
John B. Vigushin
Examiner (ID: 11466)
| Most Active Art Unit | 2841 |
| Art Unit(s) | 2835, 2841, 2103, 3662, 2827 |
| Total Applications | 656 |
| Issued Applications | 594 |
| Pending Applications | 37 |
| Abandoned Applications | 25 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5998385
[patent_doc_number] => 20020027773
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-07
[patent_title] => 'SUB-PACKAGE BYPASS CAPACITOR MOUNTING FOR AN ARRAY PACKAGED INTEGRATED CIRCUIT'
[patent_app_type] => new
[patent_app_number] => 09/286250
[patent_app_country] => US
[patent_app_date] => 1999-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4916
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0027/20020027773.pdf
[firstpage_image] =>[orig_patent_app_number] => 09286250
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/286250 | Sub-package bypass capacitor mounting for an array packaged integrated circuit | Apr 4, 1999 | Issued |
Array
(
[id] => 4272973
[patent_doc_number] => 06259608
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-10
[patent_title] => 'Conductor pattern for surface mount devices and method therefor'
[patent_app_type] => 1
[patent_app_number] => 9/286324
[patent_app_country] => US
[patent_app_date] => 1999-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 3396
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
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[pdf_file] => patents/06/259/06259608.pdf
[firstpage_image] =>[orig_patent_app_number] => 286324
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/286324 | Conductor pattern for surface mount devices and method therefor | Apr 4, 1999 | Issued |
Array
(
[id] => 4418765
[patent_doc_number] => 06301121
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-09
[patent_title] => 'Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process'
[patent_app_type] => 1
[patent_app_number] => 9/287218
[patent_app_country] => US
[patent_app_date] => 1999-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 5245
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[patent_maintenance] => 1
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[pdf_file] => patents/06/301/06301121.pdf
[firstpage_image] =>[orig_patent_app_number] => 287218
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/287218 | Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process | Apr 4, 1999 | Issued |
Array
(
[id] => 4344254
[patent_doc_number] => 06313998
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-06
[patent_title] => 'Circuit board assembly having a three dimensional array of integrated circuit packages'
[patent_app_type] => 1
[patent_app_number] => 9/285354
[patent_app_country] => US
[patent_app_date] => 1999-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 10
[patent_no_of_words] => 3505
[patent_no_of_claims] => 34
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[patent_words_short_claim] => 172
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[pdf_file] => patents/06/313/06313998.pdf
[firstpage_image] =>[orig_patent_app_number] => 285354
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/285354 | Circuit board assembly having a three dimensional array of integrated circuit packages | Apr 1, 1999 | Issued |
Array
(
[id] => 4286322
[patent_doc_number] => 06324072
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-27
[patent_title] => 'Microelectronic component of sandwich construction'
[patent_app_type] => 1
[patent_app_number] => 9/282092
[patent_app_country] => US
[patent_app_date] => 1999-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/06/324/06324072.pdf
[firstpage_image] =>[orig_patent_app_number] => 282092
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/282092 | Microelectronic component of sandwich construction | Mar 29, 1999 | Issued |
Array
(
[id] => 1178802
[patent_doc_number] => 06747362
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-06-08
[patent_title] => 'Perimeter matrix ball grid array circuit package with a populated center'
[patent_app_type] => B2
[patent_app_number] => 09/274430
[patent_app_country] => US
[patent_app_date] => 1999-03-22
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[pdf_file] => patents/06/747/06747362.pdf
[firstpage_image] =>[orig_patent_app_number] => 09274430
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/274430 | Perimeter matrix ball grid array circuit package with a populated center | Mar 21, 1999 | Issued |
Array
(
[id] => 1433781
[patent_doc_number] => 06341071
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-22
[patent_title] => 'Stress relieved ball grid array package'
[patent_app_type] => B1
[patent_app_number] => 09/272517
[patent_app_country] => US
[patent_app_date] => 1999-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 3556
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[firstpage_image] =>[orig_patent_app_number] => 09272517
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/272517 | Stress relieved ball grid array package | Mar 18, 1999 | Issued |
Array
(
[id] => 4416015
[patent_doc_number] => 06272018
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-08-07
[patent_title] => 'Method for the verification of the polarity and presence of components on a printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 9/247811
[patent_app_country] => US
[patent_app_date] => 1999-02-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1436
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[pdf_file] => patents/06/272/06272018.pdf
[firstpage_image] =>[orig_patent_app_number] => 247811
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/247811 | Method for the verification of the polarity and presence of components on a printed circuit board | Feb 10, 1999 | Issued |
Array
(
[id] => 4220964
[patent_doc_number] => 06111204
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-29
[patent_title] => 'Bond pads for fine-pitch applications on air bridge circuit boards'
[patent_app_type] => 1
[patent_app_number] => 9/246864
[patent_app_country] => US
[patent_app_date] => 1999-02-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[firstpage_image] =>[orig_patent_app_number] => 246864
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/246864 | Bond pads for fine-pitch applications on air bridge circuit boards | Feb 7, 1999 | Issued |
Array
(
[id] => 4363113
[patent_doc_number] => 06215670
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-10
[patent_title] => 'Method for manufacturing raised electrical contact pattern of controlled geometry'
[patent_app_type] => 1
[patent_app_number] => 9/245779
[patent_app_country] => US
[patent_app_date] => 1999-02-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[pdf_file] => patents/06/215/06215670.pdf
[firstpage_image] =>[orig_patent_app_number] => 245779
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/245779 | Method for manufacturing raised electrical contact pattern of controlled geometry | Feb 4, 1999 | Issued |
Array
(
[id] => 1603834
[patent_doc_number] => 06434017
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-13
[patent_title] => 'Semiconductor device and electronic apparatus'
[patent_app_type] => B1
[patent_app_number] => 09/235760
[patent_app_country] => US
[patent_app_date] => 1999-01-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/434/06434017.pdf
[firstpage_image] =>[orig_patent_app_number] => 09235760
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/235760 | Semiconductor device and electronic apparatus | Jan 24, 1999 | Issued |
Array
(
[id] => 4302082
[patent_doc_number] => 06212077
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-03
[patent_title] => 'Built-in inspection template for a printed circuit'
[patent_app_type] => 1
[patent_app_number] => 9/237090
[patent_app_country] => US
[patent_app_date] => 1999-01-25
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[pdf_file] => patents/06/212/06212077.pdf
[firstpage_image] =>[orig_patent_app_number] => 237090
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/237090 | Built-in inspection template for a printed circuit | Jan 24, 1999 | Issued |
Array
(
[id] => 4262310
[patent_doc_number] => 06222739
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-24
[patent_title] => 'High-density computer module with stacked parallel-plane packaging'
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[pdf_file] => patents/06/222/06222739.pdf
[firstpage_image] =>[orig_patent_app_number] => 228867
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/228867 | High-density computer module with stacked parallel-plane packaging | Jan 11, 1999 | Issued |
Array
(
[id] => 4246750
[patent_doc_number] => 06118666
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-09-12
[patent_title] => 'Flexible printed wiring board and connecting structure thereof'
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[patent_app_number] => 9/228281
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 228281
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/228281 | Flexible printed wiring board and connecting structure thereof | Jan 10, 1999 | Issued |
Array
(
[id] => 4154641
[patent_doc_number] => 06031729
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Integral heater for reworking MCMS and other semiconductor components'
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[pdf_file] => patents/06/031/06031729.pdf
[firstpage_image] =>[orig_patent_app_number] => 227249
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/227249 | Integral heater for reworking MCMS and other semiconductor components | Jan 7, 1999 | Issued |
Array
(
[id] => 4245747
[patent_doc_number] => 06075712
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Flip-chip having electrical contact pads on the backside of the chip'
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[patent_app_number] => 9/227650
[patent_app_country] => US
[patent_app_date] => 1999-01-08
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[pdf_file] => patents/06/075/06075712.pdf
[firstpage_image] =>[orig_patent_app_number] => 227650
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/227650 | Flip-chip having electrical contact pads on the backside of the chip | Jan 7, 1999 | Issued |
Array
(
[id] => 4191440
[patent_doc_number] => 06038140
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-14
[patent_title] => 'Grounding circuit board standoff'
[patent_app_type] => 1
[patent_app_number] => 9/224010
[patent_app_country] => US
[patent_app_date] => 1998-12-31
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[pdf_file] => patents/06/038/06038140.pdf
[firstpage_image] =>[orig_patent_app_number] => 224010
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/224010 | Grounding circuit board standoff | Dec 30, 1998 | Issued |
Array
(
[id] => 4120056
[patent_doc_number] => 06058020
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[patent_title] => 'Component housing for surface mounting of a semiconductor component'
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Array
(
[id] => 4263499
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[patent_kind] => NA
[patent_issue_date] => 2001-03-20
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[firstpage_image] =>[orig_patent_app_number] => 221124
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/221124 | Wiring board and process for the production thereof | Dec 27, 1998 | Issued |
Array
(
[id] => 4262323
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[patent_issue_date] => 2001-04-24
[patent_title] => 'Multilayer circuit board having at least one core substrate arranged therein'
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/222/06222740.pdf
[firstpage_image] =>[orig_patent_app_number] => 209714
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/209714 | Multilayer circuit board having at least one core substrate arranged therein | Dec 10, 1998 | Issued |