Search

Kamand Cuneo

Examiner (ID: 17149)

Most Active Art Unit
2841
Art Unit(s)
2109, 2831, 2841, 2827
Total Applications
322
Issued Applications
248
Pending Applications
15
Abandoned Applications
59

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1335753 [patent_doc_number] => 06596945 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-07-22 [patent_title] => 'Superconducting cable' [patent_app_type] => B1 [patent_app_number] => 09/392278 [patent_app_country] => US [patent_app_date] => 1999-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5674 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 224 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/596/06596945.pdf [firstpage_image] =>[orig_patent_app_number] => 09392278 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/392278
Superconducting cable Sep 8, 1999 Issued
Array ( [id] => 1455040 [patent_doc_number] => 06462283 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-08 [patent_title] => 'Semiconductor package with central circuit pattern' [patent_app_type] => B1 [patent_app_number] => 09/390024 [patent_app_country] => US [patent_app_date] => 1999-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 29 [patent_no_of_words] => 4774 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/462/06462283.pdf [firstpage_image] =>[orig_patent_app_number] => 09390024 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/390024
Semiconductor package with central circuit pattern Sep 2, 1999 Issued
Array ( [id] => 1515879 [patent_doc_number] => 06420661 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-16 [patent_title] => 'Connector element for connecting microelectronic elements' [patent_app_type] => B1 [patent_app_number] => 09/388718 [patent_app_country] => US [patent_app_date] => 1999-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 6241 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/420/06420661.pdf [firstpage_image] =>[orig_patent_app_number] => 09388718 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/388718
Connector element for connecting microelectronic elements Sep 1, 1999 Issued
Array ( [id] => 4276572 [patent_doc_number] => 06323439 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-27 [patent_title] => 'Metal core multilayer resin wiring board with thin portion and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/386334 [patent_app_country] => US [patent_app_date] => 1999-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 7814 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/323/06323439.pdf [firstpage_image] =>[orig_patent_app_number] => 386334 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/386334
Metal core multilayer resin wiring board with thin portion and method for manufacturing the same Aug 30, 1999 Issued
Array ( [id] => 1297015 [patent_doc_number] => 06631280 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-10-07 [patent_title] => 'Oxide superconducting wire with reduced AC loss' [patent_app_type] => B1 [patent_app_number] => 09/380272 [patent_app_country] => US [patent_app_date] => 1999-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4118 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/631/06631280.pdf [firstpage_image] =>[orig_patent_app_number] => 09380272 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/380272
Oxide superconducting wire with reduced AC loss Aug 26, 1999 Issued
09/380178 METHOD AND ARRANGEMENT FOR ATTACHING A COMPONENT Aug 25, 1999 Abandoned
Array ( [id] => 7636169 [patent_doc_number] => 06380491 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-30 [patent_title] => 'Method for producing snap fit apertures for RF shield fences' [patent_app_type] => B1 [patent_app_number] => 09/383701 [patent_app_country] => US [patent_app_date] => 1999-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 3825 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/380/06380491.pdf [firstpage_image] =>[orig_patent_app_number] => 09383701 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/383701
Method for producing snap fit apertures for RF shield fences Aug 25, 1999 Issued
Array ( [id] => 1459633 [patent_doc_number] => 06426467 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-30 [patent_title] => 'Film carrier with adjacent electrical sorting pads' [patent_app_type] => B1 [patent_app_number] => 09/376368 [patent_app_country] => US [patent_app_date] => 1999-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 19 [patent_no_of_words] => 8431 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/426/06426467.pdf [firstpage_image] =>[orig_patent_app_number] => 09376368 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/376368
Film carrier with adjacent electrical sorting pads Aug 17, 1999 Issued
Array ( [id] => 1501907 [patent_doc_number] => 06486394 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-11-26 [patent_title] => 'Process for producing connecting conductors' [patent_app_type] => B1 [patent_app_number] => 09/230713 [patent_app_country] => US [patent_app_date] => 1999-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3196 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/486/06486394.pdf [firstpage_image] =>[orig_patent_app_number] => 09230713 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/230713
Process for producing connecting conductors Aug 15, 1999 Issued
Array ( [id] => 4308678 [patent_doc_number] => 06252178 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-26 [patent_title] => 'Semiconductor device with bonding anchors in build-up layers' [patent_app_type] => 1 [patent_app_number] => 9/373303 [patent_app_country] => US [patent_app_date] => 1999-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2738 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/252/06252178.pdf [firstpage_image] =>[orig_patent_app_number] => 373303 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/373303
Semiconductor device with bonding anchors in build-up layers Aug 11, 1999 Issued
Array ( [id] => 4308348 [patent_doc_number] => 06326560 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-04 [patent_title] => 'Adapter for a ball grid array device' [patent_app_type] => 1 [patent_app_number] => 9/366812 [patent_app_country] => US [patent_app_date] => 1999-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 2172 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 272 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/326/06326560.pdf [firstpage_image] =>[orig_patent_app_number] => 366812 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/366812
Adapter for a ball grid array device Aug 3, 1999 Issued
Array ( [id] => 1536325 [patent_doc_number] => 06337307 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-08 [patent_title] => 'Oxide superconducting conductor with intermediate layer having aligned crystal orientation' [patent_app_type] => B1 [patent_app_number] => 09/363816 [patent_app_country] => US [patent_app_date] => 1999-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 8712 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/337/06337307.pdf [firstpage_image] =>[orig_patent_app_number] => 09363816 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/363816
Oxide superconducting conductor with intermediate layer having aligned crystal orientation Jul 29, 1999 Issued
Array ( [id] => 1460971 [patent_doc_number] => 06392159 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-21 [patent_title] => 'Embedded structure for engineering change and repair of circuit boards' [patent_app_type] => B1 [patent_app_number] => 09/362273 [patent_app_country] => US [patent_app_date] => 1999-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 1744 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/392/06392159.pdf [firstpage_image] =>[orig_patent_app_number] => 09362273 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/362273
Embedded structure for engineering change and repair of circuit boards Jul 26, 1999 Issued
Array ( [id] => 1546969 [patent_doc_number] => 06444924 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-03 [patent_title] => 'Printed wiring board with joining pin and manufacturing method therefor' [patent_app_type] => B1 [patent_app_number] => 09/359981 [patent_app_country] => US [patent_app_date] => 1999-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 29 [patent_no_of_words] => 10087 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/444/06444924.pdf [firstpage_image] =>[orig_patent_app_number] => 09359981 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/359981
Printed wiring board with joining pin and manufacturing method therefor Jul 22, 1999 Issued
Array ( [id] => 1546946 [patent_doc_number] => 06444917 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-03 [patent_title] => 'Encapsulated ceramic superconductors' [patent_app_type] => B1 [patent_app_number] => 09/360318 [patent_app_country] => US [patent_app_date] => 1999-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 8712 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/444/06444917.pdf [firstpage_image] =>[orig_patent_app_number] => 09360318 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/360318
Encapsulated ceramic superconductors Jul 22, 1999 Issued
Array ( [id] => 1476058 [patent_doc_number] => 06388208 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-14 [patent_title] => 'Multi-connection via with electrically isolated segments' [patent_app_type] => B1 [patent_app_number] => 09/360002 [patent_app_country] => US [patent_app_date] => 1999-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 59 [patent_no_of_words] => 15912 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/388/06388208.pdf [firstpage_image] =>[orig_patent_app_number] => 09360002 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/360002
Multi-connection via with electrically isolated segments Jul 22, 1999 Issued
09/356608 DIRECT ATTACHED BOARD TO BOARD INTERCONNECTION AND METHOD FOR FORMING SAME Jul 18, 1999 Abandoned
Array ( [id] => 4340050 [patent_doc_number] => 06333469 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-25 [patent_title] => 'Wafer-scale package structure and circuit board attached thereto' [patent_app_type] => 1 [patent_app_number] => 9/353385 [patent_app_country] => US [patent_app_date] => 1999-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 3951 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/333/06333469.pdf [firstpage_image] =>[orig_patent_app_number] => 353385 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/353385
Wafer-scale package structure and circuit board attached thereto Jul 14, 1999 Issued
Array ( [id] => 4280925 [patent_doc_number] => 06281445 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-28 [patent_title] => 'Device and method for connecting two electronic components' [patent_app_type] => 1 [patent_app_number] => 9/352321 [patent_app_country] => US [patent_app_date] => 1999-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 23 [patent_no_of_words] => 3672 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/281/06281445.pdf [firstpage_image] =>[orig_patent_app_number] => 352321 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/352321
Device and method for connecting two electronic components Jul 11, 1999 Issued
Array ( [id] => 1596666 [patent_doc_number] => 06384342 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-07 [patent_title] => 'Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal' [patent_app_type] => B1 [patent_app_number] => 09/334565 [patent_app_country] => US [patent_app_date] => 1999-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 7604 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/384/06384342.pdf [firstpage_image] =>[orig_patent_app_number] => 09334565 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/334565
Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal Jun 20, 1999 Issued
Menu