
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6450809
[patent_doc_number] => 20100089624
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-15
[patent_title] => 'MULTILAYER CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/523813
[patent_app_country] => US
[patent_app_date] => 2008-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4238
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20100089624.pdf
[firstpage_image] =>[orig_patent_app_number] => 12523813
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/523813 | MULTILAYER CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING THE SAME | Feb 11, 2008 | Abandoned |
Array
(
[id] => 6436507
[patent_doc_number] => 20100282497
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-11-11
[patent_title] => 'CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 12/812600
[patent_app_country] => US
[patent_app_date] => 2008-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0282/20100282497.pdf
[firstpage_image] =>[orig_patent_app_number] => 12812600
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/812600 | CIRCUIT BOARD | Feb 6, 2008 | Abandoned |
Array
(
[id] => 4952154
[patent_doc_number] => 20080185178
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-07
[patent_title] => 'Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment'
[patent_app_type] => utility
[patent_app_number] => 12/011725
[patent_app_country] => US
[patent_app_date] => 2008-01-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 8650
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[pdf_file] => publications/A1/0185/20080185178.pdf
[firstpage_image] =>[orig_patent_app_number] => 12011725
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/011725 | Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment | Jan 28, 2008 | Abandoned |
Array
(
[id] => 6419015
[patent_doc_number] => 20100101843
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-29
[patent_title] => 'INSULATING RESIN SHEET LAMINATE AND MULTI-LAYER PRINTED CIRCUIT BOARD INCLUDING INSULATING RESIN SHEET LAMINATE'
[patent_app_type] => utility
[patent_app_number] => 12/523127
[patent_app_country] => US
[patent_app_date] => 2008-01-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 12007
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 1
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[pdf_file] => publications/A1/0101/20100101843.pdf
[firstpage_image] =>[orig_patent_app_number] => 12523127
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/523127 | Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate | Jan 15, 2008 | Issued |
Array
(
[id] => 22153
[patent_doc_number] => 07799615
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-21
[patent_title] => 'Power converter package and thermal management'
[patent_app_type] => utility
[patent_app_number] => 12/014662
[patent_app_country] => US
[patent_app_date] => 2008-01-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
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[patent_no_of_words] => 9456
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/799/07799615.pdf
[firstpage_image] =>[orig_patent_app_number] => 12014662
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/014662 | Power converter package and thermal management | Jan 14, 2008 | Issued |
Array
(
[id] => 4912518
[patent_doc_number] => 20080093117
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-24
[patent_title] => 'MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/968700
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[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 7654
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[firstpage_image] =>[orig_patent_app_number] => 11968700
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/968700 | Multilayer circuit board and manufacturing method thereof | Jan 2, 2008 | Issued |
Array
(
[id] => 123766
[patent_doc_number] => 07705246
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2010-04-27
[patent_title] => 'Compact differential signal via structure'
[patent_app_type] => utility
[patent_app_number] => 11/965811
[patent_app_country] => US
[patent_app_date] => 2007-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 11
[patent_no_of_words] => 1826
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/705/07705246.pdf
[firstpage_image] =>[orig_patent_app_number] => 11965811
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/965811 | Compact differential signal via structure | Dec 27, 2007 | Issued |
Array
(
[id] => 4963152
[patent_doc_number] => 20080105972
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-08
[patent_title] => 'Method for making a circuit plate'
[patent_app_type] => utility
[patent_app_number] => 12/004610
[patent_app_country] => US
[patent_app_date] => 2007-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2658
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
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[pdf_file] => publications/A1/0105/20080105972.pdf
[firstpage_image] =>[orig_patent_app_number] => 12004610
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/004610 | Method for making a circuit plate | Dec 20, 2007 | Abandoned |
Array
(
[id] => 5293219
[patent_doc_number] => 20090008145
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'EMBEDDED CIRCUIT STRUCTURE AND FABRICATING PROCESS OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/958920
[patent_app_country] => US
[patent_app_date] => 2007-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 4125
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[pdf_file] => publications/A1/0008/20090008145.pdf
[firstpage_image] =>[orig_patent_app_number] => 11958920
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/958920 | Embedded circuit structure and fabricating process of the same | Dec 17, 2007 | Issued |
Array
(
[id] => 4762260
[patent_doc_number] => 20080173469
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-24
[patent_title] => 'Multilayer wiring board'
[patent_app_type] => utility
[patent_app_number] => 12/000730
[patent_app_country] => US
[patent_app_date] => 2007-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[pdf_file] => publications/A1/0173/20080173469.pdf
[firstpage_image] =>[orig_patent_app_number] => 12000730
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/000730 | Multilayer wiring board | Dec 16, 2007 | Issued |
Array
(
[id] => 4742856
[patent_doc_number] => 20080087457
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-17
[patent_title] => 'Ceramic Package in Which Far End Noise is Reduced Using Capacitive Cancellation by Offset Wiring'
[patent_app_type] => utility
[patent_app_number] => 11/951646
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[patent_app_date] => 2007-12-06
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[pdf_file] => publications/A1/0087/20080087457.pdf
[firstpage_image] =>[orig_patent_app_number] => 11951646
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/951646 | Ceramic Package in Which Far End Noise is Reduced Using Capacitive Cancellation by Offset Wiring | Dec 5, 2007 | Abandoned |
Array
(
[id] => 4866989
[patent_doc_number] => 20080146048
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-19
[patent_title] => 'PRINTED CIRCUIT BOARD CONNECTION'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11950825
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/950825 | PRINTED CIRCUIT BOARD CONNECTION | Dec 4, 2007 | Abandoned |
Array
(
[id] => 4788890
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Array
(
[id] => 8283171
[patent_doc_number] => 08217275
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[patent_kind] => B2
[patent_issue_date] => 2012-07-10
[patent_title] => 'Sealing material and mounting method using the sealing material'
[patent_app_type] => utility
[patent_app_number] => 12/517311
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Array
(
[id] => 4918636
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/945511 | Method for making cable with a conductive bump array, and method for connecting the cable to a task object | Nov 26, 2007 | Issued |
Array
(
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/939804 | Component with bonding adhesive | Nov 13, 2007 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/938635 | Printed wiring board for mounting components | Nov 11, 2007 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/979833 | Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes | Nov 7, 2007 | Issued |