John A. Mcpherson

Array ( [id] => 20053871 [patent_doc_number] => 20250192093 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-06-12 [patent_title] => SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICEs [patent_app_type] => utility [patent_app_number] => 19/057751 [patent_app_country] => US [patent_app_date] => 2025-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 951 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 251 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19057751 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20028958 [patent_doc_number] => 20250167180 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-22 [patent_title] => INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK [patent_app_type] => utility [patent_app_number] => 19/033078 [patent_app_country] => US [patent_app_date] => 2025-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1130 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 387 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19033078 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20540600 [patent_doc_number] => 12557690 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-02-17 [patent_title] => Package structures [patent_app_type] => utility [patent_app_number] => 19/025256 [patent_app_country] => US [patent_app_date] => 2025-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 1119 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19025256 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19634598 [patent_doc_number] => 20240413047 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-12 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/779080 [patent_app_country] => US [patent_app_date] => 2024-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 22817 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18779080 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19634599 [patent_doc_number] => 20240413048 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-12 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE HAVING THERMAL MANAGEMENT STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/779081 [patent_app_country] => US [patent_app_date] => 2024-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 22852 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18779081 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19515925 [patent_doc_number] => 20240347611 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-17 [patent_title] => Source/Drain Feature to Contact Interfaces [patent_app_type] => utility [patent_app_number] => 18/750737 [patent_app_country] => US [patent_app_date] => 2024-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8470 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18750737 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19790207 [patent_doc_number] => 20250063886 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-20 [patent_title] => DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/735683 [patent_app_country] => US [patent_app_date] => 2024-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 17764 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18735683 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20381900 [patent_doc_number] => 20250364393 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-11-27 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/673204 [patent_app_country] => US [patent_app_date] => 2024-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2120 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18673204 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19420955 [patent_doc_number] => 20240297079 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-05 [patent_title] => SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET [patent_app_type] => utility [patent_app_number] => 18/662772 [patent_app_country] => US [patent_app_date] => 2024-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7072 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18662772 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20291378 [patent_doc_number] => 20250316621 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-10-09 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/660223 [patent_app_country] => US [patent_app_date] => 2024-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18660223 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20036337 [patent_doc_number] => 20250174559 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-29 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/641525 [patent_app_country] => US [patent_app_date] => 2024-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3508 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18641525 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19531741 [patent_doc_number] => 20240355643 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-24 [patent_title] => SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FOR MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/639994 [patent_app_country] => US [patent_app_date] => 2024-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4031 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18639994 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19269521 [patent_doc_number] => 20240213225 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => PACKAGE STACKING USING CHIP TO WAFER BONDING [patent_app_type] => utility [patent_app_number] => 18/601774 [patent_app_country] => US [patent_app_date] => 2024-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5358 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18601774 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19364371 [patent_doc_number] => 20240266405 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-08 [patent_title] => III-NITRIDE MATERIAL SEMICONDUCTOR STRUCTURES ON CONDUCTIVE SILICON SUBSTRATES [patent_app_type] => utility [patent_app_number] => 18/591875 [patent_app_country] => US [patent_app_date] => 2024-02-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 27041 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18591875 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19239389 [patent_doc_number] => 20240196585 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-13 [patent_title] => Methods, Structures and Devices for Intra-Connection Structures [patent_app_type] => utility [patent_app_number] => 18/581604 [patent_app_country] => US [patent_app_date] => 2024-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4639 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 210 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18581604 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19221507 [patent_doc_number] => 20240186211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-06 [patent_title] => DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES [patent_app_type] => utility [patent_app_number] => 18/441484 [patent_app_country] => US [patent_app_date] => 2024-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5281 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18441484 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19392854 [patent_doc_number] => 20240282724 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => ANTENNA-INTEGRATED HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME [patent_app_type] => utility [patent_app_number] => 18/439938 [patent_app_country] => US [patent_app_date] => 2024-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7626 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18439938 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19335624 [patent_doc_number] => 20240250054 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-25 [patent_title] => BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 18/414292 [patent_app_country] => US [patent_app_date] => 2024-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6975 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18414292 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19161330 [patent_doc_number] => 20240154037 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-09 [patent_title] => INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/400772 [patent_app_country] => US [patent_app_date] => 2023-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16762 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18400772 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20013144 [patent_doc_number] => 20250151366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-08 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/531679 [patent_app_country] => US [patent_app_date] => 2023-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18531679 [rel_patent_id] =>[rel_patent_doc_number] =>)