
Junghwa M. Im
Examiner (ID: 10638)
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 529 |
| Issued Applications | 282 |
| Pending Applications | 10 |
| Abandoned Applications | 237 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6994139
[patent_doc_number] => 20050133915
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-23
[patent_title] => 'System and method for increasing the number of IO-s on a ball grid pattern'
[patent_app_type] => utility
[patent_app_number] => 11/013965
[patent_app_country] => US
[patent_app_date] => 2004-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1171
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0133/20050133915.pdf
[firstpage_image] =>[orig_patent_app_number] => 11013965
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/013965 | System and method for increasing the number of IO-s on a ball grid pattern | Dec 14, 2004 | Abandoned |
Array
(
[id] => 7094884
[patent_doc_number] => 20050127487
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-16
[patent_title] => 'Semiconductor package with improved solder joint reliability'
[patent_app_type] => utility
[patent_app_number] => 11/008906
[patent_app_country] => US
[patent_app_date] => 2004-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3548
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0127/20050127487.pdf
[firstpage_image] =>[orig_patent_app_number] => 11008906
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/008906 | Semiconductor package with improved solder joint reliability | Dec 9, 2004 | Abandoned |
Array
(
[id] => 6988773
[patent_doc_number] => 20050087864
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-28
[patent_title] => 'Cavity-down semiconductor package with heat spreader'
[patent_app_type] => utility
[patent_app_number] => 11/006675
[patent_app_country] => US
[patent_app_date] => 2004-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1954
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0087/20050087864.pdf
[firstpage_image] =>[orig_patent_app_number] => 11006675
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/006675 | Cavity-down semiconductor package with heat spreader | Dec 7, 2004 | Abandoned |
Array
(
[id] => 7154543
[patent_doc_number] => 20050082658
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Simplified stacked chip assemblies'
[patent_app_type] => utility
[patent_app_number] => 11/006926
[patent_app_country] => US
[patent_app_date] => 2004-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4538
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0082/20050082658.pdf
[firstpage_image] =>[orig_patent_app_number] => 11006926
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/006926 | Simplified stacked chip assemblies | Dec 7, 2004 | Abandoned |
Array
(
[id] => 465305
[patent_doc_number] => 07239009
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-07-03
[patent_title] => 'Lead frame and semiconductor device having the same as well as method of resin-molding the same'
[patent_app_type] => utility
[patent_app_number] => 11/005040
[patent_app_country] => US
[patent_app_date] => 2004-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 16
[patent_no_of_words] => 8708
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 163
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/239/07239009.pdf
[firstpage_image] =>[orig_patent_app_number] => 11005040
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/005040 | Lead frame and semiconductor device having the same as well as method of resin-molding the same | Dec 6, 2004 | Issued |
Array
(
[id] => 7169179
[patent_doc_number] => 20050121760
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-09
[patent_title] => 'Semiconductor module'
[patent_app_type] => utility
[patent_app_number] => 11/004485
[patent_app_country] => US
[patent_app_date] => 2004-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3038
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0121/20050121760.pdf
[firstpage_image] =>[orig_patent_app_number] => 11004485
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/004485 | Semiconductor module | Dec 2, 2004 | Abandoned |
Array
(
[id] => 5796530
[patent_doc_number] => 20060033207
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-02-16
[patent_title] => 'Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication'
[patent_app_type] => utility
[patent_app_number] => 11/002636
[patent_app_country] => US
[patent_app_date] => 2004-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5316
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0033/20060033207.pdf
[firstpage_image] =>[orig_patent_app_number] => 11002636
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/002636 | Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication | Dec 2, 2004 | Abandoned |
Array
(
[id] => 7169159
[patent_doc_number] => 20050121753
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-09
[patent_title] => 'Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same'
[patent_app_type] => utility
[patent_app_number] => 11/002316
[patent_app_country] => US
[patent_app_date] => 2004-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3324
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0121/20050121753.pdf
[firstpage_image] =>[orig_patent_app_number] => 11002316
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/002316 | Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same | Dec 2, 2004 | Abandoned |
Array
(
[id] => 7169269
[patent_doc_number] => 20050121793
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-09
[patent_title] => 'Crossed power strapped layout for full CMOS circuit design'
[patent_app_type] => utility
[patent_app_number] => 11/002536
[patent_app_country] => US
[patent_app_date] => 2004-12-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3103
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0121/20050121793.pdf
[firstpage_image] =>[orig_patent_app_number] => 11002536
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/002536 | Crossed power strapped layout for full CMOS circuit design | Dec 1, 2004 | Issued |
Array
(
[id] => 4634998
[patent_doc_number] => 08013452
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-09-06
[patent_title] => 'Wire-bonded semiconductor component with reinforced inner connection metallization'
[patent_app_type] => utility
[patent_app_number] => 10/581162
[patent_app_country] => US
[patent_app_date] => 2004-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 4225
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 216
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/013/08013452.pdf
[firstpage_image] =>[orig_patent_app_number] => 10581162
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/581162 | Wire-bonded semiconductor component with reinforced inner connection metallization | Nov 30, 2004 | Issued |
Array
(
[id] => 873331
[patent_doc_number] => 07361986
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-22
[patent_title] => 'Heat stud for stacked chip package'
[patent_app_type] => utility
[patent_app_number] => 11/001385
[patent_app_country] => US
[patent_app_date] => 2004-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 2663
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/361/07361986.pdf
[firstpage_image] =>[orig_patent_app_number] => 11001385
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/001385 | Heat stud for stacked chip package | Nov 30, 2004 | Issued |
Array
(
[id] => 5611717
[patent_doc_number] => 20060113643
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-01
[patent_title] => 'Simplified multichip packaging and package design'
[patent_app_type] => utility
[patent_app_number] => 11/000355
[patent_app_country] => US
[patent_app_date] => 2004-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2427
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0113/20060113643.pdf
[firstpage_image] =>[orig_patent_app_number] => 11000355
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/000355 | Simplified multichip packaging and package design | Nov 29, 2004 | Issued |
Array
(
[id] => 6981169
[patent_doc_number] => 20050151237
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-07-14
[patent_title] => 'Multi-chip assembly and method for driving the same'
[patent_app_type] => utility
[patent_app_number] => 10/999415
[patent_app_country] => US
[patent_app_date] => 2004-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 2960
[patent_no_of_claims] => 10
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[pdf_file] => publications/A1/0151/20050151237.pdf
[firstpage_image] =>[orig_patent_app_number] => 10999415
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/999415 | Multi-chip assembly and method for driving the same | Nov 29, 2004 | Abandoned |
Array
(
[id] => 6936582
[patent_doc_number] => 20050110143
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-26
[patent_title] => 'Capacitor of semiconductor device applying damascene process and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/993576
[patent_app_country] => US
[patent_app_date] => 2004-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2880
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20050110143.pdf
[firstpage_image] =>[orig_patent_app_number] => 10993576
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/993576 | Capacitor of semiconductor device applying damascene process and method of fabricating the same | Nov 18, 2004 | Abandoned |
Array
(
[id] => 5588834
[patent_doc_number] => 20060038285
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-02-23
[patent_title] => 'Electronic apparatus'
[patent_app_type] => utility
[patent_app_number] => 10/991395
[patent_app_country] => US
[patent_app_date] => 2004-11-19
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0038/20060038285.pdf
[firstpage_image] =>[orig_patent_app_number] => 10991395
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/991395 | Electronic apparatus | Nov 18, 2004 | Abandoned |
Array
(
[id] => 5765887
[patent_doc_number] => 20050263887
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-01
[patent_title] => 'Circuit carrier and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/993455
[patent_app_country] => US
[patent_app_date] => 2004-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2518
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0263/20050263887.pdf
[firstpage_image] =>[orig_patent_app_number] => 10993455
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/993455 | Circuit carrier and fabrication method thereof | Nov 17, 2004 | Issued |
Array
(
[id] => 7094929
[patent_doc_number] => 20050127512
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-16
[patent_title] => 'Semiconductor device and the method of producing the same'
[patent_app_type] => utility
[patent_app_number] => 10/989395
[patent_app_country] => US
[patent_app_date] => 2004-11-17
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0127/20050127512.pdf
[firstpage_image] =>[orig_patent_app_number] => 10989395
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/989395 | Semiconductor device and the method of producing the same | Nov 16, 2004 | Issued |
Array
(
[id] => 205358
[patent_doc_number] => 07629674
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2009-12-08
[patent_title] => 'Shielded package having shield fence'
[patent_app_type] => utility
[patent_app_number] => 10/992036
[patent_app_country] => US
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[pdf_file] => patents/07/629/07629674.pdf
[firstpage_image] =>[orig_patent_app_number] => 10992036
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/992036 | Shielded package having shield fence | Nov 16, 2004 | Issued |
Array
(
[id] => 5774135
[patent_doc_number] => 20060103016
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-05-18
[patent_title] => 'Heat sinking structure'
[patent_app_type] => utility
[patent_app_number] => 10/987496
[patent_app_country] => US
[patent_app_date] => 2004-11-12
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0103/20060103016.pdf
[firstpage_image] =>[orig_patent_app_number] => 10987496
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/987496 | Heat sinking structure | Nov 11, 2004 | Abandoned |
Array
(
[id] => 5796537
[patent_doc_number] => 20060033214
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-02-16
[patent_title] => 'Semiconductor device and manufacturing method of the same'
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0033/20060033214.pdf
[firstpage_image] =>[orig_patent_app_number] => 10986385
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/986385 | Semiconductor device and manufacturing method of the same | Nov 11, 2004 | Issued |