
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4461969
[patent_doc_number] => 07880094
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-01
[patent_title] => 'Differential signal layout printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/790617
[patent_app_country] => US
[patent_app_date] => 2007-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 1958
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/880/07880094.pdf
[firstpage_image] =>[orig_patent_app_number] => 11790617
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/790617 | Differential signal layout printed circuit board | Apr 25, 2007 | Issued |
Array
(
[id] => 4855822
[patent_doc_number] => 20080264672
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-30
[patent_title] => 'Photoimprintable Low Dielectric Constant Material and Method for Making and Using Same'
[patent_app_type] => utility
[patent_app_number] => 11/740410
[patent_app_country] => US
[patent_app_date] => 2007-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 11756
[patent_no_of_claims] => 34
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0264/20080264672.pdf
[firstpage_image] =>[orig_patent_app_number] => 11740410
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/740410 | Photoimprintable Low Dielectric Constant Material and Method for Making and Using Same | Apr 25, 2007 | Abandoned |
Array
(
[id] => 4722991
[patent_doc_number] => 20080202807
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-28
[patent_title] => 'SHIELDED FLEXIBLE CIRCUITS AND METHODS FOR MANUFACTURING SAME'
[patent_app_type] => utility
[patent_app_number] => 11/739550
[patent_app_country] => US
[patent_app_date] => 2007-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 28
[patent_no_of_words] => 6949
[patent_no_of_claims] => 38
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[pdf_file] => publications/A1/0202/20080202807.pdf
[firstpage_image] =>[orig_patent_app_number] => 11739550
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/739550 | Shielded flexible circuits and methods for manufacturing same | Apr 23, 2007 | Issued |
Array
(
[id] => 7519143
[patent_doc_number] => 07973246
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-05
[patent_title] => 'Electronic component'
[patent_app_type] => utility
[patent_app_number] => 11/790232
[patent_app_country] => US
[patent_app_date] => 2007-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 36
[patent_figures_cnt] => 83
[patent_no_of_words] => 22244
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/973/07973246.pdf
[firstpage_image] =>[orig_patent_app_number] => 11790232
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/790232 | Electronic component | Apr 23, 2007 | Issued |
Array
(
[id] => 82571
[patent_doc_number] => 07745734
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-29
[patent_title] => 'Ceramic multilayer substrate'
[patent_app_type] => utility
[patent_app_number] => 11/738637
[patent_app_country] => US
[patent_app_date] => 2007-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 10
[patent_no_of_words] => 6787
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 139
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/745/07745734.pdf
[firstpage_image] =>[orig_patent_app_number] => 11738637
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/738637 | Ceramic multilayer substrate | Apr 22, 2007 | Issued |
Array
(
[id] => 5247170
[patent_doc_number] => 20070243404
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-18
[patent_title] => 'Glass circuit board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/785022
[patent_app_country] => US
[patent_app_date] => 2007-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 1743
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[pdf_file] => publications/A1/0243/20070243404.pdf
[firstpage_image] =>[orig_patent_app_number] => 11785022
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/785022 | Glass circuit board and manufacturing method thereof | Apr 12, 2007 | Abandoned |
Array
(
[id] => 5210163
[patent_doc_number] => 20070248747
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'Glass circuit board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/785025
[patent_app_country] => US
[patent_app_date] => 2007-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 2318
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 4
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0248/20070248747.pdf
[firstpage_image] =>[orig_patent_app_number] => 11785025
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/785025 | Glass circuit board and manufacturing method thereof | Apr 12, 2007 | Abandoned |
Array
(
[id] => 5177219
[patent_doc_number] => 20070178279
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-02
[patent_title] => 'HYBRID MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/734522
[patent_app_country] => US
[patent_app_date] => 2007-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 8140
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0178/20070178279.pdf
[firstpage_image] =>[orig_patent_app_number] => 11734522
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/734522 | Hybrid multilayer substrate and method for manufacturing the same | Apr 11, 2007 | Issued |
Array
(
[id] => 5088128
[patent_doc_number] => 20070227767
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-04
[patent_title] => 'Connecting device for eletronic components'
[patent_app_type] => utility
[patent_app_number] => 11/732002
[patent_app_country] => US
[patent_app_date] => 2007-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2768
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0227/20070227767.pdf
[firstpage_image] =>[orig_patent_app_number] => 11732002
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/732002 | Connecting device for electronic components | Apr 1, 2007 | Issued |
Array
(
[id] => 5122951
[patent_doc_number] => 20070235220
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'Printed circuit board using bump and method for manufacturing thereof'
[patent_app_type] => utility
[patent_app_number] => 11/727838
[patent_app_country] => US
[patent_app_date] => 2007-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5756
[patent_no_of_claims] => 19
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0235/20070235220.pdf
[firstpage_image] =>[orig_patent_app_number] => 11727838
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/727838 | Printed circuit board using bump and method for manufacturing thereof | Mar 27, 2007 | Issued |
Array
(
[id] => 4985420
[patent_doc_number] => 20070151757
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-05
[patent_title] => 'WIRING BOARD AND WIRING BOARD MODULE'
[patent_app_type] => utility
[patent_app_number] => 11/687319
[patent_app_country] => US
[patent_app_date] => 2007-03-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2676
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0151/20070151757.pdf
[firstpage_image] =>[orig_patent_app_number] => 11687319
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/687319 | Wiring board and wiring board module | Mar 15, 2007 | Issued |
Array
(
[id] => 4619472
[patent_doc_number] => 07999192
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-16
[patent_title] => 'Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards'
[patent_app_type] => utility
[patent_app_number] => 11/717634
[patent_app_country] => US
[patent_app_date] => 2007-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/999/07999192.pdf
[firstpage_image] =>[orig_patent_app_number] => 11717634
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/717634 | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards | Mar 13, 2007 | Issued |
Array
(
[id] => 4535751
[patent_doc_number] => 07872200
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-01-18
[patent_title] => 'Wired circuit board and connection structure between wired circuit boards'
[patent_app_type] => utility
[patent_app_number] => 11/717706
[patent_app_country] => US
[patent_app_date] => 2007-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/872/07872200.pdf
[firstpage_image] =>[orig_patent_app_number] => 11717706
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/717706 | Wired circuit board and connection structure between wired circuit boards | Mar 13, 2007 | Issued |
Array
(
[id] => 5258897
[patent_doc_number] => 20070212529
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-13
[patent_title] => 'Printed circuit board having metal core'
[patent_app_type] => utility
[patent_app_number] => 11/715905
[patent_app_country] => US
[patent_app_date] => 2007-03-09
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[pdf_file] => publications/A1/0212/20070212529.pdf
[firstpage_image] =>[orig_patent_app_number] => 11715905
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/715905 | Printed circuit board having metal core | Mar 8, 2007 | Abandoned |
Array
(
[id] => 5002654
[patent_doc_number] => 20070200220
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-30
[patent_title] => 'FLEXIBLE SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 11/678309
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11678309
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/678309 | FLEXIBLE SUBSTRATE | Feb 22, 2007 | Abandoned |
Array
(
[id] => 7553902
[patent_doc_number] => 08065796
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-29
[patent_title] => 'Method and apparatus for using flex circuit technology to create an electrode'
[patent_app_type] => utility
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[pdf_file] => patents/08/065/08065796.pdf
[firstpage_image] =>[orig_patent_app_number] => 11709635
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/709635 | Method and apparatus for using flex circuit technology to create an electrode | Feb 21, 2007 | Issued |
Array
(
[id] => 4796348
[patent_doc_number] => 20080007934
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-10
[patent_title] => 'Electronic device with EMI screen & packing process thereof'
[patent_app_type] => utility
[patent_app_number] => 11/706411
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/706411 | Electronic device with EMI screen and packing process thereof | Feb 14, 2007 | Issued |
Array
(
[id] => 4562676
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[patent_issue_date] => 2010-11-23
[patent_title] => 'Circuit board layout'
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[firstpage_image] =>[orig_patent_app_number] => 11706021
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/706021 | Circuit board layout | Feb 13, 2007 | Issued |
Array
(
[id] => 5250642
[patent_doc_number] => 20070132098
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[patent_kind] => A1
[patent_issue_date] => 2007-06-14
[patent_title] => 'ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC CONDUCTIVE BUMPS MADE OF THE ELASTIC CONDUCTIVE RESIN'
[patent_app_type] => utility
[patent_app_number] => 11/673904
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[firstpage_image] =>[orig_patent_app_number] => 11673904
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/673904 | Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin | Feb 11, 2007 | Issued |
Array
(
[id] => 7967903
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[pdf_file] => patents/07/939/07939935.pdf
[firstpage_image] =>[orig_patent_app_number] => 11701337
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/701337 | Electronic device substrate, electronic device and methods for fabricating the same | Jan 31, 2007 | Issued |