
Jimmy Chou
Examiner (ID: 14719, Phone: (571)270-7107 , Office: P/3742 )
| Most Active Art Unit | 3761 |
| Art Unit(s) | 3761, 3742 |
| Total Applications | 974 |
| Issued Applications | 646 |
| Pending Applications | 108 |
| Abandoned Applications | 256 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6738270
[patent_doc_number] => 20030155638
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-21
[patent_title] => 'Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/349975
[patent_app_country] => US
[patent_app_date] => 2003-01-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 9391
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0155/20030155638.pdf
[firstpage_image] =>[orig_patent_app_number] => 10349975
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/349975 | Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device | Jan 23, 2003 | Abandoned |
Array
(
[id] => 7283669
[patent_doc_number] => 20040145060
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-29
[patent_title] => 'Laser marking passivation film for semiconductor package'
[patent_app_type] => new
[patent_app_number] => 10/350536
[patent_app_country] => US
[patent_app_date] => 2003-01-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2531
[patent_no_of_claims] => 3
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0145/20040145060.pdf
[firstpage_image] =>[orig_patent_app_number] => 10350536
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/350536 | Laser marking passivation film for semiconductor package | Jan 22, 2003 | Abandoned |
Array
(
[id] => 7348369
[patent_doc_number] => 20040012079
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-22
[patent_title] => 'Multiple chip semiconductor packages'
[patent_app_type] => new
[patent_app_number] => 10/347356
[patent_app_country] => US
[patent_app_date] => 2003-01-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2856
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[pdf_file] => publications/A1/0012/20040012079.pdf
[firstpage_image] =>[orig_patent_app_number] => 10347356
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/347356 | Multiple chip semiconductor packages | Jan 20, 2003 | Issued |
Array
(
[id] => 548461
[patent_doc_number] => 07170151
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-01-30
[patent_title] => 'Accurate alignment of an LED assembly'
[patent_app_type] => utility
[patent_app_number] => 10/346535
[patent_app_country] => US
[patent_app_date] => 2003-01-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1622
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/170/07170151.pdf
[firstpage_image] =>[orig_patent_app_number] => 10346535
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/346535 | Accurate alignment of an LED assembly | Jan 15, 2003 | Issued |
Array
(
[id] => 7318920
[patent_doc_number] => 20040135239
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-15
[patent_title] => 'EMI heatspreader/lid for integrated circuit packages'
[patent_app_type] => new
[patent_app_number] => 10/345016
[patent_app_country] => US
[patent_app_date] => 2003-01-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3197
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0135/20040135239.pdf
[firstpage_image] =>[orig_patent_app_number] => 10345016
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/345016 | EMI heatspreader/lid for integrated circuit packages | Jan 14, 2003 | Issued |
Array
(
[id] => 751892
[patent_doc_number] => 07023067
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-04
[patent_title] => 'Bond pad design'
[patent_app_type] => utility
[patent_app_number] => 10/341082
[patent_app_country] => US
[patent_app_date] => 2003-01-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3766
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/023/07023067.pdf
[firstpage_image] =>[orig_patent_app_number] => 10341082
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/341082 | Bond pad design | Jan 12, 2003 | Issued |
Array
(
[id] => 6676933
[patent_doc_number] => 20030227073
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-12-11
[patent_title] => 'Lead frame and manufacturing method thereof and a semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/336716
[patent_app_country] => US
[patent_app_date] => 2003-01-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3925
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0227/20030227073.pdf
[firstpage_image] =>[orig_patent_app_number] => 10336716
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/336716 | Lead frame and manufacturing method thereof and a semiconductor device | Jan 5, 2003 | Abandoned |
Array
(
[id] => 7295914
[patent_doc_number] => 20040124475
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-01
[patent_title] => 'Diagonal deep well region for routing body-bias voltage for mosfets in surface well regions'
[patent_app_type] => new
[patent_app_number] => 10/334272
[patent_app_country] => US
[patent_app_date] => 2002-12-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3052
[patent_no_of_claims] => 39
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0124/20040124475.pdf
[firstpage_image] =>[orig_patent_app_number] => 10334272
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/334272 | Diagonal deep well region for routing body-bias voltage for MOSFETS in surface well regions | Dec 30, 2002 | Issued |
Array
(
[id] => 730216
[patent_doc_number] => 07042103
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-05-09
[patent_title] => 'Low stress semiconductor die attach'
[patent_app_type] => utility
[patent_app_number] => 10/334042
[patent_app_country] => US
[patent_app_date] => 2002-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 4062
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/042/07042103.pdf
[firstpage_image] =>[orig_patent_app_number] => 10334042
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/334042 | Low stress semiconductor die attach | Dec 29, 2002 | Issued |
Array
(
[id] => 7295960
[patent_doc_number] => 20040124509
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-01
[patent_title] => 'Method and structure for vertically-stacked device contact'
[patent_app_type] => new
[patent_app_number] => 10/334196
[patent_app_country] => US
[patent_app_date] => 2002-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3502
[patent_no_of_claims] => 34
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0124/20040124509.pdf
[firstpage_image] =>[orig_patent_app_number] => 10334196
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/334196 | Method and structure for vertically-stacked device contact | Dec 27, 2002 | Abandoned |
Array
(
[id] => 7457258
[patent_doc_number] => 20040119168
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-24
[patent_title] => 'Packaged integrated circuit having wire bonds and method therefor'
[patent_app_type] => new
[patent_app_number] => 10/323296
[patent_app_country] => US
[patent_app_date] => 2002-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0119/20040119168.pdf
[firstpage_image] =>[orig_patent_app_number] => 10323296
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/323296 | Packaged integrated circuit having wire bonds and method therefor | Dec 17, 2002 | Issued |
Array
(
[id] => 7357179
[patent_doc_number] => 20040004277
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-08
[patent_title] => 'Semiconductor package with reinforced substrate and fabrication method of the substrate'
[patent_app_type] => new
[patent_app_number] => 10/314065
[patent_app_country] => US
[patent_app_date] => 2002-12-05
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[pdf_file] => publications/A1/0004/20040004277.pdf
[firstpage_image] =>[orig_patent_app_number] => 10314065
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/314065 | Semiconductor package with reinforced substrate and fabrication method of the substrate | Dec 4, 2002 | Abandoned |
Array
(
[id] => 7205208
[patent_doc_number] => 20040070076
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-15
[patent_title] => 'Semiconductor chip package for image sensor and method of the same'
[patent_app_type] => new
[patent_app_number] => 10/300034
[patent_app_country] => US
[patent_app_date] => 2002-11-19
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0070/20040070076.pdf
[firstpage_image] =>[orig_patent_app_number] => 10300034
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/300034 | Semiconductor chip package for image sensor and method of the same | Nov 18, 2002 | Abandoned |
Array
(
[id] => 6799522
[patent_doc_number] => 20030094686
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-05-22
[patent_title] => 'Semiconductor device and method for manufacturing same'
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[firstpage_image] =>[orig_patent_app_number] => 10292495
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/292495 | Semiconductor device and method for manufacturing same | Nov 12, 2002 | Abandoned |
Array
(
[id] => 6781167
[patent_doc_number] => 20030062614
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[patent_title] => 'Folded interposer'
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[firstpage_image] =>[orig_patent_app_number] => 10291025
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/291025 | Folded interposer | Nov 6, 2002 | Abandoned |
Array
(
[id] => 6858860
[patent_doc_number] => 20030089868
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[patent_title] => 'Semiconductor device manufacturing method and semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 10287636
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Array
(
[id] => 285916
[patent_doc_number] => 07550845
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[patent_kind] => B2
[patent_issue_date] => 2009-06-23
[patent_title] => 'Ball grid array package with separated stiffener layer'
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[patent_app_number] => 10/284366
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[pdf_file] => patents/07/550/07550845.pdf
[firstpage_image] =>[orig_patent_app_number] => 10284366
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/284366 | Ball grid array package with separated stiffener layer | Oct 30, 2002 | Issued |
Array
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Array
(
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Array
(
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[pdf_file] => patents/06/861/06861750.pdf
[firstpage_image] =>[orig_patent_app_number] => 10284166
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/284166 | Ball grid array package with multiple interposers | Oct 30, 2002 | Issued |