John D Freeman
Examiner (ID: 17393, Phone: (571)270-3469 , Office: P/1787 )
Most Active Art Unit | 1787 |
Art Unit(s) | 4174, 1794, 1787 |
Total Applications | 752 |
Issued Applications | 292 |
Pending Applications | 67 |
Abandoned Applications | 393 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 1096039
[patent_doc_number] => 06821872
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-11-23
[patent_title] => 'Method of making a bit line contact device'
[patent_app_type] => B1
[patent_app_number] => 10/709852
[patent_app_country] => US
[patent_app_date] => 2004-06-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/821/06821872.pdf
[firstpage_image] =>[orig_patent_app_number] => 10709852
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/709852 | Method of making a bit line contact device | Jun 1, 2004 | Issued |
Array
(
[id] => 662832
[patent_doc_number] => 07101787
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-09-05
[patent_title] => 'System and method for minimizing increases in via resistance by applying a nitrogen plasma after a titanium liner deposition'
[patent_app_type] => utility
[patent_app_number] => 10/821491
[patent_app_country] => US
[patent_app_date] => 2004-04-09
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[pdf_file] => patents/07/101/07101787.pdf
[firstpage_image] =>[orig_patent_app_number] => 10821491
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/821491 | System and method for minimizing increases in via resistance by applying a nitrogen plasma after a titanium liner deposition | Apr 8, 2004 | Issued |
Array
(
[id] => 773516
[patent_doc_number] => 07001836
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-02-21
[patent_title] => 'Two step trench definition procedure for formation of a dual damascene opening in a stack of insulator layers'
[patent_app_type] => utility
[patent_app_number] => 10/808802
[patent_app_country] => US
[patent_app_date] => 2004-03-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/07/001/07001836.pdf
[firstpage_image] =>[orig_patent_app_number] => 10808802
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/808802 | Two step trench definition procedure for formation of a dual damascene opening in a stack of insulator layers | Mar 24, 2004 | Issued |
Array
(
[id] => 7605431
[patent_doc_number] => 07115498
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-10-03
[patent_title] => 'Method of ultra-low energy ion implantation to form alloy layers in copper'
[patent_app_type] => utility
[patent_app_number] => 10/803852
[patent_app_country] => US
[patent_app_date] => 2004-03-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3076
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[pdf_file] => patents/07/115/07115498.pdf
[firstpage_image] =>[orig_patent_app_number] => 10803852
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/803852 | Method of ultra-low energy ion implantation to form alloy layers in copper | Mar 17, 2004 | Issued |
Array
(
[id] => 1107656
[patent_doc_number] => 06808984
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-10-26
[patent_title] => 'Method for forming a contact opening'
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[patent_app_number] => 10/802552
[patent_app_country] => US
[patent_app_date] => 2004-03-17
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[pdf_file] => patents/06/808/06808984.pdf
[firstpage_image] =>[orig_patent_app_number] => 10802552
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/802552 | Method for forming a contact opening | Mar 16, 2004 | Issued |
Array
(
[id] => 982238
[patent_doc_number] => 06927082
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2005-08-09
[patent_title] => 'Method of evaluating the quality of a contact plug fill'
[patent_app_type] => utility
[patent_app_number] => 10/797672
[patent_app_country] => US
[patent_app_date] => 2004-03-10
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[pdf_file] => patents/06/927/06927082.pdf
[firstpage_image] =>[orig_patent_app_number] => 10797672
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/797672 | Method of evaluating the quality of a contact plug fill | Mar 9, 2004 | Issued |
Array
(
[id] => 6944902
[patent_doc_number] => 20050196951
[patent_country] => US
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[patent_issue_date] => 2005-09-08
[patent_title] => 'METHOD OF FORMING DUAL DAMASCENE STRUCTURES'
[patent_app_type] => utility
[patent_app_number] => 10/708502
[patent_app_country] => US
[patent_app_date] => 2004-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
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[patent_no_of_words] => 5070
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[pdf_file] => publications/A1/0196/20050196951.pdf
[firstpage_image] =>[orig_patent_app_number] => 10708502
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/708502 | METHOD OF FORMING DUAL DAMASCENE STRUCTURES | Mar 7, 2004 | Abandoned |
Array
(
[id] => 7465792
[patent_doc_number] => 20040166693
[patent_country] => US
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[patent_issue_date] => 2004-08-26
[patent_title] => 'Sputtering target compositions, and methods of inhibiting copper diffusion into a substrate'
[patent_app_type] => new
[patent_app_number] => 10/783418
[patent_app_country] => US
[patent_app_date] => 2004-02-19
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[patent_drawing_sheets_cnt] => 9
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[pdf_file] => publications/A1/0166/20040166693.pdf
[firstpage_image] =>[orig_patent_app_number] => 10783418
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/783418 | Sputtering target compositions, and methods of inhibiting copper diffusion into a substrate | Feb 18, 2004 | Abandoned |
Array
(
[id] => 1101746
[patent_doc_number] => 06815337
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-11-09
[patent_title] => 'Method to improve borderless metal line process window for sub-micron designs'
[patent_app_type] => B1
[patent_app_number] => 10/781022
[patent_app_country] => US
[patent_app_date] => 2004-02-17
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[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/06/815/06815337.pdf
[firstpage_image] =>[orig_patent_app_number] => 10781022
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/781022 | Method to improve borderless metal line process window for sub-micron designs | Feb 16, 2004 | Issued |
Array
(
[id] => 645273
[patent_doc_number] => 07119000
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-10-10
[patent_title] => 'Method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/771391
[patent_app_country] => US
[patent_app_date] => 2004-02-05
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/119/07119000.pdf
[firstpage_image] =>[orig_patent_app_number] => 10771391
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/771391 | Method of manufacturing semiconductor device | Feb 4, 2004 | Issued |
Array
(
[id] => 7039643
[patent_doc_number] => 20050159004
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[patent_kind] => A1
[patent_issue_date] => 2005-07-21
[patent_title] => 'System for reducing corrosion effects of metallic semiconductor structures'
[patent_app_type] => utility
[patent_app_number] => 10/760801
[patent_app_country] => US
[patent_app_date] => 2004-01-20
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[pdf_file] => publications/A1/0159/20050159004.pdf
[firstpage_image] =>[orig_patent_app_number] => 10760801
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/760801 | System for reducing corrosion effects of metallic semiconductor structures | Jan 19, 2004 | Abandoned |
Array
(
[id] => 1096066
[patent_doc_number] => 06821882
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-23
[patent_title] => 'Semiconductor device manufacturing method for improving adhesivity of copper metal layer to barrier layer'
[patent_app_type] => B2
[patent_app_number] => 10/758392
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[pdf_file] => patents/06/821/06821882.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/758392 | Semiconductor device manufacturing method for improving adhesivity of copper metal layer to barrier layer | Jan 15, 2004 | Issued |
Array
(
[id] => 7344259
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[patent_title] => 'Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/757372 | Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument | Jan 13, 2004 | Abandoned |
Array
(
[id] => 7061291
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[patent_title] => 'Method and apparatus for low temperature copper to copper bonding'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/746582 | Method and apparatus for low temperature copper to copper bonding | Dec 23, 2003 | Abandoned |
Array
(
[id] => 668436
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[patent_issue_date] => 2006-08-22
[patent_title] => 'Method of forming a penetration electrode and substrate having a penetration electrode'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/736581 | Method of forming a penetration electrode and substrate having a penetration electrode | Dec 16, 2003 | Issued |
Array
(
[id] => 686709
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[patent_issue_date] => 2006-07-18
[patent_title] => 'Method of forming metal line layer in semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/731482 | Method of forming metal line layer in semiconductor device | Dec 9, 2003 | Issued |
Array
(
[id] => 1053156
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[patent_title] => 'Method of fabricating semiconductor integrated circuit device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/721902 | Method of fabricating semiconductor integrated circuit device | Nov 25, 2003 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/722312 | Methods of manufacturing a semiconductor device | Nov 24, 2003 | Issued |
Array
(
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[patent_title] => 'Method of manufacturing a semiconductor device having a silicide film'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/716142 | Method of manufacturing a semiconductor device having a silicide film | Nov 18, 2003 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/706052 | Slurry for CMP, and method of manufacturing semiconductor device | Nov 12, 2003 | Issued |