
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5827439
[patent_doc_number] => 20060062979
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-23
[patent_title] => 'Circuit board and a power module employing the same'
[patent_app_type] => utility
[patent_app_number] => 11/270202
[patent_app_country] => US
[patent_app_date] => 2005-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5714
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0062/20060062979.pdf
[firstpage_image] =>[orig_patent_app_number] => 11270202
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/270202 | Circuit board and a power module employing the same | Nov 8, 2005 | Issued |
Array
(
[id] => 4613892
[patent_doc_number] => 07989702
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-02
[patent_title] => 'Sealing-end structure for superconducting cable'
[patent_app_type] => utility
[patent_app_number] => 11/794806
[patent_app_country] => US
[patent_app_date] => 2005-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 8374
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[patent_words_short_claim] => 198
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/989/07989702.pdf
[firstpage_image] =>[orig_patent_app_number] => 11794806
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/794806 | Sealing-end structure for superconducting cable | Nov 3, 2005 | Issued |
Array
(
[id] => 5804576
[patent_doc_number] => 20060090928
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-04
[patent_title] => 'Printed wiring board for plasma display and process for producing the same'
[patent_app_type] => utility
[patent_app_number] => 11/267792
[patent_app_country] => US
[patent_app_date] => 2005-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 9750
[patent_no_of_claims] => 17
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0090/20060090928.pdf
[firstpage_image] =>[orig_patent_app_number] => 11267792
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/267792 | Printed wiring board for plasma display and process for producing the same | Nov 2, 2005 | Issued |
Array
(
[id] => 5805172
[patent_doc_number] => 20060091525
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-04
[patent_title] => 'Wiring board with semiconductor component'
[patent_app_type] => utility
[patent_app_number] => 11/265952
[patent_app_country] => US
[patent_app_date] => 2005-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 5563
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[pdf_file] => publications/A1/0091/20060091525.pdf
[firstpage_image] =>[orig_patent_app_number] => 11265952
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/265952 | Wiring board with semiconductor component | Nov 2, 2005 | Issued |
Array
(
[id] => 5807909
[patent_doc_number] => 20060094264
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-04
[patent_title] => 'Image forming apparatus and electronic apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/262982
[patent_app_country] => US
[patent_app_date] => 2005-11-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3942
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[pdf_file] => publications/A1/0094/20060094264.pdf
[firstpage_image] =>[orig_patent_app_number] => 11262982
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/262982 | Image forming apparatus and electronic apparatus | Oct 31, 2005 | Issued |
Array
(
[id] => 5740812
[patent_doc_number] => 20060086534
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-27
[patent_title] => 'METHOD OF EMBEDDING TAMPER PROOF LAYERS AND\nDISCRETE COMPONENTS INTO PRINTED CIRCUIT BOARD STACK-UP'
[patent_app_type] => utility
[patent_app_number] => 11/163609
[patent_app_country] => US
[patent_app_date] => 2005-10-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0086/20060086534.pdf
[firstpage_image] =>[orig_patent_app_number] => 11163609
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/163609 | Method of embedding tamper proof layers and discrete components into printed circuit board stack-up | Oct 24, 2005 | Issued |
Array
(
[id] => 5216790
[patent_doc_number] => 20070158101
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/597919
[patent_app_country] => US
[patent_app_date] => 2005-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 7432
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0158/20070158101.pdf
[firstpage_image] =>[orig_patent_app_number] => 10597919
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/597919 | Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same | Oct 19, 2005 | Issued |
Array
(
[id] => 5805191
[patent_doc_number] => 20060091544
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-04
[patent_title] => 'Wiring board and manufacturing method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/254312
[patent_app_country] => US
[patent_app_date] => 2005-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 4155
[patent_no_of_claims] => 14
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[pdf_file] => publications/A1/0091/20060091544.pdf
[firstpage_image] =>[orig_patent_app_number] => 11254312
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/254312 | Wiring board and manufacturing method therefor | Oct 18, 2005 | Issued |
Array
(
[id] => 5745218
[patent_doc_number] => 20060108142
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-25
[patent_title] => 'Vents with signal image for signal return path'
[patent_app_type] => utility
[patent_app_number] => 11/251745
[patent_app_country] => US
[patent_app_date] => 2005-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3797
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[pdf_file] => publications/A1/0108/20060108142.pdf
[firstpage_image] =>[orig_patent_app_number] => 11251745
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/251745 | Vents with signal image for signal return path | Oct 16, 2005 | Issued |
Array
(
[id] => 5712797
[patent_doc_number] => 20060076160
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-13
[patent_title] => 'Multilayer printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/247341
[patent_app_country] => US
[patent_app_date] => 2005-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0076/20060076160.pdf
[firstpage_image] =>[orig_patent_app_number] => 11247341
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/247341 | Multilayer printed circuit board | Oct 10, 2005 | Abandoned |
Array
(
[id] => 587758
[patent_doc_number] => 07442879
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-28
[patent_title] => 'Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate'
[patent_app_type] => utility
[patent_app_number] => 11/244180
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[pdf_file] => patents/07/442/07442879.pdf
[firstpage_image] =>[orig_patent_app_number] => 11244180
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/244180 | Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate | Oct 5, 2005 | Issued |
Array
(
[id] => 4762261
[patent_doc_number] => 20080173470
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[patent_kind] => A1
[patent_issue_date] => 2008-07-24
[patent_title] => 'Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards'
[patent_app_type] => utility
[patent_app_number] => 11/163034
[patent_app_country] => US
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[pdf_file] => publications/A1/0173/20080173470.pdf
[firstpage_image] =>[orig_patent_app_number] => 11163034
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/163034 | Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards | Oct 2, 2005 | Abandoned |
Array
(
[id] => 4449712
[patent_doc_number] => 07963030
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-06-21
[patent_title] => 'Multilayer printed circuit board and method for manufacturing same'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/720810 | Multilayer printed circuit board and method for manufacturing same | Sep 28, 2005 | Issued |
Array
(
[id] => 5637643
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[patent_kind] => A1
[patent_issue_date] => 2006-03-30
[patent_title] => 'Wiring pattern formation method, wiring pattern, and electronic device'
[patent_app_type] => utility
[patent_app_number] => 11/223921
[patent_app_country] => US
[patent_app_date] => 2005-09-13
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[firstpage_image] =>[orig_patent_app_number] => 11223921
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/223921 | Wiring pattern formation method, wiring pattern, and electronic device | Sep 12, 2005 | Issued |
Array
(
[id] => 5723588
[patent_doc_number] => 20060054348
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[patent_kind] => A1
[patent_issue_date] => 2006-03-16
[patent_title] => 'CIRCUIT SUBSTRATE'
[patent_app_type] => utility
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Array
(
[id] => 5897598
[patent_doc_number] => 20060042831
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[patent_kind] => A1
[patent_issue_date] => 2006-03-02
[patent_title] => 'Visually inspectable surface mount device pad'
[patent_app_type] => utility
[patent_app_number] => 11/216813
[patent_app_country] => US
[patent_app_date] => 2005-08-31
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/216813 | Visually inspectable surface mount device pad | Aug 30, 2005 | Issued |
Array
(
[id] => 5696374
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[patent_title] => 'Circuit board for surface-mount device to be mounted thereon'
[patent_app_type] => utility
[patent_app_number] => 11/216827
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/216827 | Circuit board for surface-mount device to be mounted thereon | Aug 30, 2005 | Abandoned |
Array
(
[id] => 5897590
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[firstpage_image] =>[orig_patent_app_number] => 11213901
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/213901 | Wired circuit board | Aug 29, 2005 | Issued |
Array
(
[id] => 103434
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[patent_issue_date] => 2010-05-25
[patent_title] => 'Lead pin for mounting semiconductor and printed wiring board'
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[firstpage_image] =>[orig_patent_app_number] => 11572334
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/572334 | Lead pin for mounting semiconductor and printed wiring board | Aug 29, 2005 | Issued |
Array
(
[id] => 416576
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[patent_title] => 'Electronic package and circuit board having segmented contact pads'
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[patent_app_country] => US
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[pdf_file] => patents/07/280/07280370.pdf
[firstpage_image] =>[orig_patent_app_number] => 11213141
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/213141 | Electronic package and circuit board having segmented contact pads | Aug 25, 2005 | Issued |