
John B. Vigushin
Examiner (ID: 4424)
| Most Active Art Unit | 2841 |
| Art Unit(s) | 2841, 2103, 2827, 2835, 3662 |
| Total Applications | 656 |
| Issued Applications | 594 |
| Pending Applications | 37 |
| Abandoned Applications | 25 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1493282
[patent_doc_number] => 06418030
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-09
[patent_title] => 'Multi-chip module'
[patent_app_type] => B1
[patent_app_number] => 09/636714
[patent_app_country] => US
[patent_app_date] => 2000-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 32
[patent_no_of_words] => 10889
[patent_no_of_claims] => 37
[patent_no_of_ind_claims] => 28
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/418/06418030.pdf
[firstpage_image] =>[orig_patent_app_number] => 09636714
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/636714 | Multi-chip module | Aug 10, 2000 | Issued |
Array
(
[id] => 1504229
[patent_doc_number] => 06487083
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-26
[patent_title] => 'Multilayer circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/636595
[patent_app_country] => US
[patent_app_date] => 2000-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/06/487/06487083.pdf
[firstpage_image] =>[orig_patent_app_number] => 09636595
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/636595 | Multilayer circuit board | Aug 9, 2000 | Issued |
Array
(
[id] => 1550148
[patent_doc_number] => 06445591
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Multilayer circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/636594
[patent_app_country] => US
[patent_app_date] => 2000-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 4561
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[pdf_file] => patents/06/445/06445591.pdf
[firstpage_image] =>[orig_patent_app_number] => 09636594
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/636594 | Multilayer circuit board | Aug 9, 2000 | Issued |
Array
(
[id] => 1529044
[patent_doc_number] => 06479755
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-12
[patent_title] => 'Printed circuit board and pad apparatus having a solder deposit'
[patent_app_type] => B1
[patent_app_number] => 09/635490
[patent_app_country] => US
[patent_app_date] => 2000-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 4805
[patent_no_of_claims] => 31
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/479/06479755.pdf
[firstpage_image] =>[orig_patent_app_number] => 09635490
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/635490 | Printed circuit board and pad apparatus having a solder deposit | Aug 8, 2000 | Issued |
Array
(
[id] => 1536743
[patent_doc_number] => 06411518
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-25
[patent_title] => 'High-density mounted device employing an adhesive sheet'
[patent_app_type] => B1
[patent_app_number] => 09/634499
[patent_app_country] => US
[patent_app_date] => 2000-08-08
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/411/06411518.pdf
[firstpage_image] =>[orig_patent_app_number] => 09634499
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/634499 | High-density mounted device employing an adhesive sheet | Aug 7, 2000 | Issued |
Array
(
[id] => 1463495
[patent_doc_number] => 06350957
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-26
[patent_title] => 'Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/633438
[patent_app_country] => US
[patent_app_date] => 2000-08-07
[patent_effective_date] => 0000-00-00
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[patent_figures_cnt] => 85
[patent_no_of_words] => 24564
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[pdf_file] => patents/06/350/06350957.pdf
[firstpage_image] =>[orig_patent_app_number] => 09633438
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/633438 | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Aug 6, 2000 | Issued |
Array
(
[id] => 1493293
[patent_doc_number] => 06418035
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-09
[patent_title] => 'Retention mechanism with improved hold-down structure for securing the retention mechanism to a printed circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/632370
[patent_app_country] => US
[patent_app_date] => 2000-08-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
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[pdf_file] => patents/06/418/06418035.pdf
[firstpage_image] =>[orig_patent_app_number] => 09632370
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/632370 | Retention mechanism with improved hold-down structure for securing the retention mechanism to a printed circuit board | Aug 2, 2000 | Issued |
Array
(
[id] => 1585195
[patent_doc_number] => 06424536
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-23
[patent_title] => 'Circuit board protection method and apparatus'
[patent_app_type] => B1
[patent_app_number] => 09/627999
[patent_app_country] => US
[patent_app_date] => 2000-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 1202
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[pdf_file] => patents/06/424/06424536.pdf
[firstpage_image] =>[orig_patent_app_number] => 09627999
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/627999 | Circuit board protection method and apparatus | Jul 27, 2000 | Issued |
Array
(
[id] => 1587953
[patent_doc_number] => 06359340
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-03-19
[patent_title] => 'Multichip module having a stacked chip arrangement'
[patent_app_type] => B1
[patent_app_number] => 09/628676
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[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/628676 | Multichip module having a stacked chip arrangement | Jul 27, 2000 | Issued |
Array
(
[id] => 1555852
[patent_doc_number] => 06349036
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-19
[patent_title] => 'Adaptive seat of computer functional cards'
[patent_app_type] => B1
[patent_app_number] => 09/624985
[patent_app_country] => US
[patent_app_date] => 2000-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 1024
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[pdf_file] => patents/06/349/06349036.pdf
[firstpage_image] =>[orig_patent_app_number] => 09624985
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/624985 | Adaptive seat of computer functional cards | Jul 24, 2000 | Issued |
Array
(
[id] => 1440803
[patent_doc_number] => 06495768
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-17
[patent_title] => 'Tape carrier package and method of fabricating the same'
[patent_app_type] => B1
[patent_app_number] => 09/620211
[patent_app_country] => US
[patent_app_date] => 2000-07-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/495/06495768.pdf
[firstpage_image] =>[orig_patent_app_number] => 09620211
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/620211 | Tape carrier package and method of fabricating the same | Jul 19, 2000 | Issued |
Array
(
[id] => 1550161
[patent_doc_number] => 06445594
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Semiconductor device having stacked semiconductor elements'
[patent_app_type] => B1
[patent_app_number] => 09/620717
[patent_app_country] => US
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[pdf_file] => patents/06/445/06445594.pdf
[firstpage_image] =>[orig_patent_app_number] => 09620717
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/620717 | Semiconductor device having stacked semiconductor elements | Jul 19, 2000 | Issued |
Array
(
[id] => 1491872
[patent_doc_number] => 06417563
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-09
[patent_title] => 'Spring frame for protecting packaged electronic devices'
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[pdf_file] => patents/06/417/06417563.pdf
[firstpage_image] =>[orig_patent_app_number] => 09617102
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/617102 | Spring frame for protecting packaged electronic devices | Jul 13, 2000 | Issued |
Array
(
[id] => 1303565
[patent_doc_number] => 06628526
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-30
[patent_title] => 'Electronic device manufacturing method, electronic device and resin filling method'
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[firstpage_image] =>[orig_patent_app_number] => 09614374
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/614374 | Electronic device manufacturing method, electronic device and resin filling method | Jul 11, 2000 | Issued |
Array
(
[id] => 4341402
[patent_doc_number] => 06320757
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[firstpage_image] =>[orig_patent_app_number] => 614684
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Array
(
[id] => 1520393
[patent_doc_number] => 06501664
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[patent_issue_date] => 2002-12-31
[patent_title] => 'Decoupling structure and method for printed circuit board component'
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[pdf_file] => patents/06/501/06501664.pdf
[firstpage_image] =>[orig_patent_app_number] => 09608183
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/608183 | Decoupling structure and method for printed circuit board component | Jun 29, 2000 | Issued |
Array
(
[id] => 1473250
[patent_doc_number] => 06407929
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[patent_issue_date] => 2002-06-18
[patent_title] => 'Electronic package having embedded capacitors and method of fabrication therefor'
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Array
(
[id] => 1437620
[patent_doc_number] => 06356453
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[patent_title] => 'Electronic package having flip chip integrated circuit and passive chip component'
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Array
(
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Array
(
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[pdf_file] => patents/06/324/06324067.pdf
[firstpage_image] =>[orig_patent_app_number] => 553557
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/553557 | Printed wiring board and assembly of the same | Apr 19, 2000 | Issued |