Search

John M. Parker

Examiner (ID: 11130, Phone: (571)272-8794 , Office: P/2816 )

Most Active Art Unit
2816
Art Unit(s)
2899, 2823, 2816
Total Applications
1173
Issued Applications
1023
Pending Applications
77
Abandoned Applications
108

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 16981590 [patent_doc_number] => 20210225827 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-22 [patent_title] => LOGIC DIE IN A MULTI-CHIP PACKAGE HAVING A CONFIGURABLE PHYSICAL INTERFACE TO ON-PACKAGE MEMORY [patent_app_type] => utility [patent_app_number] => 17/213791 [patent_app_country] => US [patent_app_date] => 2021-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3791 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17213791 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/213791
Logic die in a multi-chip package having a configurable physical interface to on-package memory Mar 25, 2021 Issued
Array ( [id] => 19639658 [patent_doc_number] => 12170273 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-17 [patent_title] => Integrated circuit assemblies with direct chip attach to circuit boards [patent_app_type] => utility [patent_app_number] => 17/210682 [patent_app_country] => US [patent_app_date] => 2021-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 18667 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17210682 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/210682
Integrated circuit assemblies with direct chip attach to circuit boards Mar 23, 2021 Issued
Array ( [id] => 17509100 [patent_doc_number] => 20220102203 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-31 [patent_title] => INTERCONNECT STRUCTURE WITH DIELECTRIC CAP LAYER AND ETCH STOP LAYER STACK [patent_app_type] => utility [patent_app_number] => 17/210015 [patent_app_country] => US [patent_app_date] => 2021-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9807 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17210015 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/210015
Interconnect structure with dielectric cap layer and etch stop layer stack Mar 22, 2021 Issued
Array ( [id] => 16951662 [patent_doc_number] => 20210210354 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-08 [patent_title] => Fin Field-Effect Transistor Device And Method [patent_app_type] => utility [patent_app_number] => 17/206740 [patent_app_country] => US [patent_app_date] => 2021-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10868 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17206740 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/206740
Fin field-effect transistor device and method Mar 18, 2021 Issued
Array ( [id] => 18857197 [patent_doc_number] => 11854788 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Micro assembled LED displays and lighting elements [patent_app_type] => utility [patent_app_number] => 17/203314 [patent_app_country] => US [patent_app_date] => 2021-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 63 [patent_figures_cnt] => 77 [patent_no_of_words] => 33010 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17203314 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/203314
Micro assembled LED displays and lighting elements Mar 15, 2021 Issued
Array ( [id] => 16936452 [patent_doc_number] => 20210202341 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-01 [patent_title] => WIDE BANDGAP SEMICONDUCTOR DEVICE WITH SENSOR ELEMENT [patent_app_type] => utility [patent_app_number] => 17/201468 [patent_app_country] => US [patent_app_date] => 2021-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13461 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -24 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17201468 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/201468
Wide bandgap semiconductor device with sensor element Mar 14, 2021 Issued
Array ( [id] => 18669936 [patent_doc_number] => 11776848 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-03 [patent_title] => Semiconductor device and methods for manufacturing thereof [patent_app_type] => utility [patent_app_number] => 17/199328 [patent_app_country] => US [patent_app_date] => 2021-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 35 [patent_no_of_words] => 5318 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 213 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17199328 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/199328
Semiconductor device and methods for manufacturing thereof Mar 10, 2021 Issued
Array ( [id] => 19507993 [patent_doc_number] => 12119424 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-15 [patent_title] => Automated assembly and mounting of solar cells on a honeycomb support [patent_app_type] => utility [patent_app_number] => 17/198916 [patent_app_country] => US [patent_app_date] => 2021-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 6724 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17198916 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/198916
Automated assembly and mounting of solar cells on a honeycomb support Mar 10, 2021 Issued
Array ( [id] => 18669989 [patent_doc_number] => 11776901 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-03 [patent_title] => Via landing on first and second barrier layers to reduce cleaning time of conductive structure [patent_app_type] => utility [patent_app_number] => 17/197381 [patent_app_country] => US [patent_app_date] => 2021-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 8444 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17197381 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/197381
Via landing on first and second barrier layers to reduce cleaning time of conductive structure Mar 9, 2021 Issued
Array ( [id] => 18751497 [patent_doc_number] => 11810818 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-07 [patent_title] => Metal interconnect structure and method for fabricating the same [patent_app_type] => utility [patent_app_number] => 17/195648 [patent_app_country] => US [patent_app_date] => 2021-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3155 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17195648 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/195648
Metal interconnect structure and method for fabricating the same Mar 8, 2021 Issued
Array ( [id] => 18431632 [patent_doc_number] => 11676862 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-06-13 [patent_title] => Semiconductor device structure and methods of forming the same [patent_app_type] => utility [patent_app_number] => 17/187343 [patent_app_country] => US [patent_app_date] => 2021-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 27 [patent_no_of_words] => 6720 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17187343 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/187343
Semiconductor device structure and methods of forming the same Feb 25, 2021 Issued
Array ( [id] => 18735678 [patent_doc_number] => 11804419 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-31 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/185166 [patent_app_country] => US [patent_app_date] => 2021-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 10611 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17185166 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/185166
Semiconductor device Feb 24, 2021 Issued
Array ( [id] => 17359895 [patent_doc_number] => 20220020691 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-20 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/180491 [patent_app_country] => US [patent_app_date] => 2021-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11951 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 237 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17180491 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/180491
Semiconductor device Feb 18, 2021 Issued
Array ( [id] => 17477404 [patent_doc_number] => 20220084908 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-17 [patent_title] => THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE [patent_app_type] => utility [patent_app_number] => 17/177660 [patent_app_country] => US [patent_app_date] => 2021-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11237 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17177660 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/177660
Through-substrate-via with reentrant profile Feb 16, 2021 Issued
Array ( [id] => 18208897 [patent_doc_number] => 20230055157 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => Thin Sheet-Like Connecting Member and Manufacturing Method therefor, Semiconductor Device and Manufacturing Method therefor, and Power Conversion Device [patent_app_type] => utility [patent_app_number] => 17/759295 [patent_app_country] => US [patent_app_date] => 2021-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7371 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17759295 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/759295
Thin sheet-like connecting member and manufacturing method therefor, semiconductor device and manufacturing method therefor, and power conversion device Feb 14, 2021 Issued
Array ( [id] => 16873532 [patent_doc_number] => 20210166999 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-03 [patent_title] => Chip Package Assembly And Method For Manufacturing The Same [patent_app_type] => utility [patent_app_number] => 17/175018 [patent_app_country] => US [patent_app_date] => 2021-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3181 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 224 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17175018 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/175018
Chip package assembly and method for manufacturing the same Feb 11, 2021 Issued
Array ( [id] => 16858431 [patent_doc_number] => 20210159176 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-27 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/169445 [patent_app_country] => US [patent_app_date] => 2021-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4056 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17169445 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/169445
Semiconductor structure and manufacturing method thereof Feb 5, 2021 Issued
Array ( [id] => 18175182 [patent_doc_number] => 11574899 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-07 [patent_title] => Stretchable display device [patent_app_type] => utility [patent_app_number] => 17/169115 [patent_app_country] => US [patent_app_date] => 2021-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 21035 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17169115 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/169115
Stretchable display device Feb 4, 2021 Issued
Array ( [id] => 17566621 [patent_doc_number] => 20220130770 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-28 [patent_title] => Copper Filled Recess Structure and Method for Making the Same [patent_app_type] => utility [patent_app_number] => 17/164941 [patent_app_country] => US [patent_app_date] => 2021-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3856 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17164941 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/164941
Copper Filled Recess Structure and Method for Making the Same Feb 1, 2021 Abandoned
Array ( [id] => 17780175 [patent_doc_number] => 20220246525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => CONTACTS FOR TWISTED CONDUCTIVE LINES WITHIN MEMORY ARRAYS [patent_app_type] => utility [patent_app_number] => 17/165276 [patent_app_country] => US [patent_app_date] => 2021-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13034 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17165276 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/165276
Contacts for twisted conductive lines within memory arrays Feb 1, 2021 Issued
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