John D Freeman
Examiner (ID: 17393, Phone: (571)270-3469 , Office: P/1787 )
Most Active Art Unit | 1787 |
Art Unit(s) | 4174, 1794, 1787 |
Total Applications | 752 |
Issued Applications | 292 |
Pending Applications | 67 |
Abandoned Applications | 393 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 1585637
[patent_doc_number] => 06358845
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[patent_kind] => B1
[patent_issue_date] => 2002-03-19
[patent_title] => 'Method for forming inter metal dielectric'
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[patent_app_number] => 09/808921
[patent_app_country] => US
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[pdf_file] => patents/06/358/06358845.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/808921 | Method for forming inter metal dielectric | Mar 15, 2001 | Issued |
Array
(
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[patent_doc_number] => 06399492
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[patent_issue_date] => 2002-06-04
[patent_title] => 'Ruthenium silicide processing methods'
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[patent_app_number] => 09/810008
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/810008 | Ruthenium silicide processing methods | Mar 14, 2001 | Issued |
Array
(
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[patent_issue_date] => 2002-06-11
[patent_title] => 'Post-CMP-Cu deposition and CMP to eliminate surface voids'
[patent_app_type] => B1
[patent_app_number] => 09/805651
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Array
(
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[patent_issue_date] => 2002-09-12
[patent_title] => 'Method of manufacturing dual damascene structure'
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Array
(
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[patent_title] => 'Versatile copper-wiring layout design with low-k dielectric integration'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/794621 | Method of manufacturing a bump electrode semiconductor device using photosensitive resin | Feb 27, 2001 | Issued |
Array
(
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Array
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[patent_title] => 'Method of making a dual damascene structure with modified insulation'
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Array
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Array
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[patent_title] => 'Semiconductor device having dual damascene line structure and method for fabricating the same'
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Array
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Array
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[patent_title] => 'Method of fabricating dual damascene with silicon carbide via mask/ARC'
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Array
(
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Array
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Array
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Array
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Array
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Array
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Array
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