Search

John A. Rivell

Examiner (ID: 18446)

Most Active Art Unit
3753
Art Unit(s)
3753, 3407, 3401, 2899, 3727
Total Applications
3262
Issued Applications
2624
Pending Applications
168
Abandoned Applications
470

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7016508 [patent_doc_number] => 20050218525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-06 [patent_title] => 'Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/058323 [patent_app_country] => US [patent_app_date] => 2005-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 8245 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0218/20050218525.pdf [firstpage_image] =>[orig_patent_app_number] => 11058323 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/058323
Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device Feb 15, 2005 Abandoned
Array ( [id] => 6994034 [patent_doc_number] => 20050133810 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-23 [patent_title] => 'Opto-electronic assembly having an encapsulant with at least two different functional zones' [patent_app_type] => utility [patent_app_number] => 11/048676 [patent_app_country] => US [patent_app_date] => 2005-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 11710 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20050133810.pdf [firstpage_image] =>[orig_patent_app_number] => 11048676 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/048676
Opto-electronic assembly having an encapsulant with at least two different functional zones Jan 31, 2005 Abandoned
Array ( [id] => 7141599 [patent_doc_number] => 20050117267 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-02 [patent_title] => 'IC package substrate with over voltage protection function' [patent_app_type] => utility [patent_app_number] => 11/025330 [patent_app_country] => US [patent_app_date] => 2004-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1500 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20050117267.pdf [firstpage_image] =>[orig_patent_app_number] => 11025330 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/025330
IC package substrate with over voltage protection function Dec 28, 2004 Abandoned
Array ( [id] => 303950 [patent_doc_number] => 07535090 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-19 [patent_title] => 'LSI package provided with interface module' [patent_app_type] => utility [patent_app_number] => 11/015013 [patent_app_country] => US [patent_app_date] => 2004-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 19 [patent_no_of_words] => 18303 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/535/07535090.pdf [firstpage_image] =>[orig_patent_app_number] => 11015013 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/015013
LSI package provided with interface module Dec 19, 2004 Issued
Array ( [id] => 7096137 [patent_doc_number] => 20050128595 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-16 [patent_title] => 'Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens' [patent_app_type] => utility [patent_app_number] => 11/013101 [patent_app_country] => US [patent_app_date] => 2004-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 13339 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20050128595.pdf [firstpage_image] =>[orig_patent_app_number] => 11013101 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/013101
Substrate with recess portion for microlens, microlens substrate, transmissive screen, rear type projector, and method of manufacturing substrate with recess portion for microlens Dec 14, 2004 Issued
Array ( [id] => 469805 [patent_doc_number] => 07233067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-06-19 [patent_title] => 'Manufacturing a bump electrode with roughened face' [patent_app_type] => utility [patent_app_number] => 10/988553 [patent_app_country] => US [patent_app_date] => 2004-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2944 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/233/07233067.pdf [firstpage_image] =>[orig_patent_app_number] => 10988553 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/988553
Manufacturing a bump electrode with roughened face Nov 15, 2004 Issued
Array ( [id] => 7232381 [patent_doc_number] => 20050139391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-30 [patent_title] => 'Circuit board with trace configuration for high-speed digital differential signaling' [patent_app_type] => utility [patent_app_number] => 10/977192 [patent_app_country] => US [patent_app_date] => 2004-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3389 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0139/20050139391.pdf [firstpage_image] =>[orig_patent_app_number] => 10977192 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/977192
Circuit board with trace configuration for high-speed digital differential signaling Oct 28, 2004 Issued
Array ( [id] => 7048478 [patent_doc_number] => 20050184365 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-08-25 [patent_title] => 'High density lead arrangement package structure' [patent_app_type] => utility [patent_app_number] => 10/959203 [patent_app_country] => US [patent_app_date] => 2004-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1928 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0184/20050184365.pdf [firstpage_image] =>[orig_patent_app_number] => 10959203 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/959203
High density lead arrangement package structure Oct 6, 2004 Abandoned
Array ( [id] => 616350 [patent_doc_number] => 07144761 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-05 [patent_title] => 'Semiconductor device and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/958282 [patent_app_country] => US [patent_app_date] => 2004-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 43 [patent_no_of_words] => 6181 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/144/07144761.pdf [firstpage_image] =>[orig_patent_app_number] => 10958282 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/958282
Semiconductor device and method for fabricating the same Oct 5, 2004 Issued
Array ( [id] => 672936 [patent_doc_number] => 07091538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-15 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/954183 [patent_app_country] => US [patent_app_date] => 2004-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 3967 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/091/07091538.pdf [firstpage_image] =>[orig_patent_app_number] => 10954183 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/954183
Semiconductor device and method for manufacturing the same Sep 30, 2004 Issued
Array ( [id] => 687841 [patent_doc_number] => 07078800 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-18 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/957176 [patent_app_country] => US [patent_app_date] => 2004-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3502 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/078/07078800.pdf [firstpage_image] =>[orig_patent_app_number] => 10957176 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/957176
Semiconductor package Sep 29, 2004 Issued
Array ( [id] => 6918185 [patent_doc_number] => 20050095746 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-05 [patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument' [patent_app_type] => utility [patent_app_number] => 10/941871 [patent_app_country] => US [patent_app_date] => 2004-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4715 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0095/20050095746.pdf [firstpage_image] =>[orig_patent_app_number] => 10941871 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/941871
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Sep 15, 2004 Issued
Array ( [id] => 578353 [patent_doc_number] => 07459721 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-12-02 [patent_title] => 'Field effect type organic transistor and process for production thereof' [patent_app_type] => utility [patent_app_number] => 10/555374 [patent_app_country] => US [patent_app_date] => 2004-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 5413 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/459/07459721.pdf [firstpage_image] =>[orig_patent_app_number] => 10555374 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/555374
Field effect type organic transistor and process for production thereof Sep 15, 2004 Issued
Array ( [id] => 45176 [patent_doc_number] => 07777319 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-17 [patent_title] => 'Three dimensional integrated circuits' [patent_app_type] => utility [patent_app_number] => 10/937828 [patent_app_country] => US [patent_app_date] => 2004-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 6919 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/777/07777319.pdf [firstpage_image] =>[orig_patent_app_number] => 10937828 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/937828
Three dimensional integrated circuits Sep 9, 2004 Issued
Array ( [id] => 686550 [patent_doc_number] => 07078266 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-18 [patent_title] => 'Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts' [patent_app_type] => utility [patent_app_number] => 10/933144 [patent_app_country] => US [patent_app_date] => 2004-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 40 [patent_no_of_words] => 6585 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/078/07078266.pdf [firstpage_image] =>[orig_patent_app_number] => 10933144 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/933144
Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts Sep 1, 2004 Issued
Array ( [id] => 662646 [patent_doc_number] => 07101749 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-09-05 [patent_title] => 'Non-volatile semiconductor memory device' [patent_app_type] => utility [patent_app_number] => 10/933035 [patent_app_country] => US [patent_app_date] => 2004-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 3612 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/101/07101749.pdf [firstpage_image] =>[orig_patent_app_number] => 10933035 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/933035
Non-volatile semiconductor memory device Aug 31, 2004 Issued
Array ( [id] => 285895 [patent_doc_number] => 07550824 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-23 [patent_title] => 'Low k interconnect dielectric using surface transformation' [patent_app_type] => utility [patent_app_number] => 10/931593 [patent_app_country] => US [patent_app_date] => 2004-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 26 [patent_no_of_words] => 6214 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/550/07550824.pdf [firstpage_image] =>[orig_patent_app_number] => 10931593 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/931593
Low k interconnect dielectric using surface transformation Aug 30, 2004 Issued
Array ( [id] => 7120382 [patent_doc_number] => 20050012211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-20 [patent_title] => 'Under-bump metallugical structure' [patent_app_type] => utility [patent_app_number] => 10/921369 [patent_app_country] => US [patent_app_date] => 2004-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4365 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20050012211.pdf [firstpage_image] =>[orig_patent_app_number] => 10921369 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/921369
Under-bump metallugical structure Aug 17, 2004 Abandoned
Array ( [id] => 7058953 [patent_doc_number] => 20050001312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Chip package with grease heat sink' [patent_app_type] => utility [patent_app_number] => 10/898618 [patent_app_country] => US [patent_app_date] => 2004-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4553 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20050001312.pdf [firstpage_image] =>[orig_patent_app_number] => 10898618 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/898618
Chip package with grease heat sink Jul 21, 2004 Abandoned
Array ( [id] => 7059793 [patent_doc_number] => 20050002153 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Semiconductor integrated circuit device, mounting board, and device and board assembly' [patent_app_type] => utility [patent_app_number] => 10/893967 [patent_app_country] => US [patent_app_date] => 2004-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6016 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0002/20050002153.pdf [firstpage_image] =>[orig_patent_app_number] => 10893967 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/893967
Semiconductor integrated circuit device, mounting board, and device and board assembly Jul 19, 2004 Abandoned
Menu