
Kenneth J. Hansen
Examiner (ID: 561, Phone: (571)272-6780 , Office: P/3746 )
| Most Active Art Unit | 3746 |
| Art Unit(s) | 3722, 3209, 3206, 3746 |
| Total Applications | 920 |
| Issued Applications | 709 |
| Pending Applications | 73 |
| Abandoned Applications | 159 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1542727
[patent_doc_number] => 06372631
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-16
[patent_title] => 'Method of making a via filled dual damascene structure without middle stop layer'
[patent_app_type] => B1
[patent_app_number] => 09/778061
[patent_app_country] => US
[patent_app_date] => 2001-02-07
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/372/06372631.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/778061 | Method of making a via filled dual damascene structure without middle stop layer | Feb 6, 2001 | Issued |
Array
(
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[patent_doc_number] => 06429121
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[patent_kind] => B1
[patent_issue_date] => 2002-08-06
[patent_title] => 'Method of fabricating dual damascene with silicon carbide via mask/ARC'
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[patent_app_number] => 09/778102
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Array
(
[id] => 6876100
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[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-07-05
[patent_title] => 'Components with releasable leads and methods of making releasable leads'
[patent_app_type] => new-utility
[patent_app_number] => 09/777781
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Array
(
[id] => 1478101
[patent_doc_number] => 06451664
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[patent_kind] => B1
[patent_issue_date] => 2002-09-17
[patent_title] => 'Method of making a MIM capacitor with self-passivating plates'
[patent_app_type] => B1
[patent_app_number] => 09/774251
[patent_app_country] => US
[patent_app_date] => 2001-01-30
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Array
(
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[patent_issue_date] => 2002-05-14
[patent_title] => 'Method for selective removal of copper'
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Array
(
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[patent_title] => 'Article comprising a mechanically compliant bump'
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Array
(
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[patent_title] => 'Method to form bump in bumping technology'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/759911 | Method to form bump in bumping technology | Jan 15, 2001 | Issued |
Array
(
[id] => 1549841
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[patent_country] => US
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[patent_issue_date] => 2002-02-12
[patent_title] => 'Method of interlayer mediated epitaxy of cobalt silicide from low temperature chemical vapor deposition of cobalt'
[patent_app_type] => B1
[patent_app_number] => 09/757201
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/757201 | Method of interlayer mediated epitaxy of cobalt silicide from low temperature chemical vapor deposition of cobalt | Jan 8, 2001 | Issued |
Array
(
[id] => 6986891
[patent_doc_number] => 20010036723
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[patent_issue_date] => 2001-11-01
[patent_title] => 'Method of forming insulated metal interconnections in integrated circuits'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/742891 | Method of forming insulated metal interconnections in integrated circuits | Dec 19, 2000 | Issued |
Array
(
[id] => 1559839
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[patent_title] => 'Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry'
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[patent_app_number] => 09/741131
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Array
(
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[patent_title] => 'METHOD OF COPPER ELECTROPLATING'
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Array
(
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[patent_title] => 'Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials'
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Array
(
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Array
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Array
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Array
(
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[patent_title] => 'CMOS device structures and method of making same'
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Array
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Array
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Array
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Array
(
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