| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 4409961
[patent_doc_number] => 06232558
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-15
[patent_title] => 'Electronic component mounting base board having heat slug with slits and projections'
[patent_app_type] => 1
[patent_app_number] => 9/064770
[patent_app_country] => US
[patent_app_date] => 1998-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/06/232/06232558.pdf
[firstpage_image] =>[orig_patent_app_number] => 064770
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/064770 | Electronic component mounting base board having heat slug with slits and projections | Apr 22, 1998 | Issued |
Array
(
[id] => 4364679
[patent_doc_number] => 06255596
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-03
[patent_title] => 'Aluminum stabilized superconductor with Cu and Mg'
[patent_app_type] => 1
[patent_app_number] => 9/064836
[patent_app_country] => US
[patent_app_date] => 1998-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 5045
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[patent_words_short_claim] => 133
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/255/06255596.pdf
[firstpage_image] =>[orig_patent_app_number] => 064836
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/064836 | Aluminum stabilized superconductor with Cu and Mg | Apr 22, 1998 | Issued |
Array
(
[id] => 7645361
[patent_doc_number] => 06472610
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-29
[patent_title] => 'Support structure for electronic component'
[patent_app_type] => B1
[patent_app_number] => 09/059211
[patent_app_country] => US
[patent_app_date] => 1998-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 18
[patent_no_of_words] => 7631
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[pdf_file] => patents/06/472/06472610.pdf
[firstpage_image] =>[orig_patent_app_number] => 09059211
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/059211 | Support structure for electronic component | Apr 12, 1998 | Issued |
Array
(
[id] => 1496495
[patent_doc_number] => 06403891
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-11
[patent_title] => 'Metallization removal under the laser mark area for substrates'
[patent_app_type] => B1
[patent_app_number] => 09/049888
[patent_app_country] => US
[patent_app_date] => 1998-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 1267
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 98
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/403/06403891.pdf
[firstpage_image] =>[orig_patent_app_number] => 09049888
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/049888 | Metallization removal under the laser mark area for substrates | Mar 26, 1998 | Issued |
| 09/049666 | METHOD FOR MAKING ELECTRICAL CONNECTIONS BETWEEN CONDUCTORS SEPARATED BY A DIELECTRIC | Mar 26, 1998 | Abandoned |
Array
(
[id] => 1495348
[patent_doc_number] => 06342680
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-29
[patent_title] => 'Conductive plastic with lead-free solder additive'
[patent_app_type] => B1
[patent_app_number] => 09/027214
[patent_app_country] => US
[patent_app_date] => 1998-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 4809
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[pdf_file] => patents/06/342/06342680.pdf
[firstpage_image] =>[orig_patent_app_number] => 09027214
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/027214 | Conductive plastic with lead-free solder additive | Feb 19, 1998 | Issued |
Array
(
[id] => 4242725
[patent_doc_number] => 06166333
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-26
[patent_title] => 'Bumps with plural under-bump dielectric layers'
[patent_app_type] => 1
[patent_app_number] => 9/006805
[patent_app_country] => US
[patent_app_date] => 1998-01-14
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/166/06166333.pdf
[firstpage_image] =>[orig_patent_app_number] => 006805
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/006805 | Bumps with plural under-bump dielectric layers | Jan 13, 1998 | Issued |
| 08/973170 | ELECTRIC CONDUCTORS AND CABLES | Dec 14, 1997 | Abandoned |
Array
(
[id] => 4221158
[patent_doc_number] => 06087596
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-11
[patent_title] => 'Solder joints for printed circuit boards having intermediate metallic member'
[patent_app_type] => 1
[patent_app_number] => 8/985227
[patent_app_country] => US
[patent_app_date] => 1997-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/06/087/06087596.pdf
[firstpage_image] =>[orig_patent_app_number] => 985227
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/985227 | Solder joints for printed circuit boards having intermediate metallic member | Dec 3, 1997 | Issued |
Array
(
[id] => 4135938
[patent_doc_number] => 06034333
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-07
[patent_title] => 'Frame embedded in a polymeric encapsulant'
[patent_app_type] => 1
[patent_app_number] => 8/975720
[patent_app_country] => US
[patent_app_date] => 1997-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 1910
[patent_no_of_claims] => 12
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[pdf_file] => patents/06/034/06034333.pdf
[firstpage_image] =>[orig_patent_app_number] => 975720
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/975720 | Frame embedded in a polymeric encapsulant | Nov 20, 1997 | Issued |
Array
(
[id] => 4135819
[patent_doc_number] => 06034324
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-07
[patent_title] => 'Modular high temperature superconducting down lead with safety lead'
[patent_app_type] => 1
[patent_app_number] => 8/968432
[patent_app_country] => US
[patent_app_date] => 1997-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/06/034/06034324.pdf
[firstpage_image] =>[orig_patent_app_number] => 968432
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/968432 | Modular high temperature superconducting down lead with safety lead | Nov 11, 1997 | Issued |
Array
(
[id] => 4253123
[patent_doc_number] => 06222136
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-24
[patent_title] => 'Printed circuit board with continuous connective bumps'
[patent_app_type] => 1
[patent_app_number] => 8/968988
[patent_app_country] => US
[patent_app_date] => 1997-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[pdf_file] => patents/06/222/06222136.pdf
[firstpage_image] =>[orig_patent_app_number] => 968988
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/968988 | Printed circuit board with continuous connective bumps | Nov 11, 1997 | Issued |
Array
(
[id] => 1568091
[patent_doc_number] => 06376781
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-23
[patent_title] => 'Low resistance contacts fabricated in high aspect ratio openings by resputtering'
[patent_app_type] => B1
[patent_app_number] => 08/960494
[patent_app_country] => US
[patent_app_date] => 1997-10-29
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[pdf_file] => patents/06/376/06376781.pdf
[firstpage_image] =>[orig_patent_app_number] => 08960494
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/960494 | Low resistance contacts fabricated in high aspect ratio openings by resputtering | Oct 28, 1997 | Issued |
Array
(
[id] => 4056233
[patent_doc_number] => 05932838
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-03
[patent_title] => 'Ionization cluster tree having tiers of spline ball ionizers'
[patent_app_type] => 1
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[firstpage_image] =>[orig_patent_app_number] => 959971
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/959971 | Ionization cluster tree having tiers of spline ball ionizers | Oct 28, 1997 | Issued |
Array
(
[id] => 3928177
[patent_doc_number] => 05945636
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Electrical insulators with mechanical core and dielectric sheath'
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[patent_app_country] => US
[patent_app_date] => 1997-10-27
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/960095 | Electrical insulators with mechanical core and dielectric sheath | Oct 26, 1997 | Issued |
Array
(
[id] => 4421411
[patent_doc_number] => 06194656
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-27
[patent_title] => 'Mounting structure for a relay arranged on a printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 8/953377
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[patent_app_date] => 1997-10-17
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[firstpage_image] =>[orig_patent_app_number] => 953377
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/953377 | Mounting structure for a relay arranged on a printed circuit board | Oct 16, 1997 | Issued |
Array
(
[id] => 3988620
[patent_doc_number] => 05959254
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-28
[patent_title] => 'Tapered support insulator for heating elements having curved surface grooves for retention of the heating elements'
[patent_app_type] => 1
[patent_app_number] => 8/950106
[patent_app_country] => US
[patent_app_date] => 1997-10-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 950106
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/950106 | Tapered support insulator for heating elements having curved surface grooves for retention of the heating elements | Oct 15, 1997 | Issued |
| 08/951556 | TRACE-PAD INTERFACE FOR IMPROVED SIGNAL QUALITY | Oct 15, 1997 | Abandoned |
Array
(
[id] => 4146670
[patent_doc_number] => 06031186
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Solid polymer insulators with eye and clevis ends'
[patent_app_type] => 1
[patent_app_number] => 8/947751
[patent_app_country] => US
[patent_app_date] => 1997-10-09
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[pdf_file] => patents/06/031/06031186.pdf
[firstpage_image] =>[orig_patent_app_number] => 947751
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/947751 | Solid polymer insulators with eye and clevis ends | Oct 8, 1997 | Issued |
Array
(
[id] => 3942826
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-26
[patent_title] => 'Composite insulator with insulating tapered rings providing a transition surface between endpieces and support inserted with the endpieces, a method of manufacturing such an insulator, and apparatus for implementing the method'
[patent_app_type] => 1
[patent_app_number] => 8/939413
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