
Junghwa M. Im
Examiner (ID: 2065)
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 529 |
| Issued Applications | 282 |
| Pending Applications | 10 |
| Abandoned Applications | 237 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5104447
[patent_doc_number] => 20070063322
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-22
[patent_title] => 'INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 11/162785
[patent_app_country] => US
[patent_app_date] => 2005-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 5017
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0063/20070063322.pdf
[firstpage_image] =>[orig_patent_app_number] => 11162785
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/162785 | Integrated circuit protruding pad package system | Sep 21, 2005 | Issued |
Array
(
[id] => 5104458
[patent_doc_number] => 20070063333
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-22
[patent_title] => 'Semiconductor package with internal shunt resistor'
[patent_app_type] => utility
[patent_app_number] => 11/231595
[patent_app_country] => US
[patent_app_date] => 2005-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3434
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0063/20070063333.pdf
[firstpage_image] =>[orig_patent_app_number] => 11231595
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/231595 | Semiconductor package with internal shunt resistor | Sep 19, 2005 | Abandoned |
Array
(
[id] => 5634991
[patent_doc_number] => 20060065964
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-30
[patent_title] => 'Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/229765
[patent_app_country] => US
[patent_app_date] => 2005-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 13556
[patent_no_of_claims] => 34
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0065/20060065964.pdf
[firstpage_image] =>[orig_patent_app_number] => 11229765
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/229765 | Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor | Sep 19, 2005 | Abandoned |
Array
(
[id] => 5718545
[patent_doc_number] => 20060071318
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-04-06
[patent_title] => 'Methods for manufacturing semiconductor device, semiconductor device and metal mold'
[patent_app_type] => utility
[patent_app_number] => 11/230266
[patent_app_country] => US
[patent_app_date] => 2005-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4315
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0071/20060071318.pdf
[firstpage_image] =>[orig_patent_app_number] => 11230266
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/230266 | Methods for manufacturing semiconductor device, semiconductor device and metal mold | Sep 18, 2005 | Abandoned |
Array
(
[id] => 7703386
[patent_doc_number] => 08089143
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-01-03
[patent_title] => 'Integrated circuit package system using interposer'
[patent_app_type] => utility
[patent_app_number] => 11/162635
[patent_app_country] => US
[patent_app_date] => 2005-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 13
[patent_no_of_words] => 3706
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 47
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/089/08089143.pdf
[firstpage_image] =>[orig_patent_app_number] => 11162635
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/162635 | Integrated circuit package system using interposer | Sep 15, 2005 | Issued |
Array
(
[id] => 877611
[patent_doc_number] => 07358616
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-15
[patent_title] => 'Semiconductor stacked die/wafer configuration and packaging and method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/226025
[patent_app_country] => US
[patent_app_date] => 2005-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 19
[patent_no_of_words] => 6457
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/358/07358616.pdf
[firstpage_image] =>[orig_patent_app_number] => 11226025
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/226025 | Semiconductor stacked die/wafer configuration and packaging and method thereof | Sep 13, 2005 | Issued |
Array
(
[id] => 5724258
[patent_doc_number] => 20060055018
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-16
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/224056
[patent_app_country] => US
[patent_app_date] => 2005-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4787
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0055/20060055018.pdf
[firstpage_image] =>[orig_patent_app_number] => 11224056
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/224056 | Semiconductor device | Sep 12, 2005 | Abandoned |
Array
(
[id] => 5054444
[patent_doc_number] => 20070057365
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-15
[patent_title] => 'Device for preventing low-melting-point heat-transfer medium from oxidization'
[patent_app_type] => utility
[patent_app_number] => 11/223996
[patent_app_country] => US
[patent_app_date] => 2005-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1568
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0057/20070057365.pdf
[firstpage_image] =>[orig_patent_app_number] => 11223996
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/223996 | Device for preventing low-melting-point heat-transfer medium from oxidization | Sep 12, 2005 | Abandoned |
Array
(
[id] => 5645979
[patent_doc_number] => 20060131711
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-22
[patent_title] => 'Package for semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/222806
[patent_app_country] => US
[patent_app_date] => 2005-09-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3802
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0131/20060131711.pdf
[firstpage_image] =>[orig_patent_app_number] => 11222806
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/222806 | Package for semiconductor device | Sep 11, 2005 | Abandoned |
Array
(
[id] => 5180737
[patent_doc_number] => 20070052079
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-08
[patent_title] => 'Multi-chip stacking package structure'
[patent_app_type] => utility
[patent_app_number] => 11/219815
[patent_app_country] => US
[patent_app_date] => 2005-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 5361
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0052/20070052079.pdf
[firstpage_image] =>[orig_patent_app_number] => 11219815
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/219815 | Multi-chip stacking package structure | Sep 6, 2005 | Abandoned |
Array
(
[id] => 5823776
[patent_doc_number] => 20060060958
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-23
[patent_title] => 'Semiconductor package, and fabrication method and carrier thereof'
[patent_app_type] => utility
[patent_app_number] => 11/222386
[patent_app_country] => US
[patent_app_date] => 2005-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 2922
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0060/20060060958.pdf
[firstpage_image] =>[orig_patent_app_number] => 11222386
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/222386 | Semiconductor package, and fabrication method and carrier thereof | Sep 6, 2005 | Abandoned |
Array
(
[id] => 5646006
[patent_doc_number] => 20060131738
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-22
[patent_title] => 'Method and apparatus for chip cooling using a liquid metal thermal interface'
[patent_app_type] => utility
[patent_app_number] => 11/220825
[patent_app_country] => US
[patent_app_date] => 2005-09-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3917
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0131/20060131738.pdf
[firstpage_image] =>[orig_patent_app_number] => 11220825
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/220825 | Method and apparatus for chip cooling using a liquid metal thermal interface | Sep 5, 2005 | Abandoned |
Array
(
[id] => 8165797
[patent_doc_number] => 08174101
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-05-08
[patent_title] => 'Microelectronic devices and microelectronic support devices, and associated assemblies and methods'
[patent_app_type] => utility
[patent_app_number] => 11/218256
[patent_app_country] => US
[patent_app_date] => 2005-09-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/174/08174101.pdf
[firstpage_image] =>[orig_patent_app_number] => 11218256
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/218256 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | Aug 31, 2005 | Issued |
Array
(
[id] => 5145741
[patent_doc_number] => 20070045795
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'MEMS package and method of forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/217576
[patent_app_country] => US
[patent_app_date] => 2005-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
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[patent_no_of_words] => 4009
[patent_no_of_claims] => 20
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20070045795.pdf
[firstpage_image] =>[orig_patent_app_number] => 11217576
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/217576 | MEMS package and method of forming the same | Aug 30, 2005 | Abandoned |
Array
(
[id] => 5145731
[patent_doc_number] => 20070045785
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'Reversible-multiple footprint package and method of manufacturing'
[patent_app_type] => utility
[patent_app_number] => 11/215485
[patent_app_country] => US
[patent_app_date] => 2005-08-30
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20070045785.pdf
[firstpage_image] =>[orig_patent_app_number] => 11215485
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/215485 | Reversible-multiple footprint package and method of manufacturing | Aug 29, 2005 | Abandoned |
Array
(
[id] => 5145790
[patent_doc_number] => 20070045844
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'Alpha particle shields in chip packaging'
[patent_app_type] => utility
[patent_app_number] => 11/211116
[patent_app_country] => US
[patent_app_date] => 2005-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[pdf_file] => publications/A1/0045/20070045844.pdf
[firstpage_image] =>[orig_patent_app_number] => 11211116
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/211116 | Alpha particle shields in chip packaging | Aug 23, 2005 | Abandoned |
Array
(
[id] => 4963115
[patent_doc_number] => 20080105935
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-08
[patent_title] => 'Micromachine Device'
[patent_app_type] => utility
[patent_app_number] => 11/661355
[patent_app_country] => US
[patent_app_date] => 2005-08-15
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0105/20080105935.pdf
[firstpage_image] =>[orig_patent_app_number] => 11661355
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/661355 | Micromachine Device | Aug 14, 2005 | Abandoned |
Array
(
[id] => 5202411
[patent_doc_number] => 20070023890
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-01
[patent_title] => 'Microelectronic device'
[patent_app_type] => utility
[patent_app_number] => 11/192701
[patent_app_country] => US
[patent_app_date] => 2005-07-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0023/20070023890.pdf
[firstpage_image] =>[orig_patent_app_number] => 11192701
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/192701 | Microelectronic device | Jul 27, 2005 | Issued |
Array
(
[id] => 7214553
[patent_doc_number] => 20050253261
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-11-17
[patent_title] => 'Electronic device package structures'
[patent_app_type] => utility
[patent_app_number] => 11/184166
[patent_app_country] => US
[patent_app_date] => 2005-07-19
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0253/20050253261.pdf
[firstpage_image] =>[orig_patent_app_number] => 11184166
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/184166 | Electronic device package structures | Jul 18, 2005 | Issued |
Array
(
[id] => 8772338
[patent_doc_number] => 08426293
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-04-23
[patent_title] => 'IC chip and its manufacturing method'
[patent_app_type] => utility
[patent_app_number] => 11/629861
[patent_app_country] => US
[patent_app_date] => 2005-07-06
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11629861
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/629861 | IC chip and its manufacturing method | Jul 5, 2005 | Issued |