John Kwon

Array ( [id] => 4226227 [patent_doc_number] => 06135345 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-24 [patent_title] => 'Metal material bonding method' [patent_app_type] => 1 [patent_app_number] => 9/246709 [patent_app_country] => US [patent_app_date] => 1999-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 10032 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/135/06135345.pdf [firstpage_image] =>[orig_patent_app_number] => 246709 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4231346 [patent_doc_number] => 06206271 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-27 [patent_title] => 'Method for sealing a vacuum double wall container made of metal and associated sealed thereof' [patent_app_type] => 1 [patent_app_number] => 9/244526 [patent_app_country] => US [patent_app_date] => 1999-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 2585 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/206/06206271.pdf [firstpage_image] =>[orig_patent_app_number] => 244526 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4273075 [patent_doc_number] => 06179200 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-30 [patent_title] => 'Method for forming solder bumps of improved height and devices formed' [patent_app_type] => 1 [patent_app_number] => 9/243031 [patent_app_country] => US [patent_app_date] => 1999-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3980 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/179/06179200.pdf [firstpage_image] =>[orig_patent_app_number] => 243031 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4113038 [patent_doc_number] => 06119918 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-09-19 [patent_title] => 'Solder head control mechanism' [patent_app_type] => 1 [patent_app_number] => 9/243112 [patent_app_country] => US [patent_app_date] => 1999-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1675 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/119/06119918.pdf [firstpage_image] =>[orig_patent_app_number] => 243112 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4228269 [patent_doc_number] => 06220503 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-24 [patent_title] => 'Rework and underfill nozzle for electronic components' [patent_app_type] => 1 [patent_app_number] => 9/244565 [patent_app_country] => US [patent_app_date] => 1999-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 4837 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/220/06220503.pdf [firstpage_image] =>[orig_patent_app_number] => 244565 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4215151 [patent_doc_number] => 06164524 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-12-26 [patent_title] => 'HIP-bonded body and method of producing the same' [patent_app_type] => 1 [patent_app_number] => 9/243664 [patent_app_country] => US [patent_app_date] => 1999-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4499 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/164/06164524.pdf [firstpage_image] =>[orig_patent_app_number] => 243664 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4149283 [patent_doc_number] => 06138889 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-31 [patent_title] => 'Device for assembling motor-vehicle bodies by spot-welding' [patent_app_type] => 1 [patent_app_number] => 9/240600 [patent_app_country] => US [patent_app_date] => 1999-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4732 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 588 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/138/06138889.pdf [firstpage_image] =>[orig_patent_app_number] => 240600 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1588523 [patent_doc_number] => 06382501 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-07 [patent_title] => 'Furnace brazing' [patent_app_type] => B1 [patent_app_number] => 09/240392 [patent_app_country] => US [patent_app_date] => 1999-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2374 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/382/06382501.pdf [firstpage_image] =>[orig_patent_app_number] => 09240392 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4343613 [patent_doc_number] => 06173884 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-16 [patent_title] => 'Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same' [patent_app_type] => 1 [patent_app_number] => 9/238426 [patent_app_country] => US [patent_app_date] => 1999-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 19 [patent_no_of_words] => 4692 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/173/06173884.pdf [firstpage_image] =>[orig_patent_app_number] => 238426 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4164322 [patent_doc_number] => 06149050 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-21 [patent_title] => 'Method for attaching solderable wire leads to a lead frame' [patent_app_type] => 1 [patent_app_number] => 9/238229 [patent_app_country] => US [patent_app_date] => 1999-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 2115 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/149/06149050.pdf [firstpage_image] =>[orig_patent_app_number] => 238229 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4339212 [patent_doc_number] => 06189764 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-20 [patent_title] => 'Fitting gear' [patent_app_type] => 1 [patent_app_number] => 9/236382 [patent_app_country] => US [patent_app_date] => 1999-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1839 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/189/06189764.pdf [firstpage_image] =>[orig_patent_app_number] => 236382 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4171207 [patent_doc_number] => 06152353 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-28 [patent_title] => 'Printed circuit board header attachment station' [patent_app_type] => 1 [patent_app_number] => 9/245125 [patent_app_country] => US [patent_app_date] => 1999-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 14 [patent_no_of_words] => 4861 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/152/06152353.pdf [firstpage_image] =>[orig_patent_app_number] => 245125 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1454129 [patent_doc_number] => 06390353 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-21 [patent_title] => 'Integral solder and plated sealing cover and method of making the same' [patent_app_type] => B1 [patent_app_number] => 09/226339 [patent_app_country] => US [patent_app_date] => 1999-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 2166 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/390/06390353.pdf [firstpage_image] =>[orig_patent_app_number] => 09226339 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4405288 [patent_doc_number] => 06238819 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-29 [patent_title] => 'Metal foam support, electrode and method of making same' [patent_app_type] => 1 [patent_app_number] => 9/213240 [patent_app_country] => US [patent_app_date] => 1998-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 6154 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/238/06238819.pdf [firstpage_image] =>[orig_patent_app_number] => 213240 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4378409 [patent_doc_number] => 06277524 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-21 [patent_title] => 'Lithium-ion-conductive solid electrolyte and solid-electrolyte lithium battery' [patent_app_type] => 1 [patent_app_number] => 9/206961 [patent_app_country] => US [patent_app_date] => 1998-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 5443 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/277/06277524.pdf [firstpage_image] =>[orig_patent_app_number] => 206961 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4344908 [patent_doc_number] => 06168070 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-02 [patent_title] => 'Method for soldering DPAK-type electronic components to circuit boards' [patent_app_type] => 1 [patent_app_number] => 9/172047 [patent_app_country] => US [patent_app_date] => 1998-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2256 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 342 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/168/06168070.pdf [firstpage_image] =>[orig_patent_app_number] => 172047 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4217454 [patent_doc_number] => 06073830 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Sputter target/backing plate assembly and method of making same' [patent_app_type] => 1 [patent_app_number] => 9/172311 [patent_app_country] => US [patent_app_date] => 1998-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 9 [patent_no_of_words] => 5953 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/073/06073830.pdf [firstpage_image] =>[orig_patent_app_number] => 172311 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4344927 [patent_doc_number] => 06168071 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-02 [patent_title] => 'Method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method' [patent_app_type] => 1 [patent_app_number] => 9/170924 [patent_app_country] => US [patent_app_date] => 1998-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2569 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/168/06168071.pdf [firstpage_image] =>[orig_patent_app_number] => 170924 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4178113 [patent_doc_number] => 06129263 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-10-10 [patent_title] => 'Mounting method of bonding insert material and jig used in the method' [patent_app_type] => 1 [patent_app_number] => 9/169149 [patent_app_country] => US [patent_app_date] => 1998-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 16 [patent_no_of_words] => 3564 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/129/06129263.pdf [firstpage_image] =>[orig_patent_app_number] => 169149 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1322007 [patent_doc_number] => 06595408 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-22 [patent_title] => 'Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement' [patent_app_type] => B1 [patent_app_number] => 09/167763 [patent_app_country] => US [patent_app_date] => 1998-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 4251 [patent_no_of_claims] => 70 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/595/06595408.pdf [firstpage_image] =>[orig_patent_app_number] => 09167763 [rel_patent_id] =>[rel_patent_doc_number] =>)