
Kamand Cuneo
Examiner (ID: 15865)
| Most Active Art Unit | 2841 |
| Art Unit(s) | 2827, 2831, 2841, 2109 |
| Total Applications | 322 |
| Issued Applications | 248 |
| Pending Applications | 15 |
| Abandoned Applications | 59 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1427252
[patent_doc_number] => 06504109
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-01-07
[patent_title] => 'Micro-strip circuit for loss reduction'
[patent_app_type] => B1
[patent_app_number] => 09/605636
[patent_app_country] => US
[patent_app_date] => 2000-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 4357
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/504/06504109.pdf
[firstpage_image] =>[orig_patent_app_number] => 09605636
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/605636 | Micro-strip circuit for loss reduction | Jun 27, 2000 | Issued |
Array
(
[id] => 1477814
[patent_doc_number] => 06344430
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-02-05
[patent_title] => 'Multifilament strand with Ag cladding and a coating of oxygen-permeable ceramic'
[patent_app_type] => B1
[patent_app_number] => 09/598910
[patent_app_country] => US
[patent_app_date] => 2000-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2900
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 61
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/344/06344430.pdf
[firstpage_image] =>[orig_patent_app_number] => 09598910
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/598910 | Multifilament strand with Ag cladding and a coating of oxygen-permeable ceramic | Jun 21, 2000 | Issued |
Array
(
[id] => 1447792
[patent_doc_number] => 06369332
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-09
[patent_title] => 'Metal-base multilayer circuit substrate with heat conducting adhesive'
[patent_app_type] => B1
[patent_app_number] => 09/593059
[patent_app_country] => US
[patent_app_date] => 2000-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 20619
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/369/06369332.pdf
[firstpage_image] =>[orig_patent_app_number] => 09593059
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/593059 | Metal-base multilayer circuit substrate with heat conducting adhesive | Jun 12, 2000 | Issued |
Array
(
[id] => 7643656
[patent_doc_number] => 06429384
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-06
[patent_title] => 'Chip C4 assembly improvement using magnetic force and adhesive'
[patent_app_type] => B1
[patent_app_number] => 09/588836
[patent_app_country] => US
[patent_app_date] => 2000-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 3962
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 5
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/429/06429384.pdf
[firstpage_image] =>[orig_patent_app_number] => 09588836
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/588836 | Chip C4 assembly improvement using magnetic force and adhesive | Jun 6, 2000 | Issued |
Array
(
[id] => 7636166
[patent_doc_number] => 06380494
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-30
[patent_title] => 'Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/559310
[patent_app_country] => US
[patent_app_date] => 2000-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1436
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/380/06380494.pdf
[firstpage_image] =>[orig_patent_app_number] => 09559310
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/559310 | Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board | Apr 26, 2000 | Issued |
Array
(
[id] => 1590391
[patent_doc_number] => 06483046
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-19
[patent_title] => 'Circuit board having burr free castellated plated through holes'
[patent_app_type] => B1
[patent_app_number] => 09/559018
[patent_app_country] => US
[patent_app_date] => 2000-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 2000
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 35
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/483/06483046.pdf
[firstpage_image] =>[orig_patent_app_number] => 09559018
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/559018 | Circuit board having burr free castellated plated through holes | Apr 23, 2000 | Issued |
Array
(
[id] => 7645373
[patent_doc_number] => 06472598
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-29
[patent_title] => 'Electromagnetic interference shield device with conductive encapsulant and dam'
[patent_app_type] => B1
[patent_app_number] => 09/548702
[patent_app_country] => US
[patent_app_date] => 2000-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 2646
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 4
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/472/06472598.pdf
[firstpage_image] =>[orig_patent_app_number] => 09548702
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/548702 | Electromagnetic interference shield device with conductive encapsulant and dam | Apr 12, 2000 | Issued |
Array
(
[id] => 1561276
[patent_doc_number] => 06437251
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-20
[patent_title] => 'Flexible board made by joining two pieces through an adhesive film'
[patent_app_type] => B1
[patent_app_number] => 09/505871
[patent_app_country] => US
[patent_app_date] => 2000-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 3673
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 158
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/437/06437251.pdf
[firstpage_image] =>[orig_patent_app_number] => 09505871
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/505871 | Flexible board made by joining two pieces through an adhesive film | Feb 16, 2000 | Issued |
Array
(
[id] => 1546961
[patent_doc_number] => 06444921
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like'
[patent_app_type] => B1
[patent_app_number] => 09/497542
[patent_app_country] => US
[patent_app_date] => 2000-02-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 21
[patent_no_of_words] => 9085
[patent_no_of_claims] => 39
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/444/06444921.pdf
[firstpage_image] =>[orig_patent_app_number] => 09497542
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/497542 | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like | Feb 2, 2000 | Issued |
Array
(
[id] => 1308963
[patent_doc_number] => 06617509
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-09
[patent_title] => 'Arrangement relating to conductor carriers and methods for the manufacture of such carriers'
[patent_app_type] => B1
[patent_app_number] => 09/495481
[patent_app_country] => US
[patent_app_date] => 2000-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 23
[patent_no_of_words] => 3324
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/617/06617509.pdf
[firstpage_image] =>[orig_patent_app_number] => 09495481
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/495481 | Arrangement relating to conductor carriers and methods for the manufacture of such carriers | Jan 31, 2000 | Issued |
Array
(
[id] => 1590374
[patent_doc_number] => 06483041
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-19
[patent_title] => 'Micro soldered connection'
[patent_app_type] => B1
[patent_app_number] => 09/438245
[patent_app_country] => US
[patent_app_date] => 1999-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 19
[patent_no_of_words] => 8021
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/483/06483041.pdf
[firstpage_image] =>[orig_patent_app_number] => 09438245
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/438245 | Micro soldered connection | Nov 11, 1999 | Issued |
Array
(
[id] => 4424205
[patent_doc_number] => 06225572
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-01
[patent_title] => 'Connecting an electronic card point to a printed circuit on a metal substrate with a capsule'
[patent_app_type] => 1
[patent_app_number] => 9/403966
[patent_app_country] => US
[patent_app_date] => 1999-11-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1243
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/225/06225572.pdf
[firstpage_image] =>[orig_patent_app_number] => 403966
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/403966 | Connecting an electronic card point to a printed circuit on a metal substrate with a capsule | Oct 31, 1999 | Issued |
Array
(
[id] => 1419538
[patent_doc_number] => 06521844
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-18
[patent_title] => 'Through hole in a photoimageable dielectric structure with wired and uncured dielectric'
[patent_app_type] => B1
[patent_app_number] => 09/430076
[patent_app_country] => US
[patent_app_date] => 1999-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 13
[patent_no_of_words] => 7685
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 42
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/521/06521844.pdf
[firstpage_image] =>[orig_patent_app_number] => 09430076
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/430076 | Through hole in a photoimageable dielectric structure with wired and uncured dielectric | Oct 28, 1999 | Issued |
Array
(
[id] => 1518398
[patent_doc_number] => 06501030
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-31
[patent_title] => 'Grounding plug for printed circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/427294
[patent_app_country] => US
[patent_app_date] => 1999-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 2631
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 201
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/501/06501030.pdf
[firstpage_image] =>[orig_patent_app_number] => 09427294
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/427294 | Grounding plug for printed circuit board | Oct 25, 1999 | Issued |
Array
(
[id] => 1480031
[patent_doc_number] => 06452112
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-17
[patent_title] => 'Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/420292
[patent_app_country] => US
[patent_app_date] => 1999-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2765
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 158
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/452/06452112.pdf
[firstpage_image] =>[orig_patent_app_number] => 09420292
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/420292 | Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same | Oct 17, 1999 | Issued |
Array
(
[id] => 1451798
[patent_doc_number] => 06455785
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-24
[patent_title] => 'Bump connection with stacked metal balls'
[patent_app_type] => B1
[patent_app_number] => 09/412241
[patent_app_country] => US
[patent_app_date] => 1999-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 30
[patent_no_of_words] => 4794
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/455/06455785.pdf
[firstpage_image] =>[orig_patent_app_number] => 09412241
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/412241 | Bump connection with stacked metal balls | Oct 4, 1999 | Issued |
Array
(
[id] => 1447786
[patent_doc_number] => 06369330
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-04-09
[patent_title] => 'Printed circuit board with pushbutton and air corridors'
[patent_app_type] => B2
[patent_app_number] => 09/405164
[patent_app_country] => US
[patent_app_date] => 1999-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 1267
[patent_no_of_claims] => 5
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[patent_words_short_claim] => 230
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/369/06369330.pdf
[firstpage_image] =>[orig_patent_app_number] => 09405164
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/405164 | Printed circuit board with pushbutton and air corridors | Sep 23, 1999 | Issued |
| 09/381712 | HIGH-VOLTAGE, HIGH-CURRENT MULTILAYER CIRCUIT BOARD, METHOD FOR THE PRODUCTION THEREOF | Sep 23, 1999 | Abandoned |
Array
(
[id] => 1447797
[patent_doc_number] => 06369334
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-09
[patent_title] => 'Printed circuit board with wire adds and component adds having 7-shaped and semicircular terminations'
[patent_app_type] => B1
[patent_app_number] => 09/404615
[patent_app_country] => US
[patent_app_date] => 1999-09-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 19
[patent_no_of_words] => 4676
[patent_no_of_claims] => 3
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[patent_words_short_claim] => 87
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/369/06369334.pdf
[firstpage_image] =>[orig_patent_app_number] => 09404615
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/404615 | Printed circuit board with wire adds and component adds having 7-shaped and semicircular terminations | Sep 22, 1999 | Issued |
Array
(
[id] => 1440112
[patent_doc_number] => 06334782
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-01
[patent_title] => 'Printed-circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/381662
[patent_app_country] => US
[patent_app_date] => 1999-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 1557
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[patent_words_short_claim] => 66
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/334/06334782.pdf
[firstpage_image] =>[orig_patent_app_number] => 09381662
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/381662 | Printed-circuit board | Sep 19, 1999 | Issued |