type] => utility
[patent_app_number] => 14/765440
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Array
(
[id] => 10323499
[patent_doc_number] => 20150208502
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[patent_kind] => A1
[patent_issue_date] => 2015-07-23
[patent_title] => 'THROUGH PRINTED CIRCUIT BOARD (PCB) VIAS'
[patent_app_type] => utility
[patent_app_number] => 14/161228
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[patent_app_date] => 2014-01-22
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/161228 | Through printed circuit board (PCB) vias | Jan 21, 2014 | Issued |
Array
(
[id] => 10127065
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Array
(
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Array
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Array
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Array
(
[id] => 9631253
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[patent_title] => 'WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/151374 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME | Jan 8, 2014 | Abandoned |
Array
(
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[patent_title] => 'PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/149831 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | Jan 7, 2014 | Abandoned |