
John D. Lee
Examiner (ID: 17114)
| Most Active Art Unit | 2501 |
| Art Unit(s) | 2874, 2606, 2507, 2501, 2504, 3621 |
| Total Applications | 2783 |
| Issued Applications | 2467 |
| Pending Applications | 118 |
| Abandoned Applications | 198 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5718445
[patent_doc_number] => 20060071218
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-06
[patent_title] => 'Semiconductior multilayer structurehaving inhomogeneous quantum dots, light-emitting diode using same, semiconductor laser diode, semiconductor optical amplifier, and method for manufacturing them'
[patent_app_type] => utility
[patent_app_number] => 10/539635
[patent_app_country] => US
[patent_app_date] => 2003-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 33
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0071/20060071218.pdf
[firstpage_image] =>[orig_patent_app_number] => 10539635
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/539635 | Semiconductior multilayer structurehaving inhomogeneous quantum dots, light-emitting diode using same, semiconductor laser diode, semiconductor optical amplifier, and method for manufacturing them | Jun 12, 2003 | Abandoned |
| 10/111736 | Method for thermally treating semiconductor substrates | Jun 3, 2003 | Abandoned |
Array
(
[id] => 6636454
[patent_doc_number] => 20030211721
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[patent_kind] => A1
[patent_issue_date] => 2003-11-13
[patent_title] => 'Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 10/446876
[patent_app_country] => US
[patent_app_date] => 2003-05-29
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[pdf_file] => publications/A1/0211/20030211721.pdf
[firstpage_image] =>[orig_patent_app_number] => 10446876
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/446876 | Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof | May 28, 2003 | Issued |
Array
(
[id] => 303960
[patent_doc_number] => 07535100
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[patent_kind] => B2
[patent_issue_date] => 2009-05-19
[patent_title] => 'Wafer bonding of thinned electronic materials and circuits to high performance substrates'
[patent_app_type] => utility
[patent_app_number] => 10/457692
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[patent_app_date] => 2003-05-20
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[firstpage_image] =>[orig_patent_app_number] => 10457692
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/457692 | Wafer bonding of thinned electronic materials and circuits to high performance substrates | May 19, 2003 | Issued |
Array
(
[id] => 988423
[patent_doc_number] => 06921978
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-07-26
[patent_title] => 'Method to generate porous organic dielectric'
[patent_app_type] => utility
[patent_app_number] => 10/249799
[patent_app_country] => US
[patent_app_date] => 2003-05-08
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[firstpage_image] =>[orig_patent_app_number] => 10249799
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/249799 | Method to generate porous organic dielectric | May 7, 2003 | Issued |
Array
(
[id] => 7434116
[patent_doc_number] => 20040065957
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[patent_kind] => A1
[patent_issue_date] => 2004-04-08
[patent_title] => 'Semiconductor device having a low dielectric film and fabrication process thereof'
[patent_app_type] => new
[patent_app_number] => 10/258475
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[patent_app_date] => 2003-04-21
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[firstpage_image] =>[orig_patent_app_number] => 10258475
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/258475 | Semiconductor device having a low dielectric film and fabrication process thereof | Apr 20, 2003 | Abandoned |
Array
(
[id] => 634048
[patent_doc_number] => 07129104
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[patent_issue_date] => 2006-10-31
[patent_title] => 'Wavelength-insensitive radiation coupling for multi-quantum well sensor based on intersubband absorption'
[patent_app_type] => utility
[patent_app_number] => 10/409866
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[pdf_file] => patents/07/129/07129104.pdf
[firstpage_image] =>[orig_patent_app_number] => 10409866
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/409866 | Wavelength-insensitive radiation coupling for multi-quantum well sensor based on intersubband absorption | Apr 7, 2003 | Issued |
Array
(
[id] => 6865281
[patent_doc_number] => 20030190807
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[patent_issue_date] => 2003-10-09
[patent_title] => 'Method for manufacturing semiconductor device'
[patent_app_type] => new
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[pdf_file] => publications/A1/0190/20030190807.pdf
[firstpage_image] =>[orig_patent_app_number] => 10408355
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/408355 | Method for manufacturing semiconductor device | Apr 7, 2003 | Abandoned |
Array
(
[id] => 6730308
[patent_doc_number] => 20030186498
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-10-02
[patent_title] => 'Method for fabricating metal interconnection with reliability using ionized physical vapor deposition'
[patent_app_type] => new
[patent_app_number] => 10/396469
[patent_app_country] => US
[patent_app_date] => 2003-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0186/20030186498.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/396469 | Method for fabricating metal interconnection with reliability using ionized physical vapor deposition | Mar 25, 2003 | Abandoned |
Array
(
[id] => 7406774
[patent_doc_number] => 20040175921
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[patent_kind] => A1
[patent_issue_date] => 2004-09-09
[patent_title] => 'Reduction of the shear stress in copper via\'s in organic interlayer dielectric material'
[patent_app_type] => new
[patent_app_number] => 10/379346
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[patent_app_date] => 2003-03-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/379346 | Reduction of the shear stress in copper via's in organic interlayer dielectric material | Mar 3, 2003 | Issued |
Array
(
[id] => 1062812
[patent_doc_number] => 06849556
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-02-01
[patent_title] => 'Etching method, gate etching method, and method of manufacturing semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 10/364356
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[patent_app_date] => 2003-02-12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/364356 | Etching method, gate etching method, and method of manufacturing semiconductor devices | Feb 11, 2003 | Issued |
Array
(
[id] => 7677531
[patent_doc_number] => 20040152295
[patent_country] => US
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[patent_issue_date] => 2004-08-05
[patent_title] => 'Sacrificial metal liner for copper'
[patent_app_type] => new
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[patent_app_country] => US
[patent_app_date] => 2003-02-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/248636 | Sacrificial metal liner for copper | Feb 2, 2003 | Abandoned |
Array
(
[id] => 1130591
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[patent_title] => 'Post-planarization clean-up'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/356095 | Post-planarization clean-up | Jan 30, 2003 | Issued |
Array
(
[id] => 946590
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[patent_title] => 'Methods for forming metal interconnections for semiconductor devices having multiple metal depositions'
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Array
(
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[patent_title] => 'Leadless leadframe package substitute and stack package'
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Array
(
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[patent_title] => 'Lead frame for resin-molded semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/347306 | Lead frame for resin-molded semiconductor device | Jan 20, 2003 | Issued |
Array
(
[id] => 7324337
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[patent_title] => 'METHOD FOR LOW TEMPERATURE LIQUID-PHASE DEPOSITION AND METHOD FOR CLEANING LIQUID-DEPOSITION APPARATUS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/342245 | Method for low temperature liquid-phase deposition and method for cleaning liquid-phase deposition apparatus | Jan 14, 2003 | Issued |
Array
(
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Array
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