
John B. Vigushin
Examiner (ID: 11960)
| Most Active Art Unit | 2841 |
| Art Unit(s) | 3662, 2827, 2841, 2103, 2835 |
| Total Applications | 656 |
| Issued Applications | 594 |
| Pending Applications | 37 |
| Abandoned Applications | 25 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4383654
[patent_doc_number] => 06288907
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-11
[patent_title] => 'High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief'
[patent_app_type] => 1
[patent_app_number] => 9/343432
[patent_app_country] => US
[patent_app_date] => 1999-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2179
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[pdf_file] => patents/06/288/06288907.pdf
[firstpage_image] =>[orig_patent_app_number] => 343432
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/343432 | High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief | Jun 29, 1999 | Issued |
Array
(
[id] => 1417496
[patent_doc_number] => 06528889
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-04
[patent_title] => 'Electronic circuit device having adhesion-reinforcing pattern on a circuit board for flip-chip mounting an IC chip'
[patent_app_type] => B1
[patent_app_number] => 09/342424
[patent_app_country] => US
[patent_app_date] => 1999-06-29
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[pdf_file] => patents/06/528/06528889.pdf
[firstpage_image] =>[orig_patent_app_number] => 09342424
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/342424 | Electronic circuit device having adhesion-reinforcing pattern on a circuit board for flip-chip mounting an IC chip | Jun 28, 1999 | Issued |
Array
(
[id] => 1597465
[patent_doc_number] => 06492600
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[patent_kind] => B1
[patent_issue_date] => 2002-12-10
[patent_title] => 'Laminate having plated microvia interconnects and method for forming the same'
[patent_app_type] => B1
[patent_app_number] => 09/340758
[patent_app_country] => US
[patent_app_date] => 1999-06-28
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[pdf_file] => patents/06/492/06492600.pdf
[firstpage_image] =>[orig_patent_app_number] => 09340758
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/340758 | Laminate having plated microvia interconnects and method for forming the same | Jun 27, 1999 | Issued |
Array
(
[id] => 1310208
[patent_doc_number] => 06617681
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-09
[patent_title] => 'Interposer and method of making same'
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[patent_app_country] => US
[patent_app_date] => 1999-06-28
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[pdf_file] => patents/06/617/06617681.pdf
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Array
(
[id] => 4406807
[patent_doc_number] => 06297965
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-02
[patent_title] => 'Wiring arrangement including capacitors for suppressing electromagnetic wave radiation from a printed circuit board'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/340053 | Wiring arrangement including capacitors for suppressing electromagnetic wave radiation from a printed circuit board | Jun 27, 1999 | Issued |
Array
(
[id] => 4384163
[patent_doc_number] => 06303871
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[patent_kind] => NA
[patent_issue_date] => 2001-10-16
[patent_title] => 'Degassing hole design for olga trace impedance'
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Array
(
[id] => 4116590
[patent_doc_number] => 06101100
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[patent_kind] => NA
[patent_issue_date] => 2000-08-08
[patent_title] => 'Multi-electronic device package'
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[patent_app_number] => 9/330170
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[pdf_file] => patents/06/101/06101100.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/330170 | Multi-electronic device package | Jun 10, 1999 | Issued |
Array
(
[id] => 4416025
[patent_doc_number] => 06272019
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-08-07
[patent_title] => 'Closely-positioned multiple GBIC connectors'
[patent_app_type] => 1
[patent_app_number] => 9/330434
[patent_app_country] => US
[patent_app_date] => 1999-06-11
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[pdf_file] => patents/06/272/06272019.pdf
[firstpage_image] =>[orig_patent_app_number] => 330434
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/330434 | Closely-positioned multiple GBIC connectors | Jun 10, 1999 | Issued |
Array
(
[id] => 4344268
[patent_doc_number] => 06313999
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-06
[patent_title] => 'Self alignment device for ball grid array devices'
[patent_app_type] => 1
[patent_app_number] => 9/329420
[patent_app_country] => US
[patent_app_date] => 1999-06-10
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[pdf_file] => patents/06/313/06313999.pdf
[firstpage_image] =>[orig_patent_app_number] => 329420
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/329420 | Self alignment device for ball grid array devices | Jun 9, 1999 | Issued |
Array
(
[id] => 4245679
[patent_doc_number] => 06075707
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Radio frequency identification tag'
[patent_app_type] => 1
[patent_app_number] => 9/326167
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[patent_app_date] => 1999-06-04
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[firstpage_image] =>[orig_patent_app_number] => 326167
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/326167 | Radio frequency identification tag | Jun 3, 1999 | Issued |
Array
(
[id] => 1507246
[patent_doc_number] => 06466454
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-15
[patent_title] => 'Component transformer'
[patent_app_type] => B1
[patent_app_number] => 09/313939
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[firstpage_image] =>[orig_patent_app_number] => 09313939
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/313939 | Component transformer | May 17, 1999 | Issued |
Array
(
[id] => 4230918
[patent_doc_number] => 06088238
[patent_country] => US
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[patent_issue_date] => 2000-07-11
[patent_title] => 'Semiconductor device socket, assembly and methods'
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[firstpage_image] =>[orig_patent_app_number] => 309331
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/309331 | Semiconductor device socket, assembly and methods | May 10, 1999 | Issued |
Array
(
[id] => 1555853
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[patent_title] => 'Backplane for common building block'
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Array
(
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[patent_title] => 'Printed circuit board with oval solder ball lands for BGA semiconductor packages'
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Array
(
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Array
(
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[patent_title] => 'Compounds labeled with cyanate or thiocyanate metal complexes for detection by infrared spectroscopy'
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Array
(
[id] => 6400124
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[patent_title] => 'MODULE WITH ELECTRONIC COMPONENTS'
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Array
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/291258 | Electronic device retainer | Apr 12, 1999 | Issued |