Search

Junghwa M. Im

Examiner (ID: 10638)

Most Active Art Unit
2811
Art Unit(s)
2811
Total Applications
529
Issued Applications
282
Pending Applications
10
Abandoned Applications
237

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6994139 [patent_doc_number] => 20050133915 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-23 [patent_title] => 'System and method for increasing the number of IO-s on a ball grid pattern' [patent_app_type] => utility [patent_app_number] => 11/013965 [patent_app_country] => US [patent_app_date] => 2004-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1171 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20050133915.pdf [firstpage_image] =>[orig_patent_app_number] => 11013965 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/013965
System and method for increasing the number of IO-s on a ball grid pattern Dec 14, 2004 Abandoned
Array ( [id] => 7094884 [patent_doc_number] => 20050127487 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-16 [patent_title] => 'Semiconductor package with improved solder joint reliability' [patent_app_type] => utility [patent_app_number] => 11/008906 [patent_app_country] => US [patent_app_date] => 2004-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3548 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20050127487.pdf [firstpage_image] =>[orig_patent_app_number] => 11008906 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/008906
Semiconductor package with improved solder joint reliability Dec 9, 2004 Abandoned
Array ( [id] => 6988773 [patent_doc_number] => 20050087864 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-28 [patent_title] => 'Cavity-down semiconductor package with heat spreader' [patent_app_type] => utility [patent_app_number] => 11/006675 [patent_app_country] => US [patent_app_date] => 2004-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1954 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20050087864.pdf [firstpage_image] =>[orig_patent_app_number] => 11006675 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/006675
Cavity-down semiconductor package with heat spreader Dec 7, 2004 Abandoned
Array ( [id] => 7154543 [patent_doc_number] => 20050082658 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-04-21 [patent_title] => 'Simplified stacked chip assemblies' [patent_app_type] => utility [patent_app_number] => 11/006926 [patent_app_country] => US [patent_app_date] => 2004-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4538 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20050082658.pdf [firstpage_image] =>[orig_patent_app_number] => 11006926 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/006926
Simplified stacked chip assemblies Dec 7, 2004 Abandoned
Array ( [id] => 465305 [patent_doc_number] => 07239009 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-03 [patent_title] => 'Lead frame and semiconductor device having the same as well as method of resin-molding the same' [patent_app_type] => utility [patent_app_number] => 11/005040 [patent_app_country] => US [patent_app_date] => 2004-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 16 [patent_no_of_words] => 8708 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/239/07239009.pdf [firstpage_image] =>[orig_patent_app_number] => 11005040 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/005040
Lead frame and semiconductor device having the same as well as method of resin-molding the same Dec 6, 2004 Issued
Array ( [id] => 7169179 [patent_doc_number] => 20050121760 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-09 [patent_title] => 'Semiconductor module' [patent_app_type] => utility [patent_app_number] => 11/004485 [patent_app_country] => US [patent_app_date] => 2004-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3038 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20050121760.pdf [firstpage_image] =>[orig_patent_app_number] => 11004485 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/004485
Semiconductor module Dec 2, 2004 Abandoned
Array ( [id] => 5796530 [patent_doc_number] => 20060033207 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-02-16 [patent_title] => 'Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication' [patent_app_type] => utility [patent_app_number] => 11/002636 [patent_app_country] => US [patent_app_date] => 2004-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5316 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0033/20060033207.pdf [firstpage_image] =>[orig_patent_app_number] => 11002636 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/002636
Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication Dec 2, 2004 Abandoned
Array ( [id] => 7169159 [patent_doc_number] => 20050121753 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-09 [patent_title] => 'Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same' [patent_app_type] => utility [patent_app_number] => 11/002316 [patent_app_country] => US [patent_app_date] => 2004-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3324 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20050121753.pdf [firstpage_image] =>[orig_patent_app_number] => 11002316 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/002316
Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same Dec 2, 2004 Abandoned
Array ( [id] => 7169269 [patent_doc_number] => 20050121793 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-09 [patent_title] => 'Crossed power strapped layout for full CMOS circuit design' [patent_app_type] => utility [patent_app_number] => 11/002536 [patent_app_country] => US [patent_app_date] => 2004-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3103 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0121/20050121793.pdf [firstpage_image] =>[orig_patent_app_number] => 11002536 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/002536
Crossed power strapped layout for full CMOS circuit design Dec 1, 2004 Issued
Array ( [id] => 4634998 [patent_doc_number] => 08013452 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-06 [patent_title] => 'Wire-bonded semiconductor component with reinforced inner connection metallization' [patent_app_type] => utility [patent_app_number] => 10/581162 [patent_app_country] => US [patent_app_date] => 2004-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 4225 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 216 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/013/08013452.pdf [firstpage_image] =>[orig_patent_app_number] => 10581162 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/581162
Wire-bonded semiconductor component with reinforced inner connection metallization Nov 30, 2004 Issued
Array ( [id] => 873331 [patent_doc_number] => 07361986 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-22 [patent_title] => 'Heat stud for stacked chip package' [patent_app_type] => utility [patent_app_number] => 11/001385 [patent_app_country] => US [patent_app_date] => 2004-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2663 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/361/07361986.pdf [firstpage_image] =>[orig_patent_app_number] => 11001385 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/001385
Heat stud for stacked chip package Nov 30, 2004 Issued
Array ( [id] => 5611717 [patent_doc_number] => 20060113643 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-01 [patent_title] => 'Simplified multichip packaging and package design' [patent_app_type] => utility [patent_app_number] => 11/000355 [patent_app_country] => US [patent_app_date] => 2004-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2427 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20060113643.pdf [firstpage_image] =>[orig_patent_app_number] => 11000355 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/000355
Simplified multichip packaging and package design Nov 29, 2004 Issued
Array ( [id] => 6981169 [patent_doc_number] => 20050151237 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-14 [patent_title] => 'Multi-chip assembly and method for driving the same' [patent_app_type] => utility [patent_app_number] => 10/999415 [patent_app_country] => US [patent_app_date] => 2004-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2960 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20050151237.pdf [firstpage_image] =>[orig_patent_app_number] => 10999415 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/999415
Multi-chip assembly and method for driving the same Nov 29, 2004 Abandoned
Array ( [id] => 6936582 [patent_doc_number] => 20050110143 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-26 [patent_title] => 'Capacitor of semiconductor device applying damascene process and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/993576 [patent_app_country] => US [patent_app_date] => 2004-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2880 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0110/20050110143.pdf [firstpage_image] =>[orig_patent_app_number] => 10993576 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/993576
Capacitor of semiconductor device applying damascene process and method of fabricating the same Nov 18, 2004 Abandoned
Array ( [id] => 5588834 [patent_doc_number] => 20060038285 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-02-23 [patent_title] => 'Electronic apparatus' [patent_app_type] => utility [patent_app_number] => 10/991395 [patent_app_country] => US [patent_app_date] => 2004-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3082 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20060038285.pdf [firstpage_image] =>[orig_patent_app_number] => 10991395 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/991395
Electronic apparatus Nov 18, 2004 Abandoned
Array ( [id] => 5765887 [patent_doc_number] => 20050263887 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-12-01 [patent_title] => 'Circuit carrier and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 10/993455 [patent_app_country] => US [patent_app_date] => 2004-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2518 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0263/20050263887.pdf [firstpage_image] =>[orig_patent_app_number] => 10993455 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/993455
Circuit carrier and fabrication method thereof Nov 17, 2004 Issued
Array ( [id] => 7094929 [patent_doc_number] => 20050127512 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-16 [patent_title] => 'Semiconductor device and the method of producing the same' [patent_app_type] => utility [patent_app_number] => 10/989395 [patent_app_country] => US [patent_app_date] => 2004-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 8002 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20050127512.pdf [firstpage_image] =>[orig_patent_app_number] => 10989395 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/989395
Semiconductor device and the method of producing the same Nov 16, 2004 Issued
Array ( [id] => 205358 [patent_doc_number] => 07629674 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2009-12-08 [patent_title] => 'Shielded package having shield fence' [patent_app_type] => utility [patent_app_number] => 10/992036 [patent_app_country] => US [patent_app_date] => 2004-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5355 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/629/07629674.pdf [firstpage_image] =>[orig_patent_app_number] => 10992036 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/992036
Shielded package having shield fence Nov 16, 2004 Issued
Array ( [id] => 5774135 [patent_doc_number] => 20060103016 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-18 [patent_title] => 'Heat sinking structure' [patent_app_type] => utility [patent_app_number] => 10/987496 [patent_app_country] => US [patent_app_date] => 2004-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2380 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0103/20060103016.pdf [firstpage_image] =>[orig_patent_app_number] => 10987496 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/987496
Heat sinking structure Nov 11, 2004 Abandoned
Array ( [id] => 5796537 [patent_doc_number] => 20060033214 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-02-16 [patent_title] => 'Semiconductor device and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 10/986385 [patent_app_country] => US [patent_app_date] => 2004-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 7377 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0033/20060033214.pdf [firstpage_image] =>[orig_patent_app_number] => 10986385 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/986385
Semiconductor device and manufacturing method of the same Nov 11, 2004 Issued
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