
Junghwa M. Im
Examiner (ID: 2065)
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 529 |
| Issued Applications | 282 |
| Pending Applications | 10 |
| Abandoned Applications | 237 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5972686
[patent_doc_number] => 20110068441
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-03-24
[patent_title] => 'Screened Electrical Device and a Process for Manufacturing the Same'
[patent_app_type] => utility
[patent_app_number] => 11/579365
[patent_app_country] => US
[patent_app_date] => 2005-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 5598
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0068/20110068441.pdf
[firstpage_image] =>[orig_patent_app_number] => 11579365
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/579365 | Screened electrical device and a process for manufacturing the same | Apr 26, 2005 | Issued |
Array
(
[id] => 72741
[patent_doc_number] => 07755176
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2010-07-13
[patent_title] => 'Die-mounting substrate and method incorporating dummy traces for improving mounting film planarity'
[patent_app_type] => utility
[patent_app_number] => 11/111316
[patent_app_country] => US
[patent_app_date] => 2005-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 15
[patent_no_of_words] => 5127
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 250
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/755/07755176.pdf
[firstpage_image] =>[orig_patent_app_number] => 11111316
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/111316 | Die-mounting substrate and method incorporating dummy traces for improving mounting film planarity | Apr 20, 2005 | Issued |
Array
(
[id] => 896352
[patent_doc_number] => 07342318
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-11
[patent_title] => 'Semiconductor package free of substrate and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/112145
[patent_app_country] => US
[patent_app_date] => 2005-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 28
[patent_no_of_words] => 5223
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 193
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/342/07342318.pdf
[firstpage_image] =>[orig_patent_app_number] => 11112145
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/112145 | Semiconductor package free of substrate and fabrication method thereof | Apr 20, 2005 | Issued |
Array
(
[id] => 6963923
[patent_doc_number] => 20050230820
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-20
[patent_title] => 'Power semiconductor arrangement'
[patent_app_type] => utility
[patent_app_number] => 11/107225
[patent_app_country] => US
[patent_app_date] => 2005-04-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4146
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0230/20050230820.pdf
[firstpage_image] =>[orig_patent_app_number] => 11107225
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/107225 | Power semiconductor arrangement | Apr 14, 2005 | Issued |
Array
(
[id] => 6963908
[patent_doc_number] => 20050230805
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-20
[patent_title] => 'Semiconductor device, method for producing the same, circuit board, and electronic apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/105965
[patent_app_country] => US
[patent_app_date] => 2005-04-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 7947
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0230/20050230805.pdf
[firstpage_image] =>[orig_patent_app_number] => 11105965
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/105965 | Semiconductor device, method for producing the same, circuit board, and electronic apparatus | Apr 13, 2005 | Abandoned |
Array
(
[id] => 8147169
[patent_doc_number] => 08164186
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-24
[patent_title] => 'BGA semiconductor device having a dummy bump'
[patent_app_type] => utility
[patent_app_number] => 11/105546
[patent_app_country] => US
[patent_app_date] => 2005-04-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 21
[patent_no_of_words] => 5525
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 206
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/164/08164186.pdf
[firstpage_image] =>[orig_patent_app_number] => 11105546
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/105546 | BGA semiconductor device having a dummy bump | Apr 13, 2005 | Issued |
Array
(
[id] => 5708157
[patent_doc_number] => 20060049501
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-09
[patent_title] => 'Package having dummy package substrate and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/100526
[patent_app_country] => US
[patent_app_date] => 2005-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3510
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0049/20060049501.pdf
[firstpage_image] =>[orig_patent_app_number] => 11100526
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/100526 | Package having dummy package substrate and method of fabricating the same | Apr 6, 2005 | Abandoned |
Array
(
[id] => 4717149
[patent_doc_number] => 20080239671
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-02
[patent_title] => 'Semiconductor Element Mounting Substrate, Semiconductor Module, And Electric Vehicle'
[patent_app_type] => utility
[patent_app_number] => 11/547851
[patent_app_country] => US
[patent_app_date] => 2005-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 8398
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0239/20080239671.pdf
[firstpage_image] =>[orig_patent_app_number] => 11547851
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/547851 | Semiconductor Element Mounting Substrate, Semiconductor Module, And Electric Vehicle | Apr 5, 2005 | Abandoned |
Array
(
[id] => 7003720
[patent_doc_number] => 20050169033
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-04
[patent_title] => 'Semiconductor module'
[patent_app_type] => utility
[patent_app_number] => 11/095571
[patent_app_country] => US
[patent_app_date] => 2005-04-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 13910
[patent_no_of_claims] => 6
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0169/20050169033.pdf
[firstpage_image] =>[orig_patent_app_number] => 11095571
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/095571 | Semiconductor module | Mar 31, 2005 | Abandoned |
Array
(
[id] => 64891
[patent_doc_number] => 07759697
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-07-20
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/592445
[patent_app_country] => US
[patent_app_date] => 2005-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 2051
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 156
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/759/07759697.pdf
[firstpage_image] =>[orig_patent_app_number] => 10592445
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/592445 | Semiconductor device | Mar 27, 2005 | Issued |
Array
(
[id] => 4624217
[patent_doc_number] => 08003513
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-23
[patent_title] => 'Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures'
[patent_app_type] => utility
[patent_app_number] => 11/086936
[patent_app_country] => US
[patent_app_date] => 2005-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 19
[patent_no_of_words] => 8708
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/003/08003513.pdf
[firstpage_image] =>[orig_patent_app_number] => 11086936
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/086936 | Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures | Mar 21, 2005 | Issued |
Array
(
[id] => 160171
[patent_doc_number] => 07675144
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-09
[patent_title] => 'Method of making wireless semiconductor device, and leadframe used therefor'
[patent_app_type] => utility
[patent_app_number] => 11/085116
[patent_app_country] => US
[patent_app_date] => 2005-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 22
[patent_no_of_words] => 5734
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/675/07675144.pdf
[firstpage_image] =>[orig_patent_app_number] => 11085116
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/085116 | Method of making wireless semiconductor device, and leadframe used therefor | Mar 21, 2005 | Issued |
Array
(
[id] => 7109445
[patent_doc_number] => 20050206899
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-22
[patent_title] => 'Manufacturing method for semiconductor device and determination method for position of semiconductor element'
[patent_app_type] => utility
[patent_app_number] => 11/082505
[patent_app_country] => US
[patent_app_date] => 2005-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3691
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0206/20050206899.pdf
[firstpage_image] =>[orig_patent_app_number] => 11082505
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/082505 | Manufacturing method for semiconductor device and determination method for position of semiconductor element | Mar 16, 2005 | Issued |
Array
(
[id] => 7043415
[patent_doc_number] => 20050248010
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-11-10
[patent_title] => 'Semiconductor package and system module'
[patent_app_type] => utility
[patent_app_number] => 11/080545
[patent_app_country] => US
[patent_app_date] => 2005-03-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3404
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0248/20050248010.pdf
[firstpage_image] =>[orig_patent_app_number] => 11080545
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/080545 | Semiconductor package and system module | Mar 15, 2005 | Abandoned |
Array
(
[id] => 6963936
[patent_doc_number] => 20050230833
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-20
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/079315
[patent_app_country] => US
[patent_app_date] => 2005-03-15
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0230/20050230833.pdf
[firstpage_image] =>[orig_patent_app_number] => 11079315
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/079315 | Semiconductor device | Mar 14, 2005 | Abandoned |
Array
(
[id] => 4661000
[patent_doc_number] => 20080251907
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-16
[patent_title] => 'Electronic Device With Stress Relief Element'
[patent_app_type] => utility
[patent_app_number] => 10/591356
[patent_app_country] => US
[patent_app_date] => 2005-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0251/20080251907.pdf
[firstpage_image] =>[orig_patent_app_number] => 10591356
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/591356 | Electronic Device With Stress Relief Element | Mar 2, 2005 | Abandoned |
Array
(
[id] => 7048514
[patent_doc_number] => 20050184401
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-25
[patent_title] => 'Wiring substrate, manufacturing method thereof, and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/064495
[patent_app_country] => US
[patent_app_date] => 2005-02-23
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0184/20050184401.pdf
[firstpage_image] =>[orig_patent_app_number] => 11064495
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/064495 | Wiring substrate, manufacturing method thereof, and semiconductor device | Feb 22, 2005 | Issued |
Array
(
[id] => 7048485
[patent_doc_number] => 20050184372
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-25
[patent_title] => 'Three-dimensional mounting structure and method for producing the same'
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[patent_app_country] => US
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[pdf_file] => publications/A1/0184/20050184372.pdf
[firstpage_image] =>[orig_patent_app_number] => 11059845
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/059845 | Three-dimensional mounting structure and method for producing the same | Feb 15, 2005 | Abandoned |
Array
(
[id] => 5675571
[patent_doc_number] => 20060180926
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-17
[patent_title] => 'Heat spreader clamping mechanism for semiconductor modules'
[patent_app_type] => utility
[patent_app_number] => 11/056536
[patent_app_country] => US
[patent_app_date] => 2005-02-11
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0180/20060180926.pdf
[firstpage_image] =>[orig_patent_app_number] => 11056536
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/056536 | Heat spreader clamping mechanism for semiconductor modules | Feb 10, 2005 | Abandoned |
Array
(
[id] => 5157494
[patent_doc_number] => 20070170538
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'Process for the fabricating an electronic integrated circuit and electronic integrated circuit thus obtained'
[patent_app_type] => utility
[patent_app_number] => 10/589275
[patent_app_country] => US
[patent_app_date] => 2005-02-10
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0170/20070170538.pdf
[firstpage_image] =>[orig_patent_app_number] => 10589275
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/589275 | Process for fabricating an electronic integrated circuit and electronic integrated circuit thus obtained | Feb 9, 2005 | Issued |