John P. Lacyk

Array ( [id] => 19900280 [patent_doc_number] => 12278218 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/923340 [patent_app_country] => US [patent_app_date] => 2024-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 19 [patent_no_of_words] => 6979 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18923340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19900280 [patent_doc_number] => 12278218 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/923340 [patent_app_country] => US [patent_app_date] => 2024-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 19 [patent_no_of_words] => 6979 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18923340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19900280 [patent_doc_number] => 12278218 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/923340 [patent_app_country] => US [patent_app_date] => 2024-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 19 [patent_no_of_words] => 6979 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18923340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19900280 [patent_doc_number] => 12278218 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/923340 [patent_app_country] => US [patent_app_date] => 2024-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 19 [patent_no_of_words] => 6979 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18923340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19843184 [patent_doc_number] => 12255591 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-18 [patent_title] => Temperature compensation bias circuit and power amplifier [patent_app_type] => utility [patent_app_number] => 18/806715 [patent_app_country] => US [patent_app_date] => 2024-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4637 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 279 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18806715 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20381861 [patent_doc_number] => 20250364354 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-11-27 [patent_title] => PACKAGE STRUCTURE INCLUDING HEAT SINK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/741149 [patent_app_country] => US [patent_app_date] => 2024-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8108 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18741149 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19484160 [patent_doc_number] => 20240332202 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-03 [patent_title] => PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/735194 [patent_app_country] => US [patent_app_date] => 2024-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14718 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18735194 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19467991 [patent_doc_number] => 20240321661 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-26 [patent_title] => PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS [patent_app_type] => utility [patent_app_number] => 18/679091 [patent_app_country] => US [patent_app_date] => 2024-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6652 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18679091 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20111539 [patent_doc_number] => 12362275 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-15 [patent_title] => Method of fabricating package structure including a plurality of antenna patterns [patent_app_type] => utility [patent_app_number] => 18/672001 [patent_app_country] => US [patent_app_date] => 2024-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 1140 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18672001 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19619298 [patent_doc_number] => 20240404978 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/671520 [patent_app_country] => US [patent_app_date] => 2024-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6806 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18671520 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20313534 [patent_doc_number] => 20250331163 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-10-23 [patent_title] => SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING SAME [patent_app_type] => utility [patent_app_number] => 18/665064 [patent_app_country] => US [patent_app_date] => 2024-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18665064 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20612606 [patent_doc_number] => 12588222 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-24 [patent_title] => Semiconductor package including an integrated circuit die and an inductor or a transformer [patent_app_type] => utility [patent_app_number] => 18/663697 [patent_app_country] => US [patent_app_date] => 2024-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 47 [patent_figures_cnt] => 51 [patent_no_of_words] => 7601 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18663697 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20404771 [patent_doc_number] => 12494755 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Apparatus and method of power management using envelope stacking [patent_app_type] => utility [patent_app_number] => 18/661761 [patent_app_country] => US [patent_app_date] => 2024-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 24 [patent_no_of_words] => 7558 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18661761 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19407943 [patent_doc_number] => 20240291454 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => POWER RECONFIGURABLE POWER AMPLIFIER [patent_app_type] => utility [patent_app_number] => 18/659409 [patent_app_country] => US [patent_app_date] => 2024-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7490 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 199 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18659409 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19560194 [patent_doc_number] => 20240371986 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-07 [patent_title] => QUANTUM DEVICE INCLUDING MODERATE FLUORIATED GRAPHENE AND METHOD FOR FABRICATING SAME [patent_app_type] => utility [patent_app_number] => 18/654150 [patent_app_country] => US [patent_app_date] => 2024-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4182 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18654150 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20002524 [patent_doc_number] => 20250140746 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-01 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/654916 [patent_app_country] => US [patent_app_date] => 2024-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18654916 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20346022 [patent_doc_number] => 12469757 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Package structure including a die having a taper-shaped die connector [patent_app_type] => utility [patent_app_number] => 18/652779 [patent_app_country] => US [patent_app_date] => 2024-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 58 [patent_figures_cnt] => 103 [patent_no_of_words] => 16562 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18652779 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20389339 [patent_doc_number] => 12489074 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-02 [patent_title] => Package structure having a device inside a molding member and method of forming the package structure [patent_app_type] => utility [patent_app_number] => 18/650143 [patent_app_country] => US [patent_app_date] => 2024-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 32 [patent_figures_cnt] => 46 [patent_no_of_words] => 4425 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18650143 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19646617 [patent_doc_number] => 20240421137 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-19 [patent_title] => CHIP PACKAGE UNIT, CHIP PACKAGE STACK MODULE, AND METHOD OF MANUFACTURING CHIP PACKAGE STACK MODULE [patent_app_type] => utility [patent_app_number] => 18/645411 [patent_app_country] => US [patent_app_date] => 2024-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2340 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18645411 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19392803 [patent_doc_number] => 20240282673 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES THEREOF [patent_app_type] => utility [patent_app_number] => 18/643322 [patent_app_country] => US [patent_app_date] => 2024-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12304 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18643322 [rel_patent_id] =>[rel_patent_doc_number] =>)