
Junghwa M. Im
Examiner (ID: 2065)
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 529 |
| Issued Applications | 282 |
| Pending Applications | 10 |
| Abandoned Applications | 237 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7515838
[patent_doc_number] => 08039910
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-10-18
[patent_title] => 'Electro-acoustic sensing device'
[patent_app_type] => utility
[patent_app_number] => 11/964995
[patent_app_country] => US
[patent_app_date] => 2007-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 7
[patent_no_of_words] => 4092
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 231
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/039/08039910.pdf
[firstpage_image] =>[orig_patent_app_number] => 11964995
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/964995 | Electro-acoustic sensing device | Dec 26, 2007 | Issued |
Array
(
[id] => 5319869
[patent_doc_number] => 20090057859
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-05
[patent_title] => 'WINDOW-TYPE BALL GRID ARRAY PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/955355
[patent_app_country] => US
[patent_app_date] => 2007-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3043
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0057/20090057859.pdf
[firstpage_image] =>[orig_patent_app_number] => 11955355
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/955355 | WINDOW-TYPE BALL GRID ARRAY PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF | Dec 11, 2007 | Abandoned |
Array
(
[id] => 5561530
[patent_doc_number] => 20090134382
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-28
[patent_title] => 'MULTILEVEL LOGIC BALLISTIC DEFLECTION TRANSISTOR'
[patent_app_type] => utility
[patent_app_number] => 11/945825
[patent_app_country] => US
[patent_app_date] => 2007-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2489
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0134/20090134382.pdf
[firstpage_image] =>[orig_patent_app_number] => 11945825
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/945825 | MULTILEVEL LOGIC BALLISTIC DEFLECTION TRANSISTOR | Nov 26, 2007 | Abandoned |
Array
(
[id] => 4896977
[patent_doc_number] => 20080116590
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-22
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/985936
[patent_app_country] => US
[patent_app_date] => 2007-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3544
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0116/20080116590.pdf
[firstpage_image] =>[orig_patent_app_number] => 11985936
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/985936 | Semiconductor device | Nov 18, 2007 | Abandoned |
Array
(
[id] => 4952674
[patent_doc_number] => 20080185698
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-07
[patent_title] => 'SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/942496
[patent_app_country] => US
[patent_app_date] => 2007-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2718
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0185/20080185698.pdf
[firstpage_image] =>[orig_patent_app_number] => 11942496
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/942496 | SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE | Nov 18, 2007 | Abandoned |
Array
(
[id] => 4935802
[patent_doc_number] => 20080073116
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-27
[patent_title] => 'Semiconductor device having a mount board'
[patent_app_type] => utility
[patent_app_number] => 11/984176
[patent_app_country] => US
[patent_app_date] => 2007-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4136
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0073/20080073116.pdf
[firstpage_image] =>[orig_patent_app_number] => 11984176
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/984176 | Semiconductor device having a mount board | Nov 13, 2007 | Issued |
Array
(
[id] => 4863514
[patent_doc_number] => 20080142573
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-19
[patent_title] => 'PACKAGE STRUCTURE FOR LEAD-FREE PROCESS'
[patent_app_type] => utility
[patent_app_number] => 11/935476
[patent_app_country] => US
[patent_app_date] => 2007-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1352
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0142/20080142573.pdf
[firstpage_image] =>[orig_patent_app_number] => 11935476
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/935476 | PACKAGE STRUCTURE FOR LEAD-FREE PROCESS | Nov 5, 2007 | Abandoned |
Array
(
[id] => 7965737
[patent_doc_number] => 07939383
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-10
[patent_title] => 'Method for fabricating semiconductor package free of substrate'
[patent_app_type] => utility
[patent_app_number] => 11/928708
[patent_app_country] => US
[patent_app_date] => 2007-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 28
[patent_no_of_words] => 5239
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 221
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/939/07939383.pdf
[firstpage_image] =>[orig_patent_app_number] => 11928708
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/928708 | Method for fabricating semiconductor package free of substrate | Oct 29, 2007 | Issued |
Array
(
[id] => 4731276
[patent_doc_number] => 20080048299
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-28
[patent_title] => 'Electronic Component with Semiconductor Chips, Electronic Assembly Composed of Stacked Semiconductor Chips, and Methods for Producing an Electronic Component and an Electronic Assembly'
[patent_app_type] => utility
[patent_app_number] => 11/928941
[patent_app_country] => US
[patent_app_date] => 2007-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 6055
[patent_no_of_claims] => 21
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0048/20080048299.pdf
[firstpage_image] =>[orig_patent_app_number] => 11928941
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/928941 | Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly | Oct 29, 2007 | Issued |
Array
(
[id] => 5327941
[patent_doc_number] => 20090108418
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-30
[patent_title] => 'Non-leaded semiconductor package structure'
[patent_app_type] => utility
[patent_app_number] => 11/976775
[patent_app_country] => US
[patent_app_date] => 2007-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 1594
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20090108418.pdf
[firstpage_image] =>[orig_patent_app_number] => 11976775
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/976775 | Non-leaded semiconductor package structure | Oct 28, 2007 | Abandoned |
Array
(
[id] => 8690582
[patent_doc_number] => 08390111
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-03-05
[patent_title] => 'Wafer bonding method'
[patent_app_type] => utility
[patent_app_number] => 11/877473
[patent_app_country] => US
[patent_app_date] => 2007-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1861
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11877473
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/877473 | Wafer bonding method | Oct 22, 2007 | Issued |
Array
(
[id] => 143033
[patent_doc_number] => 07692203
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-06
[patent_title] => 'Semiconductor light emitting device'
[patent_app_type] => utility
[patent_app_number] => 11/907976
[patent_app_country] => US
[patent_app_date] => 2007-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 15384
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/692/07692203.pdf
[firstpage_image] =>[orig_patent_app_number] => 11907976
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/907976 | Semiconductor light emitting device | Oct 18, 2007 | Issued |
Array
(
[id] => 5439387
[patent_doc_number] => 20090091026
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-09
[patent_title] => 'Stackable semiconductor package having plural pillars per pad'
[patent_app_type] => utility
[patent_app_number] => 11/905946
[patent_app_country] => US
[patent_app_date] => 2007-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 2715
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0091/20090091026.pdf
[firstpage_image] =>[orig_patent_app_number] => 11905946
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/905946 | Stackable semiconductor package having plural pillars per pad | Oct 4, 2007 | Abandoned |
Array
(
[id] => 8726098
[patent_doc_number] => 08405220
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2013-03-26
[patent_title] => 'Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types'
[patent_app_type] => utility
[patent_app_number] => 11/867615
[patent_app_country] => US
[patent_app_date] => 2007-10-04
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11867615
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/867615 | Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types | Oct 3, 2007 | Issued |
Array
(
[id] => 8115667
[patent_doc_number] => 08159055
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-17
[patent_title] => 'Semiconductor device, lead-frame product used for the same and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/853405
[patent_app_country] => US
[patent_app_date] => 2007-09-11
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/159/08159055.pdf
[firstpage_image] =>[orig_patent_app_number] => 11853405
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/853405 | Semiconductor device, lead-frame product used for the same and method for manufacturing the same | Sep 10, 2007 | Issued |
Array
(
[id] => 4691197
[patent_doc_number] => 20080083967
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-10
[patent_title] => 'Capacitor integrated in semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/898175
[patent_app_country] => US
[patent_app_date] => 2007-09-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0083/20080083967.pdf
[firstpage_image] =>[orig_patent_app_number] => 11898175
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/898175 | Capacitor integrated in semiconductor device | Sep 9, 2007 | Abandoned |
Array
(
[id] => 4701817
[patent_doc_number] => 20080061339
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-13
[patent_title] => 'SEMICONDUCTOR DEVICE HAVING CAPACITANCE ELEMENT, ARRANGED CLOSE TO MOS TRANSISTOR AND HAVING DIELECTRIC MADE OF ELECTROSTRICTIVE MATERIAL'
[patent_app_type] => utility
[patent_app_number] => 11/852045
[patent_app_country] => US
[patent_app_date] => 2007-09-07
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0061/20080061339.pdf
[firstpage_image] =>[orig_patent_app_number] => 11852045
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/852045 | SEMICONDUCTOR DEVICE HAVING CAPACITANCE ELEMENT, ARRANGED CLOSE TO MOS TRANSISTOR AND HAVING DIELECTRIC MADE OF ELECTROSTRICTIVE MATERIAL | Sep 6, 2007 | Abandoned |
Array
(
[id] => 5319863
[patent_doc_number] => 20090057853
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-05
[patent_title] => 'Semiconductor power module with flexible circuit leadframe'
[patent_app_type] => utility
[patent_app_number] => 11/899365
[patent_app_country] => US
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[pdf_file] => publications/A1/0057/20090057853.pdf
[firstpage_image] =>[orig_patent_app_number] => 11899365
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/899365 | Semiconductor power module with flexible circuit leadframe | Sep 4, 2007 | Issued |
Array
(
[id] => 4768708
[patent_doc_number] => 20080054364
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-06
[patent_title] => 'SEMICONDUCTOR DEVICE HAVING CMOS DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/847865
[patent_app_country] => US
[patent_app_date] => 2007-08-30
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0054/20080054364.pdf
[firstpage_image] =>[orig_patent_app_number] => 11847865
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/847865 | SEMICONDUCTOR DEVICE HAVING CMOS DEVICE | Aug 29, 2007 | Abandoned |
Array
(
[id] => 4661026
[patent_doc_number] => 20080251933
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-16
[patent_title] => 'METAL INTERCONNECT STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/845746
[patent_app_country] => US
[patent_app_date] => 2007-08-27
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0251/20080251933.pdf
[firstpage_image] =>[orig_patent_app_number] => 11845746
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/845746 | METAL INTERCONNECT STRUCTURE | Aug 26, 2007 | Abandoned |