
Kevin M. Johnson
Examiner (ID: 13728)
| Most Active Art Unit | 1793 |
| Art Unit(s) | 1732, 1793 |
| Total Applications | 255 |
| Issued Applications | 85 |
| Pending Applications | 85 |
| Abandoned Applications | 85 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 16765571
[patent_doc_number] => 20210111153
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-04-15
[patent_title] => MULTI-CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 17/065527
[patent_app_country] => US
[patent_app_date] => 2020-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 18678
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -30
[patent_words_short_claim] => 152
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17065527
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/065527 | Multi-chip package and manufacturing method thereof | Oct 7, 2020 | Issued |
Array
(
[id] => 20390818
[patent_doc_number] => 12490568
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-02
[patent_title] => Method of forming a dielectric collar for semiconductor wires
[patent_app_type] => utility
[patent_app_number] => 17/767608
[patent_app_country] => US
[patent_app_date] => 2020-10-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 19
[patent_no_of_words] => 0
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 241
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17767608
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/767608 | Method of forming a dielectric collar for semiconductor wires | Sep 30, 2020 | Issued |
Array
(
[id] => 20361818
[patent_doc_number] => 12477837
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-11-18
[patent_title] => Semiconductor device and manufacturing method thereof
[patent_app_type] => utility
[patent_app_number] => 17/641569
[patent_app_country] => US
[patent_app_date] => 2020-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 42
[patent_figures_cnt] => 127
[patent_no_of_words] => 53690
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17641569
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/641569 | Semiconductor device and manufacturing method thereof | Sep 29, 2020 | Issued |
Array
(
[id] => 19260994
[patent_doc_number] => 12021060
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-25
[patent_title] => Reducing keep-out-zone area for a semiconductor device
[patent_app_type] => utility
[patent_app_number] => 17/028484
[patent_app_country] => US
[patent_app_date] => 2020-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 7
[patent_no_of_words] => 4136
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17028484
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/028484 | Reducing keep-out-zone area for a semiconductor device | Sep 21, 2020 | Issued |
Array
(
[id] => 18331800
[patent_doc_number] => 11637056
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-04-25
[patent_title] => 3D chip package based on through-silicon-via interconnection elevator
[patent_app_type] => utility
[patent_app_number] => 17/026186
[patent_app_country] => US
[patent_app_date] => 2020-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 91
[patent_figures_cnt] => 155
[patent_no_of_words] => 136874
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 538
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17026186
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/026186 | 3D chip package based on through-silicon-via interconnection elevator | Sep 18, 2020 | Issued |
Array
(
[id] => 16850637
[patent_doc_number] => 20210151382
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-05-20
[patent_title] => INTEGRATED SUBSTRATE STRUCTURE, REDISTRIBUTION STRUCTURE, AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 17/024676
[patent_app_country] => US
[patent_app_date] => 2020-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11343
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17024676
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/024676 | Integrated substrate structure, redistribution structure, and manufacturing method thereof | Sep 16, 2020 | Issued |
Array
(
[id] => 18277073
[patent_doc_number] => 11616021
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-03-28
[patent_title] => Semiconductor device including stack structure with flat region
[patent_app_type] => utility
[patent_app_number] => 17/021321
[patent_app_country] => US
[patent_app_date] => 2020-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 12755
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17021321
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/021321 | Semiconductor device including stack structure with flat region | Sep 14, 2020 | Issued |
Array
(
[id] => 18277073
[patent_doc_number] => 11616021
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-03-28
[patent_title] => Semiconductor device including stack structure with flat region
[patent_app_type] => utility
[patent_app_number] => 17/021321
[patent_app_country] => US
[patent_app_date] => 2020-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 12755
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17021321
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/021321 | Semiconductor device including stack structure with flat region | Sep 14, 2020 | Issued |
Array
(
[id] => 18277073
[patent_doc_number] => 11616021
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-03-28
[patent_title] => Semiconductor device including stack structure with flat region
[patent_app_type] => utility
[patent_app_number] => 17/021321
[patent_app_country] => US
[patent_app_date] => 2020-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 12755
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17021321
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/021321 | Semiconductor device including stack structure with flat region | Sep 14, 2020 | Issued |
Array
(
[id] => 18277073
[patent_doc_number] => 11616021
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-03-28
[patent_title] => Semiconductor device including stack structure with flat region
[patent_app_type] => utility
[patent_app_number] => 17/021321
[patent_app_country] => US
[patent_app_date] => 2020-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 12755
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17021321
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/021321 | Semiconductor device including stack structure with flat region | Sep 14, 2020 | Issued |
Array
(
[id] => 17347138
[patent_doc_number] => 20220013469
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-01-13
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/018608
[patent_app_country] => US
[patent_app_date] => 2020-09-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5027
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -9
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17018608
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/018608 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Sep 10, 2020 | Abandoned |
Array
(
[id] => 17373729
[patent_doc_number] => 20220028781
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-01-27
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/018560
[patent_app_country] => US
[patent_app_date] => 2020-09-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7240
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17018560
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/018560 | Multilevel interconnection structure and method for forming the same | Sep 10, 2020 | Issued |
Array
(
[id] => 17926042
[patent_doc_number] => 11469306
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-10-11
[patent_title] => Semiconductor device having a gate electrode in a trench
[patent_app_type] => utility
[patent_app_number] => 16/995044
[patent_app_country] => US
[patent_app_date] => 2020-08-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 7673
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 161
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16995044
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/995044 | Semiconductor device having a gate electrode in a trench | Aug 16, 2020 | Issued |
Array
(
[id] => 17871118
[patent_doc_number] => 20220293855
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-09-15
[patent_title] => STORAGE DEVICE AND STORAGE UNIT
[patent_app_type] => utility
[patent_app_number] => 17/641290
[patent_app_country] => US
[patent_app_date] => 2020-08-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11497
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17641290
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/641290 | STORAGE DEVICE AND STORAGE UNIT | Aug 12, 2020 | Abandoned |
Array
(
[id] => 19812427
[patent_doc_number] => 12243840
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-03-04
[patent_title] => Wirebondable interposer for flip chip packaged integrated circuit die
[patent_app_type] => utility
[patent_app_number] => 16/937922
[patent_app_country] => US
[patent_app_date] => 2020-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 18
[patent_no_of_words] => 12151
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16937922
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/937922 | Wirebondable interposer for flip chip packaged integrated circuit die | Jul 23, 2020 | Issued |
Array
(
[id] => 17795615
[patent_doc_number] => 20220254707
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-08-11
[patent_title] => WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE
[patent_app_type] => utility
[patent_app_number] => 17/629916
[patent_app_country] => US
[patent_app_date] => 2020-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12151
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17629916
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/629916 | WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE | Jul 23, 2020 | Abandoned |
Array
(
[id] => 18073700
[patent_doc_number] => 11532540
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-12-20
[patent_title] => Planarizing RDLS in RDL-first processes through CMP process
[patent_app_type] => utility
[patent_app_number] => 16/927020
[patent_app_country] => US
[patent_app_date] => 2020-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 25
[patent_no_of_words] => 7100
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 128
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16927020
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/927020 | Planarizing RDLS in RDL-first processes through CMP process | Jul 12, 2020 | Issued |
Array
(
[id] => 18447050
[patent_doc_number] => 11682626
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-06-20
[patent_title] => Chamfered die of semiconductor package and method for forming the same
[patent_app_type] => utility
[patent_app_number] => 16/926215
[patent_app_country] => US
[patent_app_date] => 2020-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 35
[patent_no_of_words] => 8354
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16926215
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/926215 | Chamfered die of semiconductor package and method for forming the same | Jul 9, 2020 | Issued |
Array
(
[id] => 17319201
[patent_doc_number] => 20210408251
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-30
[patent_title] => SEMICONDUCTOR DEVICE WITH T-SHAPED BURIED GATE ELECTRODE AND METHOD FOR FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 16/916696
[patent_app_country] => US
[patent_app_date] => 2020-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8024
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16916696
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/916696 | Semiconductor device with T-shaped buried gate electrode and method for forming the same | Jun 29, 2020 | Issued |
Array
(
[id] => 19428248
[patent_doc_number] => 12087682
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-10
[patent_title] => Power delivery structures
[patent_app_type] => utility
[patent_app_number] => 16/907797
[patent_app_country] => US
[patent_app_date] => 2020-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 14
[patent_no_of_words] => 8818
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16907797
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/907797 | Power delivery structures | Jun 21, 2020 | Issued |