
Junghwa M. Im
Examiner (ID: 10638)
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 529 |
| Issued Applications | 282 |
| Pending Applications | 10 |
| Abandoned Applications | 237 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7807665
[patent_doc_number] => 20120058619
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-08
[patent_title] => 'NAND FLASH MEMORY ARRAY HAVING PILLAR STRUCTURE AND FABRICATING METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/222246
[patent_app_country] => US
[patent_app_date] => 2011-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[pdf_file] => publications/A1/0058/20120058619.pdf
[firstpage_image] =>[orig_patent_app_number] => 13222246
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/222246 | NAND flash memory array having pillar structure and fabricating method of the same | Aug 30, 2011 | Issued |
Array
(
[id] => 8244837
[patent_doc_number] => 08202762
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-06-19
[patent_title] => 'Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 13/218916
[patent_app_country] => US
[patent_app_date] => 2011-08-26
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[pdf_file] => patents/08/202/08202762.pdf
[firstpage_image] =>[orig_patent_app_number] => 13218916
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/218916 | Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same | Aug 25, 2011 | Issued |
Array
(
[id] => 8785185
[patent_doc_number] => 08432030
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-04-30
[patent_title] => 'Power electronic package having two substrates with multiple semiconductor chips and electronic components'
[patent_app_type] => utility
[patent_app_number] => 13/171788
[patent_app_country] => US
[patent_app_date] => 2011-06-29
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/171788 | Power electronic package having two substrates with multiple semiconductor chips and electronic components | Jun 28, 2011 | Issued |
Array
(
[id] => 6256341
[patent_doc_number] => 20100295179
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-11-25
[patent_title] => 'BGA SEMICONDUCTOR DEVICE HAVING A DUMMY BUMP'
[patent_app_type] => utility
[patent_app_number] => 12/846120
[patent_app_country] => US
[patent_app_date] => 2010-07-29
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12846120
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/846120 | BGA semiconductor device having a dummy bump | Jul 28, 2010 | Issued |
Array
(
[id] => 6511681
[patent_doc_number] => 20100230143
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-09-16
[patent_title] => 'ELECTRICAL INTERCONNECT STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 12/787485
[patent_app_country] => US
[patent_app_date] => 2010-05-26
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12787485
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/787485 | Electrical interconnect structure | May 25, 2010 | Issued |
Array
(
[id] => 8340087
[patent_doc_number] => 08242010
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-08-14
[patent_title] => 'Electrical interconnect forming method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/787503 | Electrical interconnect forming method | May 25, 2010 | Issued |
Array
(
[id] => 8528316
[patent_doc_number] => 08304889
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-06
[patent_title] => 'Power semiconductor module and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/732238
[patent_app_country] => US
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12732238
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/732238 | Power semiconductor module and fabrication method thereof | Mar 25, 2010 | Issued |
Array
(
[id] => 7666703
[patent_doc_number] => 20110315972
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-12-29
[patent_title] => 'ORGANIC ELECTRONIC ELEMENT AND ITS MANUFACTURING METHOD'
[patent_app_type] => utility
[patent_app_number] => 13/254886
[patent_app_country] => US
[patent_app_date] => 2010-03-03
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13254886
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/254886 | Organic electronic element and its manufacturing method | Mar 2, 2010 | Issued |
Array
(
[id] => 6114431
[patent_doc_number] => 20110073961
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-03-31
[patent_title] => 'SELF-ALIGNED WELL IMPLANT FOR IMPROVING SHORT CHANNEL EFFECTS CONTROL, PARASITIC CAPACITANCE, AND JUNCTION LEAKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/568287
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[pdf_file] => publications/A1/0073/20110073961.pdf
[firstpage_image] =>[orig_patent_app_number] => 12568287
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/568287 | Self-aligned well implant for improving short channel effects control, parasitic capacitance, and junction leakage | Sep 27, 2009 | Issued |
Array
(
[id] => 6358816
[patent_doc_number] => 20100078786
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-01
[patent_title] => 'WIRING SUBSTRATE WITH REINFORCEMENT'
[patent_app_type] => utility
[patent_app_number] => 12/568185
[patent_app_country] => US
[patent_app_date] => 2009-09-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0078/20100078786.pdf
[firstpage_image] =>[orig_patent_app_number] => 12568185
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/568185 | Wiring substrate with reinforcement | Sep 27, 2009 | Issued |
Array
(
[id] => 6470194
[patent_doc_number] => 20100207142
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-08-19
[patent_title] => 'LIGHT-EMITTING DIODE LIGHT SOURCE MODULE'
[patent_app_type] => utility
[patent_app_number] => 12/567806
[patent_app_country] => US
[patent_app_date] => 2009-09-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0207/20100207142.pdf
[firstpage_image] =>[orig_patent_app_number] => 12567806
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/567806 | Light-emitting diode light source module | Sep 27, 2009 | Issued |
Array
(
[id] => 8834430
[patent_doc_number] => 08450186
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-05-28
[patent_title] => 'Optical modulator utilizing wafer bonding technology'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/567645 | Optical modulator utilizing wafer bonding technology | Sep 24, 2009 | Issued |
Array
(
[id] => 6358262
[patent_doc_number] => 20100078706
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-01
[patent_title] => 'Nonvolatile semiconductor memory device and method of manufacturing nonvolatile semiconductor memory device'
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Array
(
[id] => 8317339
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[patent_title] => 'Test structure for determination of TSV depth'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/566726 | Test structure for determination of TSV depth | Sep 24, 2009 | Issued |
Array
(
[id] => 6417067
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[patent_title] => 'Metal Oxide Semiconductor (MOS) Structure and Manufacturing Method Thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/567194 | Metal oxide semiconductor (MOS) structure and manufacturing method thereof | Sep 24, 2009 | Issued |
Array
(
[id] => 6358037
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/585827 | Light-emitting element | Sep 24, 2009 | Issued |
Array
(
[id] => 6358711
[patent_doc_number] => 20100078773
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[patent_title] => 'Semiconductor device and method of forming semiconductor device'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/543104 | Through board stacking of multiple LGA-connected components | Aug 17, 2009 | Issued |
Array
(
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 12386000
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/386000 | Blade arrangement | Apr 26, 2009 | Issued |