
Jeremy C. Norris
Examiner (ID: 7122, Phone: (571)272-1932 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2841, 2835, 2827, 2831 |
| Total Applications | 2133 |
| Issued Applications | 1816 |
| Pending Applications | 90 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 820786
[patent_doc_number] => 07408119
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-05
[patent_title] => 'Electrical interconnection for high-frequency devices'
[patent_app_type] => utility
[patent_app_number] => 10/687225
[patent_app_country] => US
[patent_app_date] => 2003-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 5147
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/408/07408119.pdf
[firstpage_image] =>[orig_patent_app_number] => 10687225
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/687225 | Electrical interconnection for high-frequency devices | Oct 14, 2003 | Issued |
Array
(
[id] => 877117
[patent_doc_number] => 07358446
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-15
[patent_title] => 'Power distribution system'
[patent_app_type] => utility
[patent_app_number] => 10/685175
[patent_app_country] => US
[patent_app_date] => 2003-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3187
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/358/07358446.pdf
[firstpage_image] =>[orig_patent_app_number] => 10685175
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/685175 | Power distribution system | Oct 13, 2003 | Issued |
Array
(
[id] => 5645334
[patent_doc_number] => 20060131066
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-22
[patent_title] => 'Adhesive closing device provided with a switching circuit'
[patent_app_type] => utility
[patent_app_number] => 10/541827
[patent_app_country] => US
[patent_app_date] => 2003-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2563
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0131/20060131066.pdf
[firstpage_image] =>[orig_patent_app_number] => 10541827
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/541827 | Adhesive closing device provided with a switching circuit | Oct 10, 2003 | Issued |
Array
(
[id] => 7162764
[patent_doc_number] => 20040075991
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-22
[patent_title] => 'Vapor phase connection techniques'
[patent_app_type] => new
[patent_app_number] => 10/683667
[patent_app_country] => US
[patent_app_date] => 2003-10-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 11207
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 55
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0075/20040075991.pdf
[firstpage_image] =>[orig_patent_app_number] => 10683667
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/683667 | Vapor phase connection techniques | Oct 9, 2003 | Abandoned |
Array
(
[id] => 827091
[patent_doc_number] => 07402758
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-22
[patent_title] => 'Telescoping blind via in three-layer core'
[patent_app_type] => utility
[patent_app_number] => 10/683641
[patent_app_country] => US
[patent_app_date] => 2003-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 18
[patent_no_of_words] => 8166
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 156
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/402/07402758.pdf
[firstpage_image] =>[orig_patent_app_number] => 10683641
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/683641 | Telescoping blind via in three-layer core | Oct 8, 2003 | Issued |
Array
(
[id] => 892826
[patent_doc_number] => 07345245
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-18
[patent_title] => 'Robust high density substrate design for thermal cycling reliability'
[patent_app_type] => utility
[patent_app_number] => 10/681554
[patent_app_country] => US
[patent_app_date] => 2003-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1940
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/345/07345245.pdf
[firstpage_image] =>[orig_patent_app_number] => 10681554
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/681554 | Robust high density substrate design for thermal cycling reliability | Oct 7, 2003 | Issued |
Array
(
[id] => 292605
[patent_doc_number] => 07544898
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-09
[patent_title] => 'Multilayer wiring board, touch panel and manufacturing method of the same'
[patent_app_type] => utility
[patent_app_number] => 10/678062
[patent_app_country] => US
[patent_app_date] => 2003-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 6708
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 189
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/544/07544898.pdf
[firstpage_image] =>[orig_patent_app_number] => 10678062
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/678062 | Multilayer wiring board, touch panel and manufacturing method of the same | Oct 5, 2003 | Issued |
Array
(
[id] => 7115450
[patent_doc_number] => 20050068751
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-31
[patent_title] => 'Floating trace on signal layer'
[patent_app_type] => utility
[patent_app_number] => 10/674886
[patent_app_country] => US
[patent_app_date] => 2003-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 1564
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0068/20050068751.pdf
[firstpage_image] =>[orig_patent_app_number] => 10674886
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/674886 | Floating trace on signal layer | Sep 29, 2003 | Abandoned |
Array
(
[id] => 7320442
[patent_doc_number] => 20040136169
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-15
[patent_title] => 'Printed circuit board, a buildup substrate, a method of manufacturing printed circuit board, and an electronic device'
[patent_app_type] => new
[patent_app_number] => 10/676569
[patent_app_country] => US
[patent_app_date] => 2003-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[patent_no_of_words] => 8169
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0136/20040136169.pdf
[firstpage_image] =>[orig_patent_app_number] => 10676569
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/676569 | Printed circuit board, a buildup substrate, a method of manufacturing printed circuit board, and an electronic device | Sep 29, 2003 | Abandoned |
Array
(
[id] => 7115456
[patent_doc_number] => 20050068757
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-31
[patent_title] => 'Stress compensation layer systems for improved second level solder joint reliability'
[patent_app_type] => utility
[patent_app_number] => 10/676548
[patent_app_country] => US
[patent_app_date] => 2003-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 22
[patent_no_of_words] => 5205
[patent_no_of_claims] => 30
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0068/20050068757.pdf
[firstpage_image] =>[orig_patent_app_number] => 10676548
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/676548 | Stress compensation layer systems for improved second level solder joint reliability | Sep 29, 2003 | Abandoned |
Array
(
[id] => 352874
[patent_doc_number] => 07491897
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-02-17
[patent_title] => 'Electronic equipment provided with wiring board into which press-fit terminals are press-fitted'
[patent_app_type] => utility
[patent_app_number] => 10/675227
[patent_app_country] => US
[patent_app_date] => 2003-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 10344
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/491/07491897.pdf
[firstpage_image] =>[orig_patent_app_number] => 10675227
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/675227 | Electronic equipment provided with wiring board into which press-fit terminals are press-fitted | Sep 28, 2003 | Issued |
Array
(
[id] => 383270
[patent_doc_number] => 07307222
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-12-11
[patent_title] => 'Printed circuit board test access point structures and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 10/670649
[patent_app_country] => US
[patent_app_date] => 2003-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/307/07307222.pdf
[firstpage_image] =>[orig_patent_app_number] => 10670649
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/670649 | Printed circuit board test access point structures and method for making the same | Sep 23, 2003 | Issued |
Array
(
[id] => 479606
[patent_doc_number] => 07223924
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-05-29
[patent_title] => 'Via placement for layer transitions in flexible circuits with high density ball grid arrays'
[patent_app_type] => utility
[patent_app_number] => 10/669982
[patent_app_country] => US
[patent_app_date] => 2003-09-23
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[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/07/223/07223924.pdf
[firstpage_image] =>[orig_patent_app_number] => 10669982
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/669982 | Via placement for layer transitions in flexible circuits with high density ball grid arrays | Sep 22, 2003 | Issued |
Array
(
[id] => 725423
[patent_doc_number] => 07045720
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-05-16
[patent_title] => 'Component lead system'
[patent_app_type] => utility
[patent_app_number] => 10/665594
[patent_app_country] => US
[patent_app_date] => 2003-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => patents/07/045/07045720.pdf
[firstpage_image] =>[orig_patent_app_number] => 10665594
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/665594 | Component lead system | Sep 18, 2003 | Issued |
Array
(
[id] => 7285709
[patent_doc_number] => 20040108134
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-10
[patent_title] => 'Printed wiring boards having low inductance embedded capacitors and methods of making same'
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[firstpage_image] =>[orig_patent_app_number] => 10663551
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/663551 | Printed wiring boards having low inductance embedded capacitors and methods of making same | Sep 15, 2003 | Abandoned |
Array
(
[id] => 574455
[patent_doc_number] => 07434309
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-14
[patent_title] => 'Method and apparatus for supporting a circuit component having solder column interconnects using an external support'
[patent_app_type] => utility
[patent_app_number] => 10/652598
[patent_app_country] => US
[patent_app_date] => 2003-08-29
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[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/07/434/07434309.pdf
[firstpage_image] =>[orig_patent_app_number] => 10652598
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/652598 | Method and apparatus for supporting a circuit component having solder column interconnects using an external support | Aug 28, 2003 | Issued |
Array
(
[id] => 7365521
[patent_doc_number] => 20040026122
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-12
[patent_title] => 'Printed circuit board and production method therefor, and laminated printed circuit board'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/297804 | Printed circuit board and production method therefor, and laminated printed circuit board | Jul 29, 2003 | Abandoned |
Array
(
[id] => 7417571
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[patent_title] => '[INNER LAYER STRUCTURE OF A CIRCUIT BOARD]'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/604474 | [INNER LAYER STRUCTURE OF A CIRCUIT BOARD] | Jul 23, 2003 | Abandoned |
Array
(
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[patent_title] => 'Apparatus and method for interconnection between a component and a printed circuit board'
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[patent_app_number] => 10/625216
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[patent_app_date] => 2003-07-22
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/625216 | Apparatus and method for interconnection between a component and a printed circuit board | Jul 21, 2003 | Abandoned |
Array
(
[id] => 401424
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[patent_issue_date] => 2007-11-06
[patent_title] => 'Copper paste and wiring board using the same'
[patent_app_type] => utility
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[patent_app_country] => US
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[pdf_file] => patents/07/291/07291789.pdf
[firstpage_image] =>[orig_patent_app_number] => 10620361
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/620361 | Copper paste and wiring board using the same | Jul 16, 2003 | Issued |