
Junghwa M. Im
Examiner (ID: 10638)
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 529 |
| Issued Applications | 282 |
| Pending Applications | 10 |
| Abandoned Applications | 237 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5763209
[patent_doc_number] => 20060017148
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-26
[patent_title] => 'Semiconductor package and method for its manufacture'
[patent_app_type] => utility
[patent_app_number] => 11/154075
[patent_app_country] => US
[patent_app_date] => 2005-06-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3839
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0017/20060017148.pdf
[firstpage_image] =>[orig_patent_app_number] => 11154075
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/154075 | Semiconductor package and method for its manufacture | Jun 14, 2005 | Abandoned |
Array
(
[id] => 7053926
[patent_doc_number] => 20050275098
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-15
[patent_title] => 'Lead-free conductive jointing bump'
[patent_app_type] => utility
[patent_app_number] => 11/151755
[patent_app_country] => US
[patent_app_date] => 2005-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1807
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0275/20050275098.pdf
[firstpage_image] =>[orig_patent_app_number] => 11151755
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/151755 | Lead-free conductive jointing bump | Jun 13, 2005 | Abandoned |
Array
(
[id] => 5640532
[patent_doc_number] => 20060278987
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-14
[patent_title] => 'INTEGRATED CIRCUIT HAVING A PROGRAMMABLE CONDUCTIVE PATH ON EACH CONDUCTIVE LAYER AND RELATED METHOD OF MODIFYING A VERSION NUMBER ASSIGNED TO THE INTEGRATED CIRCUIT'
[patent_app_type] => utility
[patent_app_number] => 11/160136
[patent_app_country] => US
[patent_app_date] => 2005-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3254
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0278/20060278987.pdf
[firstpage_image] =>[orig_patent_app_number] => 11160136
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/160136 | INTEGRATED CIRCUIT HAVING A PROGRAMMABLE CONDUCTIVE PATH ON EACH CONDUCTIVE LAYER AND RELATED METHOD OF MODIFYING A VERSION NUMBER ASSIGNED TO THE INTEGRATED CIRCUIT | Jun 9, 2005 | Abandoned |
Array
(
[id] => 5640509
[patent_doc_number] => 20060278964
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-14
[patent_title] => 'Plastic integrated circuit package, leadframe and method for use in making the package'
[patent_app_type] => utility
[patent_app_number] => 11/147756
[patent_app_country] => US
[patent_app_date] => 2005-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4866
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0278/20060278964.pdf
[firstpage_image] =>[orig_patent_app_number] => 11147756
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/147756 | Plastic integrated circuit package, leadframe and method for use in making the package | Jun 7, 2005 | Abandoned |
Array
(
[id] => 7228763
[patent_doc_number] => 20050269674
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-08
[patent_title] => 'Semiconductor equipment having multiple semiconductor devices and multiple lead frames'
[patent_app_type] => utility
[patent_app_number] => 11/142346
[patent_app_country] => US
[patent_app_date] => 2005-06-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5513
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0269/20050269674.pdf
[firstpage_image] =>[orig_patent_app_number] => 11142346
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/142346 | Semiconductor equipment having multiple semiconductor devices and multiple lead frames | Jun 1, 2005 | Issued |
Array
(
[id] => 5818038
[patent_doc_number] => 20060022351
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-02-02
[patent_title] => 'Semiconductor device and method for manufacturing the same, package for LCD driver'
[patent_app_type] => utility
[patent_app_number] => 11/143186
[patent_app_country] => US
[patent_app_date] => 2005-06-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5373
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0022/20060022351.pdf
[firstpage_image] =>[orig_patent_app_number] => 11143186
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/143186 | Semiconductor device and method for manufacturing the same, package for LCD driver | Jun 1, 2005 | Abandoned |
Array
(
[id] => 861359
[patent_doc_number] => 07372142
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-13
[patent_title] => 'Vertical conduction power electronic device package and corresponding assembling method'
[patent_app_type] => utility
[patent_app_number] => 11/142816
[patent_app_country] => US
[patent_app_date] => 2005-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 40
[patent_no_of_words] => 5371
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 171
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/372/07372142.pdf
[firstpage_image] =>[orig_patent_app_number] => 11142816
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/142816 | Vertical conduction power electronic device package and corresponding assembling method | May 30, 2005 | Issued |
Array
(
[id] => 7248203
[patent_doc_number] => 20050272252
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-08
[patent_title] => 'Circuit device'
[patent_app_type] => utility
[patent_app_number] => 11/139036
[patent_app_country] => US
[patent_app_date] => 2005-05-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 9053
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0272/20050272252.pdf
[firstpage_image] =>[orig_patent_app_number] => 11139036
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/139036 | Circuit device | May 26, 2005 | Abandoned |
Array
(
[id] => 5765884
[patent_doc_number] => 20050263885
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-01
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/137356
[patent_app_country] => US
[patent_app_date] => 2005-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 7277
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0263/20050263885.pdf
[firstpage_image] =>[orig_patent_app_number] => 11137356
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/137356 | Semiconductor device | May 25, 2005 | Abandoned |
Array
(
[id] => 5765857
[patent_doc_number] => 20050263869
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-01
[patent_title] => 'Semiconductor device and manufacturing process therefor'
[patent_app_type] => utility
[patent_app_number] => 11/138936
[patent_app_country] => US
[patent_app_date] => 2005-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 29
[patent_no_of_words] => 9654
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0263/20050263869.pdf
[firstpage_image] =>[orig_patent_app_number] => 11138936
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/138936 | Semiconductor device and manufacturing process therefor | May 24, 2005 | Abandoned |
Array
(
[id] => 5593916
[patent_doc_number] => 20060157832
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-20
[patent_title] => 'Printed circuit board including embedded chips and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/137345
[patent_app_country] => US
[patent_app_date] => 2005-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 5443
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20060157832.pdf
[firstpage_image] =>[orig_patent_app_number] => 11137345
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/137345 | Printed circuit board including embedded chips and method of fabricating the same | May 23, 2005 | Issued |
Array
(
[id] => 6975530
[patent_doc_number] => 20050285245
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-29
[patent_title] => 'Substrate strip for a transparent package'
[patent_app_type] => utility
[patent_app_number] => 11/135355
[patent_app_country] => US
[patent_app_date] => 2005-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1955
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0285/20050285245.pdf
[firstpage_image] =>[orig_patent_app_number] => 11135355
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/135355 | Substrate strip for a transparent package | May 23, 2005 | Abandoned |
Array
(
[id] => 865576
[patent_doc_number] => 07368819
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-06
[patent_title] => 'Multilayer printed wiring board and multilayer printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/134426
[patent_app_country] => US
[patent_app_date] => 2005-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3255
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 153
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/368/07368819.pdf
[firstpage_image] =>[orig_patent_app_number] => 11134426
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/134426 | Multilayer printed wiring board and multilayer printed circuit board | May 22, 2005 | Issued |
Array
(
[id] => 5838273
[patent_doc_number] => 20060118931
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-08
[patent_title] => 'Assembly structure and method for embedded passive device'
[patent_app_type] => utility
[patent_app_number] => 11/133646
[patent_app_country] => US
[patent_app_date] => 2005-05-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3389
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0118/20060118931.pdf
[firstpage_image] =>[orig_patent_app_number] => 11133646
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/133646 | Assembly structure and method for embedded passive device | May 19, 2005 | Abandoned |
Array
(
[id] => 5622949
[patent_doc_number] => 20060261454
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'System-in-a-package based flash memory card'
[patent_app_type] => utility
[patent_app_number] => 11/133576
[patent_app_country] => US
[patent_app_date] => 2005-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3284
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0261/20060261454.pdf
[firstpage_image] =>[orig_patent_app_number] => 11133576
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/133576 | System-in-a-package based flash memory card | May 18, 2005 | Issued |
Array
(
[id] => 5622944
[patent_doc_number] => 20060261449
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'Memory module system and method'
[patent_app_type] => utility
[patent_app_number] => 11/131835
[patent_app_country] => US
[patent_app_date] => 2005-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 4256
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0261/20060261449.pdf
[firstpage_image] =>[orig_patent_app_number] => 11131835
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/131835 | Memory module system and method | May 17, 2005 | Abandoned |
Array
(
[id] => 315222
[patent_doc_number] => 07525193
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-04-28
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/128156
[patent_app_country] => US
[patent_app_date] => 2005-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 5449
[patent_no_of_claims] => 2
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[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/525/07525193.pdf
[firstpage_image] =>[orig_patent_app_number] => 11128156
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/128156 | Semiconductor device and method of manufacturing the same | May 12, 2005 | Issued |
Array
(
[id] => 5730340
[patent_doc_number] => 20060255454
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Wafer bonding method'
[patent_app_type] => utility
[patent_app_number] => 11/126485
[patent_app_country] => US
[patent_app_date] => 2005-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 1832
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0255/20060255454.pdf
[firstpage_image] =>[orig_patent_app_number] => 11126485
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/126485 | Wafer bonding method | May 9, 2005 | Issued |
Array
(
[id] => 873341
[patent_doc_number] => 07361993
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-22
[patent_title] => 'Terminal pad structures and methods of fabricating same'
[patent_app_type] => utility
[patent_app_number] => 10/908346
[patent_app_country] => US
[patent_app_date] => 2005-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 16
[patent_no_of_words] => 3859
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 239
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/361/07361993.pdf
[firstpage_image] =>[orig_patent_app_number] => 10908346
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/908346 | Terminal pad structures and methods of fabricating same | May 8, 2005 | Issued |
Array
(
[id] => 7108519
[patent_doc_number] => 20050205972
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-22
[patent_title] => 'COF flexible printed wiring board and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/120958
[patent_app_country] => US
[patent_app_date] => 2005-05-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 10811
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0205/20050205972.pdf
[firstpage_image] =>[orig_patent_app_number] => 11120958
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/120958 | COF flexible printed wiring board and semiconductor device | May 3, 2005 | Abandoned |