Kevin Worrell

Array ( [id] => 10624482 [patent_doc_number] => 09343432 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-05-17 [patent_title] => 'Semiconductor chip stack having improved encapsulation' [patent_app_type] => utility [patent_app_number] => 14/094996 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 40 [patent_no_of_words] => 14269 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14094996 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9639466 [patent_doc_number] => 20140217576 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-07 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/095376 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 10321 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14095376 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11898453 [patent_doc_number] => 09768398 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-09-19 [patent_title] => 'Substrate for organic electronic device' [patent_app_type] => utility [patent_app_number] => 14/441143 [patent_app_country] => US [patent_app_date] => 2013-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 10208 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14441143 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9508200 [patent_doc_number] => 20140144690 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-29 [patent_title] => 'METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY' [patent_app_type] => utility [patent_app_number] => 14/090321 [patent_app_country] => US [patent_app_date] => 2013-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4145 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14090321 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9905952 [patent_doc_number] => 20150061152 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-05 [patent_title] => 'PACKAGE MODULE WITH OFFSET STACK DEVICE' [patent_app_type] => utility [patent_app_number] => 14/088915 [patent_app_country] => US [patent_app_date] => 2013-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 9951 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14088915 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10165350 [patent_doc_number] => 09196582 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-11-24 [patent_title] => 'Word line coupling prevention using 3D integrated circuit' [patent_app_type] => utility [patent_app_number] => 14/087016 [patent_app_country] => US [patent_app_date] => 2013-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5567 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14087016 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9855147 [patent_doc_number] => 20150035165 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-02-05 [patent_title] => 'INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 14/086995 [patent_app_country] => US [patent_app_date] => 2013-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4458 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14086995 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9508857 [patent_doc_number] => 20140145348 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-29 [patent_title] => 'RF (RADIO FREQUENCY) MODULE AND METHOD OF MAUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/087827 [patent_app_country] => US [patent_app_date] => 2013-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2869 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14087827 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10537759 [patent_doc_number] => 09263394 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-16 [patent_title] => 'Multiple bond via arrays of different wire heights on a same substrate' [patent_app_type] => utility [patent_app_number] => 14/087252 [patent_app_country] => US [patent_app_date] => 2013-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 49 [patent_no_of_words] => 10060 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14087252 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10252358 [patent_doc_number] => 20150137354 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-05-21 [patent_title] => 'PILLAR BUMP FORMED USING SPOT-LASER' [patent_app_type] => utility [patent_app_number] => 14/086932 [patent_app_country] => US [patent_app_date] => 2013-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3321 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14086932 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10138488 [patent_doc_number] => 09171810 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-10-27 [patent_title] => 'Electronic device incorporating a randomized interconnection layer having a randomized conduction pattern' [patent_app_type] => utility [patent_app_number] => 14/086601 [patent_app_country] => US [patent_app_date] => 2013-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4087 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14086601 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9367519 [patent_doc_number] => 20140077392 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-20 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/085124 [patent_app_country] => US [patent_app_date] => 2013-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 39 [patent_figures_cnt] => 39 [patent_no_of_words] => 16286 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14085124 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10217487 [patent_doc_number] => 20150102481 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-16 [patent_title] => 'SINTERED BACKSIDE SHIM IN A PRESS PACK CASSETTE' [patent_app_type] => utility [patent_app_number] => 14/054754 [patent_app_country] => US [patent_app_date] => 2013-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 9017 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14054754 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9965423 [patent_doc_number] => 09013040 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-04-21 [patent_title] => 'Memory device with die stacking and heat dissipation' [patent_app_type] => utility [patent_app_number] => 14/045226 [patent_app_country] => US [patent_app_date] => 2013-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 18 [patent_no_of_words] => 2855 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14045226 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9951789 [patent_doc_number] => 09000583 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-04-07 [patent_title] => 'Multiple die in a face down package' [patent_app_type] => utility [patent_app_number] => 14/040948 [patent_app_country] => US [patent_app_date] => 2013-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 7168 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14040948 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9984279 [patent_doc_number] => 09029995 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-05-12 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 14/037489 [patent_app_country] => US [patent_app_date] => 2013-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 39 [patent_no_of_words] => 19955 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 312 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14037489 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10597315 [patent_doc_number] => 09318410 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Cooling assembly using heatspreader' [patent_app_type] => utility [patent_app_number] => 14/037706 [patent_app_country] => US [patent_app_date] => 2013-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1804 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14037706 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10125324 [patent_doc_number] => 09159690 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-10-13 [patent_title] => 'Tall solders for through-mold interconnect' [patent_app_type] => utility [patent_app_number] => 14/036755 [patent_app_country] => US [patent_app_date] => 2013-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 41 [patent_no_of_words] => 6214 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 292 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14036755 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10525557 [patent_doc_number] => 09252077 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-02 [patent_title] => 'Package vias for radio frequency antenna connections' [patent_app_type] => utility [patent_app_number] => 14/037213 [patent_app_country] => US [patent_app_date] => 2013-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 6448 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14037213 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10577000 [patent_doc_number] => 09299650 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2016-03-29 [patent_title] => 'Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 14/037274 [patent_app_country] => US [patent_app_date] => 2013-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 22 [patent_no_of_words] => 9790 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14037274 [rel_patent_id] =>[rel_patent_doc_number] =>)