Kamand Cuneo

Array ( [id] => 4359544 [patent_doc_number] => 06218629 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-17 [patent_title] => 'Module with metal-ion matrix induced dendrites for interconnection' [patent_app_type] => 1 [patent_app_number] => 9/233890 [patent_app_country] => US [patent_app_date] => 1999-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3658 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/218/06218629.pdf [firstpage_image] =>[orig_patent_app_number] => 233890 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4264437 [patent_doc_number] => 06259039 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-10 [patent_title] => 'Surface mount connector with pins in vias' [patent_app_type] => 1 [patent_app_number] => 9/222604 [patent_app_country] => US [patent_app_date] => 1998-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3066 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/259/06259039.pdf [firstpage_image] =>[orig_patent_app_number] => 222604 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1578653 [patent_doc_number] => 06357111 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-03-19 [patent_title] => 'Inter-electrode connection structure, inter-electrode connection method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic apparatus' [patent_app_type] => B1 [patent_app_number] => 09/202846 [patent_app_country] => US [patent_app_date] => 1998-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 7256 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/357/06357111.pdf [firstpage_image] =>[orig_patent_app_number] => 09202846 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4323731 [patent_doc_number] => 06248961 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-19 [patent_title] => 'Wave solder application for ball grid array modules and solder plug' [patent_app_type] => 1 [patent_app_number] => 9/211976 [patent_app_country] => US [patent_app_date] => 1998-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3108 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/248/06248961.pdf [firstpage_image] =>[orig_patent_app_number] => 211976 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4232425 [patent_doc_number] => 06256877 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-10 [patent_title] => 'Method for transforming a substrate with edge contacts into a ball grid array' [patent_app_type] => 1 [patent_app_number] => 9/209406 [patent_app_country] => US [patent_app_date] => 1998-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2026 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 230 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/256/06256877.pdf [firstpage_image] =>[orig_patent_app_number] => 209406 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4359837 [patent_doc_number] => 06201194 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-13 [patent_title] => 'Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric' [patent_app_type] => 1 [patent_app_number] => 9/203978 [patent_app_country] => US [patent_app_date] => 1998-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 15 [patent_no_of_words] => 2747 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/201/06201194.pdf [firstpage_image] =>[orig_patent_app_number] => 203978 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4330352 [patent_doc_number] => 06329606 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-11 [patent_title] => 'Grid array assembly of circuit boards with singulation grooves' [patent_app_type] => 1 [patent_app_number] => 9/203826 [patent_app_country] => US [patent_app_date] => 1998-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3646 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/329/06329606.pdf [firstpage_image] =>[orig_patent_app_number] => 203826 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4332226 [patent_doc_number] => 06320139 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-20 [patent_title] => 'Reflow selective shorting' [patent_app_type] => 1 [patent_app_number] => 9/190688 [patent_app_country] => US [patent_app_date] => 1998-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 2705 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/320/06320139.pdf [firstpage_image] =>[orig_patent_app_number] => 190688 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1508971 [patent_doc_number] => 06441315 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-27 [patent_title] => 'Contact structures with blades having a wiping motion' [patent_app_type] => B1 [patent_app_number] => 09/189761 [patent_app_country] => US [patent_app_date] => 1998-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 33 [patent_no_of_words] => 8558 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/441/06441315.pdf [firstpage_image] =>[orig_patent_app_number] => 09189761 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4255957 [patent_doc_number] => 06207906 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-27 [patent_title] => 'PCB having holes between terminals and method of making the same' [patent_app_type] => 1 [patent_app_number] => 9/185677 [patent_app_country] => US [patent_app_date] => 1998-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 2100 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/207/06207906.pdf [firstpage_image] =>[orig_patent_app_number] => 185677 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5812684 [patent_doc_number] => 20020038722 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-04 [patent_title] => 'INTEGRATED CIRCUIT MOUNTING STRUCTURE AND MOUNTING METHOD THEREOF' [patent_app_type] => new [patent_app_number] => 09/181639 [patent_app_country] => US [patent_app_date] => 1998-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2691 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20020038722.pdf [firstpage_image] =>[orig_patent_app_number] => 09181639 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4323745 [patent_doc_number] => 06248962 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-19 [patent_title] => 'Electrically conductive projections of the same material as their substrate' [patent_app_type] => 1 [patent_app_number] => 9/178047 [patent_app_country] => US [patent_app_date] => 1998-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 3233 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/248/06248962.pdf [firstpage_image] =>[orig_patent_app_number] => 178047 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4413250 [patent_doc_number] => 06229096 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-08 [patent_title] => 'Nonwoven reinforcement for printed wiring base board and process for producing the same' [patent_app_type] => 1 [patent_app_number] => 9/166578 [patent_app_country] => US [patent_app_date] => 1998-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 11970 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/229/06229096.pdf [firstpage_image] =>[orig_patent_app_number] => 166578 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4361883 [patent_doc_number] => 06175088 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-16 [patent_title] => 'Multi-layer printed-wiring boards with inner power and ground layers' [patent_app_type] => 1 [patent_app_number] => 9/166828 [patent_app_country] => US [patent_app_date] => 1998-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2331 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/175/06175088.pdf [firstpage_image] =>[orig_patent_app_number] => 166828 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4100318 [patent_doc_number] => 06096976 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-01 [patent_title] => 'Relay apparatus between relative rotary materials' [patent_app_type] => 1 [patent_app_number] => 9/161958 [patent_app_country] => US [patent_app_date] => 1998-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 4601 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/096/06096976.pdf [firstpage_image] =>[orig_patent_app_number] => 161958 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1440813 [patent_doc_number] => 06495773 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-12-17 [patent_title] => 'Wire bonded device with ball-shaped bonds' [patent_app_type] => B1 [patent_app_number] => 09/160536 [patent_app_country] => US [patent_app_date] => 1998-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 36 [patent_no_of_words] => 8578 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/495/06495773.pdf [firstpage_image] =>[orig_patent_app_number] => 09160536 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4263528 [patent_doc_number] => 06204456 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-20 [patent_title] => 'Filling open through holes in a multilayer board' [patent_app_type] => 1 [patent_app_number] => 9/159938 [patent_app_country] => US [patent_app_date] => 1998-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3834 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/204/06204456.pdf [firstpage_image] =>[orig_patent_app_number] => 159938 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4359708 [patent_doc_number] => 06201185 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-13 [patent_title] => 'Substrate for mounting electronic part having conductive projections and process for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/091505 [patent_app_country] => US [patent_app_date] => 1998-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 30 [patent_no_of_words] => 9488 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/201/06201185.pdf [firstpage_image] =>[orig_patent_app_number] => 091505 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4193739 [patent_doc_number] => 06153833 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-11-28 [patent_title] => 'Integrated circuit having interconnect lines separated by a dielectric having a capping layer' [patent_app_type] => 1 [patent_app_number] => 9/148098 [patent_app_country] => US [patent_app_date] => 1998-09-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 14 [patent_no_of_words] => 5143 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/153/06153833.pdf [firstpage_image] =>[orig_patent_app_number] => 148098 [rel_patent_id] =>[rel_patent_doc_number] =>)