
John B. Vigushin
Examiner (ID: 4424)
| Most Active Art Unit | 2841 |
| Art Unit(s) | 2841, 2103, 2827, 2835, 3662 |
| Total Applications | 656 |
| Issued Applications | 594 |
| Pending Applications | 37 |
| Abandoned Applications | 25 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7620122
[patent_doc_number] => 06943060
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2005-09-13
[patent_title] => 'Method for fabricating integrated circuit package with solder bumps'
[patent_app_type] => utility
[patent_app_number] => 10/794945
[patent_app_country] => US
[patent_app_date] => 2004-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 3043
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/943/06943060.pdf
[firstpage_image] =>[orig_patent_app_number] => 10794945
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/794945 | Method for fabricating integrated circuit package with solder bumps | Mar 4, 2004 | Issued |
Array
(
[id] => 6943535
[patent_doc_number] => 20050195584
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-08
[patent_title] => 'Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection'
[patent_app_type] => utility
[patent_app_number] => 10/791292
[patent_app_country] => US
[patent_app_date] => 2004-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 8505
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
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[pdf_file] => publications/A1/0195/20050195584.pdf
[firstpage_image] =>[orig_patent_app_number] => 10791292
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/791292 | Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection | Mar 2, 2004 | Issued |
Array
(
[id] => 6943534
[patent_doc_number] => 20050195583
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-08
[patent_title] => 'Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection'
[patent_app_type] => utility
[patent_app_number] => 10/791291
[patent_app_country] => US
[patent_app_date] => 2004-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 8518
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[pdf_file] => publications/A1/0195/20050195583.pdf
[firstpage_image] =>[orig_patent_app_number] => 10791291
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/791291 | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection | Mar 2, 2004 | Abandoned |
Array
(
[id] => 7185431
[patent_doc_number] => 20050191785
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-01
[patent_title] => 'Via structure of packages for high frequency semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 10/788711
[patent_app_country] => US
[patent_app_date] => 2004-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4652
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0191/20050191785.pdf
[firstpage_image] =>[orig_patent_app_number] => 10788711
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/788711 | Via structure of packages for high frequency semiconductor devices | Feb 26, 2004 | Issued |
Array
(
[id] => 639730
[patent_doc_number] => 07126829
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-10-24
[patent_title] => 'Adapter board for stacking Ball-Grid-Array (BGA) chips'
[patent_app_type] => utility
[patent_app_number] => 10/708101
[patent_app_country] => US
[patent_app_date] => 2004-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3089
[patent_no_of_claims] => 19
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/126/07126829.pdf
[firstpage_image] =>[orig_patent_app_number] => 10708101
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/708101 | Adapter board for stacking Ball-Grid-Array (BGA) chips | Feb 8, 2004 | Issued |
Array
(
[id] => 491548
[patent_doc_number] => 07215016
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-05-08
[patent_title] => 'Multi-chips stacked package'
[patent_app_type] => utility
[patent_app_number] => 10/747114
[patent_app_country] => US
[patent_app_date] => 2003-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 2144
[patent_no_of_claims] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/215/07215016.pdf
[firstpage_image] =>[orig_patent_app_number] => 10747114
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/747114 | Multi-chips stacked package | Dec 29, 2003 | Issued |
Array
(
[id] => 7320763
[patent_doc_number] => 20040136364
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-15
[patent_title] => 'Electronic apparatus'
[patent_app_type] => new
[patent_app_number] => 10/743191
[patent_app_country] => US
[patent_app_date] => 2003-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4852
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
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[pdf_file] => publications/A1/0136/20040136364.pdf
[firstpage_image] =>[orig_patent_app_number] => 10743191
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/743191 | Electronic apparatus | Dec 22, 2003 | Issued |
Array
(
[id] => 511929
[patent_doc_number] => 07203074
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-04-10
[patent_title] => 'Electronic circuit building block'
[patent_app_type] => utility
[patent_app_number] => 10/738405
[patent_app_country] => US
[patent_app_date] => 2003-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 29
[patent_no_of_words] => 10092
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 125
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/203/07203074.pdf
[firstpage_image] =>[orig_patent_app_number] => 10738405
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/738405 | Electronic circuit building block | Dec 15, 2003 | Issued |
Array
(
[id] => 506957
[patent_doc_number] => 07202420
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-04-10
[patent_title] => 'Methods to prevent mechanical flexure related BGA failure'
[patent_app_type] => utility
[patent_app_number] => 10/738688
[patent_app_country] => US
[patent_app_date] => 2003-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 2708
[patent_no_of_claims] => 17
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/202/07202420.pdf
[firstpage_image] =>[orig_patent_app_number] => 10738688
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/738688 | Methods to prevent mechanical flexure related BGA failure | Dec 15, 2003 | Issued |
Array
(
[id] => 540308
[patent_doc_number] => 07176579
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-02-13
[patent_title] => 'Semiconductor module'
[patent_app_type] => utility
[patent_app_number] => 10/733581
[patent_app_country] => US
[patent_app_date] => 2003-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 21
[patent_no_of_words] => 9449
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/176/07176579.pdf
[firstpage_image] =>[orig_patent_app_number] => 10733581
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/733581 | Semiconductor module | Dec 11, 2003 | Issued |
Array
(
[id] => 7176773
[patent_doc_number] => 20050123677
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-09
[patent_title] => 'System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design'
[patent_app_type] => utility
[patent_app_number] => 10/727362
[patent_app_country] => US
[patent_app_date] => 2003-12-04
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[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 4457
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0123/20050123677.pdf
[firstpage_image] =>[orig_patent_app_number] => 10727362
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/727362 | System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design | Dec 3, 2003 | Issued |
Array
(
[id] => 604597
[patent_doc_number] => 07152313
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-12-26
[patent_title] => 'Package substrate for integrated circuit and method of making the substrate'
[patent_app_type] => utility
[patent_app_number] => 10/723414
[patent_app_country] => US
[patent_app_date] => 2003-11-26
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[pdf_file] => patents/07/152/07152313.pdf
[firstpage_image] =>[orig_patent_app_number] => 10723414
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/723414 | Package substrate for integrated circuit and method of making the substrate | Nov 25, 2003 | Issued |
Array
(
[id] => 606684
[patent_doc_number] => 07154049
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-12-26
[patent_title] => 'Apparatus for crosstalk compensation in a telecommunications connector'
[patent_app_type] => utility
[patent_app_number] => 10/716808
[patent_app_country] => US
[patent_app_date] => 2003-11-19
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[pdf_file] => patents/07/154/07154049.pdf
[firstpage_image] =>[orig_patent_app_number] => 10716808
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/716808 | Apparatus for crosstalk compensation in a telecommunications connector | Nov 18, 2003 | Issued |
Array
(
[id] => 7302359
[patent_doc_number] => 20040114336
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-17
[patent_title] => 'Techniques for fabricating a resistor on a flexible base material'
[patent_app_type] => new
[patent_app_number] => 10/716143
[patent_app_country] => US
[patent_app_date] => 2003-11-18
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[pdf_file] => publications/A1/0114/20040114336.pdf
[firstpage_image] =>[orig_patent_app_number] => 10716143
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/716143 | Techniques for fabricating a resistor on a flexible base material | Nov 17, 2003 | Issued |
Array
(
[id] => 624880
[patent_doc_number] => 07139177
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-11-21
[patent_title] => 'Printed circuit board with void between pins'
[patent_app_type] => utility
[patent_app_number] => 10/695100
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[pdf_file] => patents/07/139/07139177.pdf
[firstpage_image] =>[orig_patent_app_number] => 10695100
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/695100 | Printed circuit board with void between pins | Oct 27, 2003 | Issued |
Array
(
[id] => 7357854
[patent_doc_number] => 20040090748
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-13
[patent_title] => 'Printed circuit board and method for installing printed circuit board onto electro-conductive housing'
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[patent_app_number] => 10/695463
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[pdf_file] => publications/A1/0090/20040090748.pdf
[firstpage_image] =>[orig_patent_app_number] => 10695463
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/695463 | Printed circuit board and method for installing printed circuit board onto electro-conductive housing | Oct 27, 2003 | Issued |
Array
(
[id] => 708728
[patent_doc_number] => 07061087
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-06-13
[patent_title] => 'Multi-package stack module'
[patent_app_type] => utility
[patent_app_number] => 10/678412
[patent_app_country] => US
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[pdf_file] => patents/07/061/07061087.pdf
[firstpage_image] =>[orig_patent_app_number] => 10678412
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/678412 | Multi-package stack module | Oct 1, 2003 | Issued |
Array
(
[id] => 7297626
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Array
(
[id] => 775954
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[firstpage_image] =>[orig_patent_app_number] => 10669688
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/669688 | Electronic module and method for fabricating the same | Sep 24, 2003 | Issued |
Array
(
[id] => 7260381
[patent_doc_number] => 20040150095
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[patent_title] => 'Stacked chip electronic package having laminate carrier and method of making same'
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[pdf_file] => publications/A1/0150/20040150095.pdf
[firstpage_image] =>[orig_patent_app_number] => 10661616
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/661616 | Stacked chip electronic package having laminate carrier and method of making same | Sep 14, 2003 | Issued |