Search

John E. Barlow Jr.

Supervisory Patent Examiner (ID: 10238, Phone: (571)272-2269 , Office: P/2800 )

Most Active Art Unit
2108
Art Unit(s)
2105, 2600, 2800, 2863, 2108, 2853, 2857
Total Applications
691
Issued Applications
547
Pending Applications
31
Abandoned Applications
124

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18600236 [patent_doc_number] => 20230275037 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME [patent_app_type] => utility [patent_app_number] => 18/144902 [patent_app_country] => US [patent_app_date] => 2023-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4768 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18144902 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/144902
Semiconductor substrate and method of sawing the same May 8, 2023 Issued
Array ( [id] => 20416800 [patent_doc_number] => 12500093 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking application [patent_app_type] => utility [patent_app_number] => 18/308036 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5273 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308036 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/308036
Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking application Apr 26, 2023 Issued
Array ( [id] => 19546377 [patent_doc_number] => 20240363413 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => LASER DICING TO CONTROL SPLASH [patent_app_type] => utility [patent_app_number] => 18/308303 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5157 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308303 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/308303
LASER DICING TO CONTROL SPLASH Apr 26, 2023 Pending
Array ( [id] => 19980244 [patent_doc_number] => 12347732 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-01 [patent_title] => Systems and methods for mitigating crack propagation in semiconductor die manufacturing [patent_app_type] => utility [patent_app_number] => 18/306137 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 22 [patent_no_of_words] => 1085 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18306137 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/306137
Systems and methods for mitigating crack propagation in semiconductor die manufacturing Apr 23, 2023 Issued
Array ( [id] => 18774285 [patent_doc_number] => 20230369116 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => MANUFACTURING METHOD OF CHIPS [patent_app_type] => utility [patent_app_number] => 18/299786 [patent_app_country] => US [patent_app_date] => 2023-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5064 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -1 [patent_words_short_claim] => 216 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18299786 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/299786
MANUFACTURING METHOD OF CHIPS Apr 12, 2023 Pending
Array ( [id] => 18679884 [patent_doc_number] => 20230317542 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-05 [patent_title] => SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/128506 [patent_app_country] => US [patent_app_date] => 2023-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5539 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18128506 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/128506
SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE Mar 29, 2023 Pending
Array ( [id] => 18874760 [patent_doc_number] => 11862583 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-02 [patent_title] => Semiconductor wafer thinned by stealth lasing [patent_app_type] => utility [patent_app_number] => 18/128622 [patent_app_country] => US [patent_app_date] => 2023-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 3692 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18128622 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/128622
Semiconductor wafer thinned by stealth lasing Mar 29, 2023 Issued
Array ( [id] => 19484134 [patent_doc_number] => 20240332176 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-03 [patent_title] => Semiconductor Packages and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 18/192521 [patent_app_country] => US [patent_app_date] => 2023-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13405 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18192521 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/192521
Semiconductor Packages and Methods of Forming the Same Mar 28, 2023 Pending
Array ( [id] => 19972490 [patent_doc_number] => 12341111 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-24 [patent_title] => Crackstop structures [patent_app_type] => utility [patent_app_number] => 18/127203 [patent_app_country] => US [patent_app_date] => 2023-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18127203 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/127203
Crackstop structures Mar 27, 2023 Issued
Array ( [id] => 20389281 [patent_doc_number] => 12489016 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-02 [patent_title] => Integrated circuit packages and methods of forming the same [patent_app_type] => utility [patent_app_number] => 18/184968 [patent_app_country] => US [patent_app_date] => 2023-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4539 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18184968 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/184968
Integrated circuit packages and methods of forming the same Mar 15, 2023 Issued
Array ( [id] => 19384614 [patent_doc_number] => 20240274484 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION [patent_app_type] => utility [patent_app_number] => 18/179648 [patent_app_country] => US [patent_app_date] => 2023-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4463 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18179648 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/179648
WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION Mar 6, 2023 Pending
Array ( [id] => 18473166 [patent_doc_number] => 20230207454 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => METHODS OF FORMING A MICROELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 18/175398 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14249 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18175398 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/175398
Methods of forming a microelectronic device Feb 26, 2023 Issued
Array ( [id] => 18456234 [patent_doc_number] => 20230197516 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => Chip Package Based On Through-Silicon-Via Connector And Silicon Interconnection Bridge [patent_app_type] => utility [patent_app_number] => 18/108587 [patent_app_country] => US [patent_app_date] => 2023-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 59674 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 294 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18108587 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/108587
Chip Package Based On Through-Silicon-Via Connector And Silicon Interconnection Bridge Feb 10, 2023 Pending
Array ( [id] => 19670875 [patent_doc_number] => 12183646 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-31 [patent_title] => Semiconductor device with a dielectric between portions [patent_app_type] => utility [patent_app_number] => 18/166922 [patent_app_country] => US [patent_app_date] => 2023-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 7997 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18166922 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/166922
Semiconductor device with a dielectric between portions Feb 8, 2023 Issued
Array ( [id] => 18439992 [patent_doc_number] => 20230187287 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => MAGNETIC PROPERTY MEASURING SYSTEM, A METHOD FOR MEASURING MAGNETIC PROPERTIES, AND A METHOD FOR MANUFACTURING A MAGNETIC MEMORY DEVICE USING THE SAME [patent_app_type] => utility [patent_app_number] => 18/165447 [patent_app_country] => US [patent_app_date] => 2023-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8592 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18165447 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/165447
MAGNETIC PROPERTY MEASURING SYSTEM, A METHOD FOR MEASURING MAGNETIC PROPERTIES, AND A METHOD FOR MANUFACTURING A MAGNETIC MEMORY DEVICE USING THE SAME Feb 6, 2023 Pending
Array ( [id] => 19444546 [patent_doc_number] => 12094837 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-17 [patent_title] => Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material [patent_app_type] => utility [patent_app_number] => 18/106028 [patent_app_country] => US [patent_app_date] => 2023-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 18 [patent_no_of_words] => 6359 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18106028 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/106028
Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material Feb 5, 2023 Issued
Array ( [id] => 18951200 [patent_doc_number] => 11894507 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-06 [patent_title] => Light-emitting device and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/164629 [patent_app_country] => US [patent_app_date] => 2023-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 28 [patent_no_of_words] => 9976 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18164629 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/164629
Light-emitting device and manufacturing method thereof Feb 5, 2023 Issued
Array ( [id] => 19090148 [patent_doc_number] => 11951571 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-09 [patent_title] => Method of forming package structure [patent_app_type] => utility [patent_app_number] => 18/163338 [patent_app_country] => US [patent_app_date] => 2023-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 95 [patent_figures_cnt] => 190 [patent_no_of_words] => 18495 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18163338 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/163338
Method of forming package structure Feb 1, 2023 Issued
Array ( [id] => 18943547 [patent_doc_number] => 20240038686 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF [patent_app_type] => utility [patent_app_number] => 18/103676 [patent_app_country] => US [patent_app_date] => 2023-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10581 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18103676 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/103676
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF Jan 30, 2023 Pending
Array ( [id] => 18350140 [patent_doc_number] => 20230138251 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/089559 [patent_app_country] => US [patent_app_date] => 2022-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8371 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18089559 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/089559
THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF Dec 26, 2022 Pending
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