Search

Jimmy Chou

Examiner (ID: 14719, Phone: (571)270-7107 , Office: P/3742 )

Most Active Art Unit
3761
Art Unit(s)
3761, 3742
Total Applications
974
Issued Applications
646
Pending Applications
108
Abandoned Applications
256

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6738270 [patent_doc_number] => 20030155638 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-21 [patent_title] => 'Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device' [patent_app_type] => new [patent_app_number] => 10/349975 [patent_app_country] => US [patent_app_date] => 2003-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9391 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20030155638.pdf [firstpage_image] =>[orig_patent_app_number] => 10349975 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/349975
Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device Jan 23, 2003 Abandoned
Array ( [id] => 7283669 [patent_doc_number] => 20040145060 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-29 [patent_title] => 'Laser marking passivation film for semiconductor package' [patent_app_type] => new [patent_app_number] => 10/350536 [patent_app_country] => US [patent_app_date] => 2003-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2531 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20040145060.pdf [firstpage_image] =>[orig_patent_app_number] => 10350536 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/350536
Laser marking passivation film for semiconductor package Jan 22, 2003 Abandoned
Array ( [id] => 7348369 [patent_doc_number] => 20040012079 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-22 [patent_title] => 'Multiple chip semiconductor packages' [patent_app_type] => new [patent_app_number] => 10/347356 [patent_app_country] => US [patent_app_date] => 2003-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2856 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 30 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20040012079.pdf [firstpage_image] =>[orig_patent_app_number] => 10347356 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/347356
Multiple chip semiconductor packages Jan 20, 2003 Issued
Array ( [id] => 548461 [patent_doc_number] => 07170151 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-30 [patent_title] => 'Accurate alignment of an LED assembly' [patent_app_type] => utility [patent_app_number] => 10/346535 [patent_app_country] => US [patent_app_date] => 2003-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1622 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/170/07170151.pdf [firstpage_image] =>[orig_patent_app_number] => 10346535 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/346535
Accurate alignment of an LED assembly Jan 15, 2003 Issued
Array ( [id] => 7318920 [patent_doc_number] => 20040135239 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-15 [patent_title] => 'EMI heatspreader/lid for integrated circuit packages' [patent_app_type] => new [patent_app_number] => 10/345016 [patent_app_country] => US [patent_app_date] => 2003-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3197 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0135/20040135239.pdf [firstpage_image] =>[orig_patent_app_number] => 10345016 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/345016
EMI heatspreader/lid for integrated circuit packages Jan 14, 2003 Issued
Array ( [id] => 751892 [patent_doc_number] => 07023067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-04 [patent_title] => 'Bond pad design' [patent_app_type] => utility [patent_app_number] => 10/341082 [patent_app_country] => US [patent_app_date] => 2003-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3766 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 386 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/023/07023067.pdf [firstpage_image] =>[orig_patent_app_number] => 10341082 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/341082
Bond pad design Jan 12, 2003 Issued
Array ( [id] => 6676933 [patent_doc_number] => 20030227073 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-11 [patent_title] => 'Lead frame and manufacturing method thereof and a semiconductor device' [patent_app_type] => new [patent_app_number] => 10/336716 [patent_app_country] => US [patent_app_date] => 2003-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3925 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0227/20030227073.pdf [firstpage_image] =>[orig_patent_app_number] => 10336716 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/336716
Lead frame and manufacturing method thereof and a semiconductor device Jan 5, 2003 Abandoned
Array ( [id] => 7295914 [patent_doc_number] => 20040124475 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-01 [patent_title] => 'Diagonal deep well region for routing body-bias voltage for mosfets in surface well regions' [patent_app_type] => new [patent_app_number] => 10/334272 [patent_app_country] => US [patent_app_date] => 2002-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3052 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0124/20040124475.pdf [firstpage_image] =>[orig_patent_app_number] => 10334272 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/334272
Diagonal deep well region for routing body-bias voltage for MOSFETS in surface well regions Dec 30, 2002 Issued
Array ( [id] => 730216 [patent_doc_number] => 07042103 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-09 [patent_title] => 'Low stress semiconductor die attach' [patent_app_type] => utility [patent_app_number] => 10/334042 [patent_app_country] => US [patent_app_date] => 2002-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 4062 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 29 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/042/07042103.pdf [firstpage_image] =>[orig_patent_app_number] => 10334042 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/334042
Low stress semiconductor die attach Dec 29, 2002 Issued
Array ( [id] => 7295960 [patent_doc_number] => 20040124509 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-01 [patent_title] => 'Method and structure for vertically-stacked device contact' [patent_app_type] => new [patent_app_number] => 10/334196 [patent_app_country] => US [patent_app_date] => 2002-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3502 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0124/20040124509.pdf [firstpage_image] =>[orig_patent_app_number] => 10334196 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/334196
Method and structure for vertically-stacked device contact Dec 27, 2002 Abandoned
Array ( [id] => 7457258 [patent_doc_number] => 20040119168 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-24 [patent_title] => 'Packaged integrated circuit having wire bonds and method therefor' [patent_app_type] => new [patent_app_number] => 10/323296 [patent_app_country] => US [patent_app_date] => 2002-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2701 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0119/20040119168.pdf [firstpage_image] =>[orig_patent_app_number] => 10323296 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/323296
Packaged integrated circuit having wire bonds and method therefor Dec 17, 2002 Issued
Array ( [id] => 7357179 [patent_doc_number] => 20040004277 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-08 [patent_title] => 'Semiconductor package with reinforced substrate and fabrication method of the substrate' [patent_app_type] => new [patent_app_number] => 10/314065 [patent_app_country] => US [patent_app_date] => 2002-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2882 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0004/20040004277.pdf [firstpage_image] =>[orig_patent_app_number] => 10314065 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/314065
Semiconductor package with reinforced substrate and fabrication method of the substrate Dec 4, 2002 Abandoned
Array ( [id] => 7205208 [patent_doc_number] => 20040070076 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-04-15 [patent_title] => 'Semiconductor chip package for image sensor and method of the same' [patent_app_type] => new [patent_app_number] => 10/300034 [patent_app_country] => US [patent_app_date] => 2002-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 3117 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0070/20040070076.pdf [firstpage_image] =>[orig_patent_app_number] => 10300034 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/300034
Semiconductor chip package for image sensor and method of the same Nov 18, 2002 Abandoned
Array ( [id] => 6799522 [patent_doc_number] => 20030094686 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-22 [patent_title] => 'Semiconductor device and method for manufacturing same' [patent_app_type] => new [patent_app_number] => 10/292495 [patent_app_country] => US [patent_app_date] => 2002-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4649 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0094/20030094686.pdf [firstpage_image] =>[orig_patent_app_number] => 10292495 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/292495
Semiconductor device and method for manufacturing same Nov 12, 2002 Abandoned
Array ( [id] => 6781167 [patent_doc_number] => 20030062614 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-04-03 [patent_title] => 'Folded interposer' [patent_app_type] => new [patent_app_number] => 10/291025 [patent_app_country] => US [patent_app_date] => 2002-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4079 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20030062614.pdf [firstpage_image] =>[orig_patent_app_number] => 10291025 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/291025
Folded interposer Nov 6, 2002 Abandoned
Array ( [id] => 6858860 [patent_doc_number] => 20030089868 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-15 [patent_title] => 'Semiconductor device manufacturing method and semiconductor device' [patent_app_type] => new [patent_app_number] => 10/287636 [patent_app_country] => US [patent_app_date] => 2002-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 7303 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20030089868.pdf [firstpage_image] =>[orig_patent_app_number] => 10287636 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/287636
Semiconductor device manufacturing method and semiconductor device Nov 4, 2002 Abandoned
Array ( [id] => 285916 [patent_doc_number] => 07550845 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-23 [patent_title] => 'Ball grid array package with separated stiffener layer' [patent_app_type] => utility [patent_app_number] => 10/284366 [patent_app_country] => US [patent_app_date] => 2002-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 21 [patent_no_of_words] => 8687 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/550/07550845.pdf [firstpage_image] =>[orig_patent_app_number] => 10284366 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/284366
Ball grid array package with separated stiffener layer Oct 30, 2002 Issued
Array ( [id] => 6858960 [patent_doc_number] => 20030089968 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-15 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/285286 [patent_app_country] => US [patent_app_date] => 2002-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2804 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20030089968.pdf [firstpage_image] =>[orig_patent_app_number] => 10285286 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/285286
Semiconductor device Oct 30, 2002 Issued
Array ( [id] => 6807352 [patent_doc_number] => 20030197291 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-23 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/284105 [patent_app_country] => US [patent_app_date] => 2002-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4880 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20030197291.pdf [firstpage_image] =>[orig_patent_app_number] => 10284105 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/284105
Semiconductor device and method of manufacturing the same Oct 30, 2002 Issued
Array ( [id] => 1050693 [patent_doc_number] => 06861750 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-01 [patent_title] => 'Ball grid array package with multiple interposers' [patent_app_type] => utility [patent_app_number] => 10/284166 [patent_app_country] => US [patent_app_date] => 2002-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 32 [patent_no_of_words] => 8880 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/861/06861750.pdf [firstpage_image] =>[orig_patent_app_number] => 10284166 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/284166
Ball grid array package with multiple interposers Oct 30, 2002 Issued
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