
Johnny Dan Cherry
Examiner (ID: 14332)
| Most Active Art Unit | 3102 |
| Art Unit(s) | 3103, 3102, 2899, 3617, 3652 |
| Total Applications | 2069 |
| Issued Applications | 1880 |
| Pending Applications | 36 |
| Abandoned Applications | 153 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19775375
[patent_doc_number] => 20250056801
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-02-13
[patent_title] => VERTICAL MEMORY DEVICES
[patent_app_type] => utility
[patent_app_number] => 18/929113
[patent_app_country] => US
[patent_app_date] => 2024-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8882
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18929113
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/929113 | Vertical memory devices | Oct 27, 2024 | Issued |
Array
(
[id] => 20553260
[patent_doc_number] => 12564075
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-02-24
[patent_title] => Semiconductor die assemblies with decomposable materials and associated methods and systems
[patent_app_type] => utility
[patent_app_number] => 18/922192
[patent_app_country] => US
[patent_app_date] => 2024-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 1057
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18922192
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/922192 | Semiconductor die assemblies with decomposable materials and associated methods and systems | Oct 20, 2024 | Issued |
Array
(
[id] => 20540569
[patent_doc_number] => 12557659
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-02-17
[patent_title] => Wire bonding method and apparatus for electromagnetic interference shielding
[patent_app_type] => utility
[patent_app_number] => 18/788822
[patent_app_country] => US
[patent_app_date] => 2024-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 34
[patent_no_of_words] => 4332
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 160
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18788822
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/788822 | Wire bonding method and apparatus for electromagnetic interference shielding | Jul 29, 2024 | Issued |
Array
(
[id] => 19951332
[patent_doc_number] => 12322703
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-06-03
[patent_title] => Eccentric via structures for stress reduction
[patent_app_type] => utility
[patent_app_number] => 18/766974
[patent_app_country] => US
[patent_app_date] => 2024-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 20
[patent_no_of_words] => 1075
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18766974
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/766974 | Eccentric via structures for stress reduction | Jul 8, 2024 | Issued |
Array
(
[id] => 19500390
[patent_doc_number] => 20240339408
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-10-10
[patent_title] => Semiconductor Package and Method
[patent_app_type] => utility
[patent_app_number] => 18/745613
[patent_app_country] => US
[patent_app_date] => 2024-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12808
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18745613
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/745613 | Semiconductor package and method | Jun 16, 2024 | Issued |
Array
(
[id] => 19484169
[patent_doc_number] => 20240332211
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-10-03
[patent_title] => PACKAGE STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 18/740503
[patent_app_country] => US
[patent_app_date] => 2024-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8090
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18740503
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/740503 | Package structure | Jun 10, 2024 | Issued |
Array
(
[id] => 19712620
[patent_doc_number] => 20250022762
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-01-16
[patent_title] => SEMICONDUCTOR MODULE
[patent_app_type] => utility
[patent_app_number] => 18/679869
[patent_app_country] => US
[patent_app_date] => 2024-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7650
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 145
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18679869
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/679869 | SEMICONDUCTOR MODULE | May 30, 2024 | Pending |
Array
(
[id] => 19421042
[patent_doc_number] => 20240297166
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-09-05
[patent_title] => INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
[patent_app_type] => utility
[patent_app_number] => 18/664483
[patent_app_country] => US
[patent_app_date] => 2024-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10614
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18664483
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/664483 | Integrated circuit package and method of forming same | May 14, 2024 | Issued |
Array
(
[id] => 19421015
[patent_doc_number] => 20240297139
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-09-05
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/646951
[patent_app_country] => US
[patent_app_date] => 2024-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10676
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 151
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18646951
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/646951 | Semiconductor package | Apr 25, 2024 | Issued |
Array
(
[id] => 19384629
[patent_doc_number] => 20240274499
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-15
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/643144
[patent_app_country] => US
[patent_app_date] => 2024-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8610
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18643144
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/643144 | Semiconductor package | Apr 22, 2024 | Issued |
Array
(
[id] => 19384623
[patent_doc_number] => 20240274493
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-15
[patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/644068
[patent_app_country] => US
[patent_app_date] => 2024-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12384
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18644068
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/644068 | Semiconductor device and manufacturing method thereof | Apr 22, 2024 | Issued |
Array
(
[id] => 20299341
[patent_doc_number] => 20250324584
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-10-16
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/632293
[patent_app_country] => US
[patent_app_date] => 2024-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3332
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 154
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18632293
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/632293 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Apr 10, 2024 | Pending |
Array
(
[id] => 19392848
[patent_doc_number] => 20240282718
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-22
[patent_title] => INTERPOSER WITH WARPAGE-RELIEF TRENCHES
[patent_app_type] => utility
[patent_app_number] => 18/628804
[patent_app_country] => US
[patent_app_date] => 2024-04-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11638
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18628804
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/628804 | Interposer with warpage-relief trenches | Apr 7, 2024 | Issued |
Array
(
[id] => 19804044
[patent_doc_number] => 20250069969
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-02-27
[patent_title] => SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS
[patent_app_type] => utility
[patent_app_number] => 18/627071
[patent_app_country] => US
[patent_app_date] => 2024-04-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6088
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18627071
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/627071 | SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS | Apr 3, 2024 | Pending |
Array
(
[id] => 19321482
[patent_doc_number] => 20240243029
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-18
[patent_title] => SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/623010
[patent_app_country] => US
[patent_app_date] => 2024-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5495
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -12
[patent_words_short_claim] => 167
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18623010
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/623010 | Semiconductor device structures and methods of manufacturing the same | Mar 30, 2024 | Issued |
Array
(
[id] => 19305677
[patent_doc_number] => 20240234257
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-11
[patent_title] => SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS
[patent_app_type] => utility
[patent_app_number] => 18/618259
[patent_app_country] => US
[patent_app_date] => 2024-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4780
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -10
[patent_words_short_claim] => 190
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18618259
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/618259 | Signal isolator having enhanced creepage characteristics | Mar 26, 2024 | Issued |
Array
(
[id] => 19285829
[patent_doc_number] => 20240222306
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-04
[patent_title] => ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/610185
[patent_app_country] => US
[patent_app_date] => 2024-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4419
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 54
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18610185
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/610185 | Electronic package structure and method for manufacturing the same | Mar 18, 2024 | Issued |
Array
(
[id] => 19285668
[patent_doc_number] => 20240222145
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-04
[patent_title] => SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
[patent_app_type] => utility
[patent_app_number] => 18/602553
[patent_app_country] => US
[patent_app_date] => 2024-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6233
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18602553
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/602553 | SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | Mar 11, 2024 | Pending |
Array
(
[id] => 19269613
[patent_doc_number] => 20240213317
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-06-27
[patent_title] => SEMICONDUCTOR DEVICES INCLUDING PROTRUDING INSULATION PORTIONS BETWEEN ACTIVE FINS
[patent_app_type] => utility
[patent_app_number] => 18/596461
[patent_app_country] => US
[patent_app_date] => 2024-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7738
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => 0
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18596461
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/596461 | Semiconductor devices including protruding insulation portions between active fins | Mar 4, 2024 | Issued |
Array
(
[id] => 19468271
[patent_doc_number] => 20240321941
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-09-26
[patent_title] => INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/581664
[patent_app_country] => US
[patent_app_date] => 2024-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5721
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18581664
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/581664 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Feb 19, 2024 | Pending |