
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10851388
[patent_doc_number] => 08878071
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-11-04
[patent_title] => 'Integrated device with defined heat flow'
[patent_app_type] => utility
[patent_app_number] => 13/352151
[patent_app_country] => US
[patent_app_date] => 2012-01-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3857
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13352151
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/352151 | Integrated device with defined heat flow | Jan 16, 2012 | Issued |
Array
(
[id] => 10083605
[patent_doc_number] => 09120944
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-09-01
[patent_title] => 'Copper particulate dispersion, conductive film forming method and circuit board'
[patent_app_type] => utility
[patent_app_number] => 14/346534
[patent_app_country] => US
[patent_app_date] => 2012-01-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/346534 | Copper particulate dispersion, conductive film forming method and circuit board | Jan 3, 2012 | Issued |
Array
(
[id] => 9389697
[patent_doc_number] => 08686296
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-04-01
[patent_title] => 'Electronic device having heat dissipation device'
[patent_app_type] => utility
[patent_app_number] => 13/340614
[patent_app_country] => US
[patent_app_date] => 2011-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13340614
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/340614 | Electronic device having heat dissipation device | Dec 28, 2011 | Issued |
Array
(
[id] => 9103967
[patent_doc_number] => 20130277098
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-24
[patent_title] => 'MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 13/995208
[patent_app_country] => US
[patent_app_date] => 2011-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 8878
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/995208 | Mounted structure and manufacturing method of mounted structure | Dec 20, 2011 | Issued |
Array
(
[id] => 9496912
[patent_doc_number] => 08735732
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-05-27
[patent_title] => 'Multilayer substrate'
[patent_app_type] => utility
[patent_app_number] => 13/331306
[patent_app_country] => US
[patent_app_date] => 2011-12-20
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13331306
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/331306 | Multilayer substrate | Dec 19, 2011 | Issued |
Array
(
[id] => 8862632
[patent_doc_number] => 20130146336
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-06-13
[patent_title] => 'PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 13/323205
[patent_app_country] => US
[patent_app_date] => 2011-12-12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/323205 | Packaging substrate and fabrication method thereof | Dec 11, 2011 | Issued |
Array
(
[id] => 9428024
[patent_doc_number] => 08704102
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-04-22
[patent_title] => 'Printed flexible multilayer twisted-pair shielded high speed data cable'
[patent_app_type] => utility
[patent_app_number] => 13/315713
[patent_app_country] => US
[patent_app_date] => 2011-12-09
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13315713
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/315713 | Printed flexible multilayer twisted-pair shielded high speed data cable | Dec 8, 2011 | Issued |
Array
(
[id] => 8035793
[patent_doc_number] => 20120067633
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-22
[patent_title] => 'MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 13/307213
[patent_app_country] => US
[patent_app_date] => 2011-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
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[patent_no_of_words] => 17072
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[pdf_file] => publications/A1/0067/20120067633.pdf
[firstpage_image] =>[orig_patent_app_number] => 13307213
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/307213 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board | Nov 29, 2011 | Issued |
Array
(
[id] => 8838309
[patent_doc_number] => 20130133937
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-05-30
[patent_title] => 'MESH PLANES WITH ALTERNATING SPACES FOR MULTI-LAYERED CERAMIC PACKAGES'
[patent_app_type] => utility
[patent_app_number] => 13/305482
[patent_app_country] => US
[patent_app_date] => 2011-11-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/305482 | Mesh planes with alternating spaces for multi-layered ceramic packages | Nov 27, 2011 | Issued |
Array
(
[id] => 8680079
[patent_doc_number] => 20130048363
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-02-28
[patent_title] => 'CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 13/304374
[patent_app_country] => US
[patent_app_date] => 2011-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 545
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13304374
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/304374 | CIRCUIT BOARD | Nov 23, 2011 | Abandoned |
Array
(
[id] => 9510021
[patent_doc_number] => 20140146511
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-05-29
[patent_title] => 'OPTRONIC WINDOW TRANSPARENT TO IR AND REFLECTING RF'
[patent_app_type] => utility
[patent_app_number] => 13/885651
[patent_app_country] => US
[patent_app_date] => 2011-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13885651
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/885651 | Optronic window transparent to IR and reflecting RF | Nov 14, 2011 | Issued |
Array
(
[id] => 9608622
[patent_doc_number] => 08785790
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-07-22
[patent_title] => 'High strength through-substrate vias'
[patent_app_type] => utility
[patent_app_number] => 13/293698
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/293698 | High strength through-substrate vias | Nov 9, 2011 | Issued |
Array
(
[id] => 8367767
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[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-08-30
[patent_title] => 'CAPACITIVE TOUCH SENSITIVE HOUSING AND METHOD FOR MAKING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/285219
[patent_app_country] => US
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13285219
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/285219 | Capacitive touch sensitive housing and method for making the same | Oct 30, 2011 | Issued |
Array
(
[id] => 9711201
[patent_doc_number] => 08835774
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-09-16
[patent_title] => 'Circuit board assembly and method of assembling circuit boards'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/283824 | Circuit board assembly and method of assembling circuit boards | Oct 27, 2011 | Issued |
Array
(
[id] => 8704822
[patent_doc_number] => 20130062111
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[patent_title] => 'STACKED SUBSTRATE MODULE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/282554 | STACKED SUBSTRATE MODULE | Oct 26, 2011 | Abandoned |
Array
(
[id] => 10146719
[patent_doc_number] => 09179543
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[patent_kind] => B2
[patent_issue_date] => 2015-11-03
[patent_title] => 'Flexible LED device with wire bond free die'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/881466 | Flexible LED device with wire bond free die | Oct 26, 2011 | Issued |
Array
(
[id] => 9064241
[patent_doc_number] => 20130255997
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[patent_kind] => A1
[patent_issue_date] => 2013-10-03
[patent_title] => 'PROCESSES FOR PRODUCING CONDUCTIVE AND/OR PIEZORESISTIVE TRACES ON POLYMERIC SUBSTRATES'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/881150 | PROCESSES FOR PRODUCING CONDUCTIVE AND/OR PIEZORESISTIVE TRACES ON POLYMERIC SUBSTRATES | Oct 25, 2011 | Abandoned |
Array
(
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[patent_title] => 'Coreless package substrate and fabrication method thereof'
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/280682 | Wiring substrate, electronic device, and method of manufacturing wiring substrate | Oct 24, 2011 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/281264 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | Oct 24, 2011 | Abandoned |